Download or read book Interface Engineering of Capacitive Micromachined Ultrasonic Transducers for Medical Applications written by Der-Song Lin and published by Stanford University. This book was released on 2011 with total page 168 pages. Available in PDF, EPUB and Kindle. Book excerpt: Capacitive micromachined ultrasonic transducers (CMUTs), have been widely studied in academia and industry over the last decade. CMUTs provide many benefits over traditional piezoelectric transducers including improvement in performance through wide bandwidth, and ease of electronics integration, with the potential to batch fabricate very large 2D arrays with low-cost and high-yield. Though many aspects of CMUT technology have been studied over the years, packaging the CMUT into a fully practical system has not been thoroughly explored. Two important interfaces of packaging that this thesis explores are device encapsulation (the interface between CMUTs and patients) and full electronic integration of large scale 2D arrays (the interface between CMUTs and electronics). In the first part of the work, I investigate the requirements for the CMUT encapsulation. For medical usage, encapsulation is needed to electrically insulate the device, mechanically protect the device, and maintain transducer performance, especially the access of the ultrasound energy. While hermetic sealing can protect many other MEMS devices, CMUTs require mechanical interaction to a fluid, which makes fulfilling the previous criterion very challenging. The proposed solution is to use a viscoelastic material with the glass-transition-temperature lower than room temperature, such as Polydimethylsiloxane (PDMS), to preserve the CMUT static and dynamic performance. Experimental implementation of the encapsulated imaging CMUT arrays shows the device performance was maintained; 95 % of efficiency, 85% of the maximum output pressure, and 91% of the fractional bandwidth (FBW) can be preserved. A viscoelastic finite element model was also developed and shows the performance effects of the coating can be accurately predicted. Four designs, providing acoustic crosstalk suppression, flexible substrate, lens focusing, and blood flow monitoring using PDMS layer were also demonstrated. The second part of the work, presents contributions towards the electronic integration and packaging of large-area 2-D arrays. A very large 2D array is appealing for it can enable advanced novel imaging applications, such as a reconfigurable array, and a compression plate for breast cancer screening. With these goals in mind, I developed the first large-scale fully populated and integrated 2D CMUTs array with 32 by 192 elements. In this study, I demonstrate a flexible and reliable integration approach by successfully combining a simple UBM preparation technique and a CMUTs-interposer-ASICs sandwich design. The results show high shear strength of the UBM (26.5 g), 100% yield of the interconnections, and excellent CMUT resonance uniformity ([lowercase Sigma] = 0.02 MHz). As demonstrated, this allows for a large-scale assembly of a tile-able array by using an interposer. Interface engineering is crucial towards the development of CMUTs into a practical ultrasound system. With the advances in encapsulation technique with a viscoelastic polymer and the combination of the UBM technique to the TSV fabrication for electronics integration, a fully integrated CMUT system can be realized.

Download or read book Advances in Manufacturing Technology XXXII written by P. Thorvald and published by IOS Press. This book was released on 2018-08-29 with total page 558 pages. Available in PDF, EPUB and Kindle. Book excerpt: The urgent need to keep pace with the accelerating globalization of manufacturing in the 21st century has produced rapid advancements in technology, research and innovation. This book presents the proceedings of the 16th International Conference on Manufacturing Research incorporating the 33nd National Conference on Manufacturing Research (ICMR 2018), held in Skövde, Sweden, in September 2018. The aim of the conference is to create a friendly and inclusive environment, bringing together researchers, academics and industrialists with practical and theoretical knowledge to share and discuss emerging trends and new challenges. The book is divided into 12 parts, covering areas such as the manufacturing process; robots; product design and development; smart manufacturing; and lean, among others. Covering both cutting-edge research and recent industrial applications, the book will appeal to all those with an interest in recent advances in manufacturing technology.

Download or read book Piezoelectric and Acoustic Materials for Transducer Applications written by Ahmad Safari and published by Springer Science & Business Media. This book was released on 2008-09-11 with total page 483 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book discusses the underlying physical principles of piezoelectric materials, important properties of ferroelectric/piezoelectric materials used in today’s transducer technology, and the principles used in transducer design. It provides examples of a wide range of applications of such materials along with the appertaining rationales. With contributions from distinguished researchers, this is a comprehensive reference on all the pertinent aspects of piezoelectric materials.

