Download or read book Advances in Electronic Circuit Packaging written by Gerald A. Walker and published by Springer. This book was released on 2013-12-11 with total page 342 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Advances in Electronic Circuit Packaging written by Lawrence L. Rosine and published by Springer. This book was released on 2013-12-01 with total page 303 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Advances in electronic circuit packaging 1 written by and published by . This book was released on 1960 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Advances in Electronic Circuit Packaging written by Lawrence L. Rosine and published by Springer. This book was released on 2013-12-11 with total page 463 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Advanced Electronic Packaging written by Richard K. Ulrich and published by John Wiley & Sons. This book was released on 2006-02-24 with total page 852 pages. Available in PDF, EPUB and Kindle. Book excerpt: As in the First Edition, each chapter in this new Second Edition is authored by one or more acknowledged experts and then carefully edited to ensure a consistent level of quality and approach throughout. There are new chapters on passive devices, RF and microwave packaging, electronic package assembly, and cost evaluation and assembly, while organic and ceramic substrates are now covered in separate chapters. All the hallmarks of the First Edition, which became an industry standard and a popular graduate-level textbook, have been retained. An Instructor's Manual presenting detailed solutions to all the problems in the book is available upon request from the Wiley Makerting Department.
Download or read book Advances in Electronic Circuit Packaging written by Gerald A. Walker and published by . This book was released on 1965 with total page 312 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Advances in Electronic Circuit Packaging written by and published by . This book was released on 1963 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Power Electronic Packaging written by Yong Liu and published by Springer Science & Business Media. This book was released on 2012-02-15 with total page 606 pages. Available in PDF, EPUB and Kindle. Book excerpt: Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions.
Download or read book Advances in Electronic Circuit Packaging written by Gerald A. Walker and published by . This book was released on 1962 with total page 381 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Electronic Packaging of High Speed Circuitry written by Stephen G. Konsowski and published by McGraw Hill Professional. This book was released on 1997 with total page 488 pages. Available in PDF, EPUB and Kindle. Book excerpt: A comprehensive guide to the packaging of high speed circuits for today's advanced electronic products. This is a unique and expert guide to the design and packaging of the high-frequency circuitry crucial to the performance of today's advanced electronic products, such as Pentium chips, HDTV, and mobile communications. Written by two of the leading innovators in the field, this book fully explains integrated design approaches that will enable you to take advantage of all the latest advances in electronic devices, circuit design, materials, and circuit packaging. You'll read about approaches that include basic signal transmission theory, digital circuit design, and how these are integrated with the packaging and interconnection characteristics. There is detailed coverage of signal behavior in both high speed digital circuits, as well as crucial aspects of materials selection and manufacturing. This state-of-the-art resource also provides you with practical design guidelines--plus information on the major issues of design verification and perfomance evaluation.
Download or read book Electronic Equipment Packaging Technology written by Gerald L. Ginsberg and published by Springer Science & Business Media. This book was released on 2013-11-27 with total page 285 pages. Available in PDF, EPUB and Kindle. Book excerpt: The last twenty years have seen major advances in the electronics industry. Perhaps the most significant aspect of these advances has been the significant role that electronic equipment plays in almost all product markets. Even though electronic equipment is used in a broad base of applications, many future applications have yet to be conceived. This versatility of electron ics has been brought about primarily by the significant advances that have been made in integrated circuit technology. The electronic product user is rarely aware of the integrated circuits within the equipment. However, the user is often very aware of the size, weight, mod ularity, maintainability, aesthetics, and human interface features of the product. In fact, these are aspects of the products that often are instrumental in deter mining its success or failure in the marketplace. Optimizing these and other product features is the primary role of Electronic Equipment Packaging Technology. As the electronics industry continues to pro vide products that operate faster than their predecessors in a smaller space with a reduced cost per function, the role of electronic packaging technology will assume an even greater role in the development of cost-effective products.
Download or read book Advances in electronic circuit packaging 2 written by and published by . This book was released on 1961 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Advances in Electronic Circuit Packaging written by Gerald A. Walker and published by . This book was released on 1960 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Advances in Electronic Circuit Packaging written by Lawrence L. Rosine and published by . This book was released on 1965 with total page 297 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Advanced Electronic Circuits written by U. Tietze and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 519 pages. Available in PDF, EPUB and Kindle. Book excerpt: In the earlier stages of integrated circuit design, analog circuits consisted simply of type 741 operational amplifiers, and digital circuits of 7400-type gates. Today's designers must choose from a much larger and rapidly increasing variety of special integrated circuits marketed by a dynamic and creative industry. Only by a proper selection from this wide range can an economical and competitive solution be found to a given problem. For each individual case the designer must decide which parts of a circuit are best implemented by analog circuitry, which by conventional digital circuitry and which sections could be microprocessor controlled. In order to facilitate this decision for the designer who is not familiar with all these subjects, we have arranged the book so as to group the different circuits according to their field of application. Each chapter is thus written to stand on its own, with a minimum of cross-references. To enable the reader to proceed quickly from an idea to a working circuit, we discuss, for a large variety of problems, typical solutions, the applicability of which has been proved by thorough experimental investigation. Our thanks are here due to Prof. Dr. D. Seitzer for the provision of excellent laboratory facilities. The subject is extensive and the material presented has had to be limited. For this reason, we have omitted elementary circuit design, so that the book addresses the advanced student who has some back ground in electronics, and the practising engineer and scientist.
Download or read book Advances in Electronic Circuit Packaging written by Michael A. Marrese and published by . This book was released on 1964 with total page 502 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Power Electronic Packaging written by Yong Liu and published by Springer Science & Business Media. This book was released on 2012-02-15 with total page 606 pages. Available in PDF, EPUB and Kindle. Book excerpt: Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions.