Download or read book MEMS Technology for Biomedical Imaging Applications written by Qifa Zhou and published by MDPI. This book was released on 2019-10-23 with total page 218 pages. Available in PDF, EPUB and Kindle. Book excerpt: Biomedical imaging is the key technique and process to create informative images of the human body or other organic structures for clinical purposes or medical science. Micro-electro-mechanical systems (MEMS) technology has demonstrated enormous potential in biomedical imaging applications due to its outstanding advantages of, for instance, miniaturization, high speed, higher resolution, and convenience of batch fabrication. There are many advancements and breakthroughs developing in the academic community, and there are a few challenges raised accordingly upon the designs, structures, fabrication, integration, and applications of MEMS for all kinds of biomedical imaging. This Special Issue aims to collate and showcase research papers, short commutations, perspectives, and insightful review articles from esteemed colleagues that demonstrate: (1) original works on the topic of MEMS components or devices based on various kinds of mechanisms for biomedical imaging; and (2) new developments and potentials of applying MEMS technology of any kind in biomedical imaging. The objective of this special session is to provide insightful information regarding the technological advancements for the researchers in the community.

Download or read book 2021 44th International Spring Seminar on Electronics Technology ISSE written by IEEE Staff and published by . This book was released on 2021-05-05 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: The ISSE conference series is a renowned European forum for exchanging knowledge between senior and young scientists from academic communities and electronic industries from around the world on topics related to their experimental and theoretical work in the very wide spread field of electronics and micro nanoelectronics technology and in particular electronics packaging technology The motto of the upcoming conference event is Advancements in Microelectronics Packaging for Harsh Environment In the frame of a unique combination of poster exhibitions, oral paper presentations, and individual meetings senior and junior researchers from all over the world come together to discuss scientific problems and their teaching experiences as well as plan and organize international research co operations and student exchanges in a convenient and multicultural atmosphere

Download or read book Ultrasound in Food Processing written by Mar Villamiel and published by John Wiley & Sons. This book was released on 2017-04-25 with total page 764 pages. Available in PDF, EPUB and Kindle. Book excerpt: Part I: Fundamentals of ultrasound This part will cover the main basic principles of ultrasound generation and propagation and those phenomena related to low and high intensity ultrasound applications. The mechanisms involved in food analysis and process monitoring and in food process intensification will be shown. Part II: Low intensity ultrasound applications Low intensity ultrasound applications have been used for non-destructive food analysis as well as for process monitoring. Ultrasonic techniques, based on velocity, attenuation or frequency spectrum analysis, may be considered as rapid, simple, portable and suitable for on-line measurements. Although industrial applications of low-intensity ultrasound, such as meat carcass evaluation, have been used in the food industry for decades, this section will cover the most novel applications, which could be considered as highly relevant for future application in the food industry. Chapters addressing this issue will be divided into three subsections: (1) food control, (2) process monitoring, (3) new trends. Part III: High intensity ultrasound applications High intensity ultrasound application constitutes a way to intensify many food processes. However, the efficient generation and application of ultrasound is essential to achieving a successful effect. This part of the book will begin with a chapter dealing with the importance of the design of efficient ultrasonic application systems. The medium is essential to achieve efficient transmission, and for that reason the particular challenges of applying ultrasound in different media will be addressed. The next part of this section constitutes an up-to-date vision of the use of high intensity ultrasound in food processes. The chapters will be divided into four sections, according to the medium in which the ultrasound vibration is transmitted from the transducers to the product being treated. Thus, solid, liquid, supercritical and gas media have been used for ultrasound propagation. Previous books addressing ultrasonic applications in food processing have been based on the process itself, so chapters have been divided in mass and heat transport, microbial inactivation, etc. This new book will propose a revolutionary overview of ultrasonic applications based on (in the authors’ opinion) the most relevant factor affecting the efficiency of ultrasound applications: the medium in which ultrasound is propagated. Depending on the medium, ultrasonic phenomena can be completely different, but it also affects the complexity of the ultrasonic generation, propagation and application. In addition, the effect of high intensity ultrasound on major components of food, such as proteins, carbohydrates and lipids will be also covered, since this type of information has not been deeply studied in previous books. Other aspects related to the challenges of food industry to incorporate ultrasound devices will be also considered. This point is also very important since, in the last few years, researchers have made huge efforts to integrate fully automated and efficient ultrasound systems to the food production lines but, in some cases, it was not satisfactory. In this sense, it is necessary to identify and review the main related problems to efficiently produce and transmit ultrasound, scale-up, reduce cost, save energy and guarantee the production of safe, healthy and high added value foods.

Download or read book Advances in Glass Science and Technology written by Vincenzo Maria Sglavo and published by BoD – Books on Demand. This book was released on 2018-06-06 with total page 242 pages. Available in PDF, EPUB and Kindle. Book excerpt: In this book, some recent advances in glass science and technology are collected. In the first part, the structure and crystallization of innovative glass compositions are analysed. In the second part, innovative applications are described from the use of glass in optical devices and lasers to fibres in composites, micropatterned components in sensors and microdevices, beads in building walls and sealing in solid oxide fuel cells.

Download or read book Proceedings of the International Conference on Advanced Mechanical Engineering Automation and Sustainable Development 2021 AMAS2021 written by Banh Tien Long and published by Springer Nature. This book was released on 2022-05-03 with total page 982 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents selected, peer-reviewed proceedings of the International Conference on Advanced Mechanical Engineering, Automation and Sustainable Development 2021 (AMAS2021), held in the city of Ha Long, Vietnam, from November 4 to 7, 2021. AMAS2021 is a special meeting of the International Conference on Material, Machines and Methods for Sustainable Development (MMMS), with a strong focus on automation and fostering an overall approach to assist policy makers, industries, and researchers at various levels to position local technological development toward sustainable development. The contributions published in this book stem from a wide spectrum of research, ranging from micro- and nanomaterial design and processing, to special applications in mechanical technology, environmental protection, green development, and climate change mitigation. A large group of contributions selected for these proceedings also focus on modeling and manufacturing of ecomaterials.

Download or read book Future Trends in Microelectronics written by Serge Luryi and published by John Wiley & Sons. This book was released on 2016-09-12 with total page 409 pages. Available in PDF, EPUB and Kindle. Book excerpt: Presents the developments in microelectronic-related fields, with comprehensive insight from a number of leading industry professionals The book presents the future developments and innovations in the developing field of microelectronics. The book’s chapters contain contributions from various authors, all of whom are leading industry professionals affiliated either with top universities, major semiconductor companies, or government laboratories, discussing the evolution of their profession. A wide range of microelectronic-related fields are examined, including solid-state electronics, material science, optoelectronics, bioelectronics, and renewable energies. The topics covered range from fundamental physical principles, materials and device technologies, and major new market opportunities. Describes the expansion of the field into hot topics such as energy (photovoltaics) and medicine (bio-nanotechnology) Provides contributions from leading industry professionals in semiconductor micro- and nano-electronics Discusses the importance of micro- and nano-electronics in today’s rapidly changing and expanding information society Future Trends in Microelectronics: Journey into the Unknown is written for industry professionals and graduate students in engineering, physics, and nanotechnology.

Download or read book Advanced Research on Information Science Automation and Material System III written by Helen Zhang and published by Trans Tech Publications Ltd. This book was released on 2013-06-13 with total page 354 pages. Available in PDF, EPUB and Kindle. Book excerpt: Selected, peer reviewed papers from the 2013 3rd International Conference on Information Science, Automation and Material System (ISAM 2013), April 13-14, 2013, Guangzhou, China

Download or read book Mems Nems written by Cornelius T. Leondes and published by Springer Science & Business Media. This book was released on 2007-10-08 with total page 2142 pages. Available in PDF, EPUB and Kindle. Book excerpt: This significant and uniquely comprehensive five-volume reference is a valuable source for research workers, practitioners, computer scientists, students, and technologists. It covers all of the major topics within the subject and offers a comprehensive treatment of MEMS design, fabrication techniques, and manufacturing methods. It also includes current medical applications of MEMS technology and provides applications of MEMS to opto-electronic devices. It is clearly written, self-contained, and accessible, with helpful standard features including an introduction, summary, extensive figures and design examples with comprehensive reference lists.

Download or read book Proceedings of ICDMC 2019 written by Lung-Jieh Yang and published by Springer Nature. This book was released on 2020-06-01 with total page 641 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book comprises select proceedings of the International Conference on Design, Materials, Cryogenics and Constructions (ICDMC 2019). The chapters cover latest research in different areas of mechanical engineering such as additive manufacturing, automation in industry and agriculture, combustion and emission control, CFD, finite element analysis, and engineering design. The book also focuses on cryogenic systems and low-temperature materials for cost-effective and energy-efficient solutions to current challenges in the manufacturing sector. Given its contents, the book can be useful for students, academics, and practitioners.

Download or read book Mems Packaging written by Yung-cheng Lee and published by World Scientific. This book was released on 2018-01-03 with total page 363 pages. Available in PDF, EPUB and Kindle. Book excerpt: MEMS sensors and actuators are enabling components for smartphones, AR/VR, and wearable electronics. MEMS packaging is recognized as one of the most critical activities to design and manufacture reliable MEMS. A unique challenge to MEMS packaging is how to protect moving MEMS devices during manufacturing and operation. With the introduction of wafer level capping and encapsulation processes, this barrier is removed successfully. In addition, MEMS devices should be integrated with their electronic chips with the smallest footprint possible. As a result, 3D packaging is applied to connect the devices vertically for the most effective integration. Such 3D packaging also paves the way for further heterogenous integration of MEMS devices, electronics, and other functional devices.This book consists of chapters written by leaders developing products in a MEMS industrial setting and faculty members conducting research in an academic setting. After an introduction chapter, the practical issues are covered: through-silicon vias (TSVs), vertical interconnects, wafer level packaging, motion sensor-to-CMOS bonding, and use of printed circuit board technology to fabricate MEMS. These chapters are written by leaders developing MEMS products. Then, fundamental issues are discussed, topics including encapsulation of MEMS, heterogenous integration, microfluidics, solder bonding, localized sealing, microsprings, and reliability.

Download or read book Computational Science and Engineering written by Arpan Deyasi and published by CRC Press. This book was released on 2016-12-19 with total page 696 pages. Available in PDF, EPUB and Kindle. Book excerpt: Computational Science and Engineering contains peer-reviewed research presented at the International Conference on Computational Science and Engineering (RCC Institute of Information Technology, Kolkata, India, 4-6 October 2016). The contributions cover a wide range of topics: - electronic devices - photonics - electromagnetics - soft computing - artificial intelligence - modern communication systems Focussing on strong theoretical and methodological approaches and applications, Computational Science and Engineering will be of interest to academia and professionals involved or interested in the above mentioned domains.

Download or read book Photoacoustic Imaging and Spectroscopy written by Lihong V. Wang and published by CRC Press. This book was released on 2017-12-19 with total page 1027 pages. Available in PDF, EPUB and Kindle. Book excerpt: Photoacoustics promises to revolutionize medical imaging and may well make as dramatic a contribution to modern medicine as the discovery of the x-ray itself once did. Combining electromagnetic and ultrasonic waves synergistically, photoacoustics can provide deep speckle-free imaging with high electromagnetic contrast at high ultrasonic resolution and without any health risk. While photoacoustic imaging is probably the fastest growing biomedical imaging technology, this book is the first comprehensive volume in this emerging field covering both the physics and the remarkable noninvasive applications that are changing diagnostic medicine. Bringing together the leading pioneers in this field to write about their own work, Photoacoustic Imaging and Spectroscopy is the first to provide a full account of the latest research and developing applications in the area of biomedical photoacoustics. Photoacoustics can provide functional sensing of physiological parameters such as the oxygen saturation of hemoglobin. It can also provide high-contrast functional imaging of angiogenesis and hypermetabolism in tumors in vivo. Discussing these remarkable noninvasive applications and so much more, this reference is essential reading for all researchers in medical imaging and those clinicians working at the cutting-edge of modern biotechnology to develop diagnostic techniques that can save many lives and just as importantly do no harm.

Download or read book Advanced Nondestructive Evaluation I written by Seung Seok Lee and published by Trans Tech Publications Ltd. This book was released on 2006-10-15 with total page 1812 pages. Available in PDF, EPUB and Kindle. Book excerpt: Proceedings of the 1st International Conference on Advanced Nondestructive Evaluation, Jeju Island, Korea, 7-9 November 2005

Download or read book Estimation of Blood Velocities Using Ultrasound written by Jørgen Arendt Jensen and published by Cambridge University Press. This book was released on 1996-03-29 with total page 344 pages. Available in PDF, EPUB and Kindle. Book excerpt: A clear, extensively illustrated treatment of ultrasound systems used in estimating blood velocities.