Download or read book Advanced Test Methods for SRAMs written by Alberto Bosio and published by Springer Science & Business Media. This book was released on 2009-10-08 with total page 179 pages. Available in PDF, EPUB and Kindle. Book excerpt: Modern electronics depend on nanoscaled technologies that present new challenges in terms of testing and diagnostics. Memories are particularly prone to defects since they exploit the technology limits to get the highest density. This book is an invaluable guide to the testing and diagnostics of the latest generation of SRAM, one of the most widely applied types of memory. Classical methods for testing memory are designed to handle the so-called "static faults," but these test solutions are not sufficient for faults that are emerging in the latest Very Deep Sub-Micron (VDSM) technologies. These new fault models, referred to as "dynamic faults", are not covered by classical test solutions and require the dedicated test sequences presented in this book.

Download or read book ISTFA 2017 Proceedings from the 43rd International Symposium for Testing and Failure Analysis written by and published by ASM International. This book was released on 2017-12-01 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: The theme for the November 2017 conference was Striving for 100% Success Rate. Papers focus on the tools and techniques needed for maximizing the success rate in every aspect of the electronic device failure analysis process.

Download or read book Silicon Systems For Wireless Lan written by Zoran Stamenkovic and published by World Scientific. This book was released on 2020-11-27 with total page 430 pages. Available in PDF, EPUB and Kindle. Book excerpt: Today's integrated silicon circuits and systems for wireless communications are of a huge complexity.This unique compendium covers all the steps (from the system-level to the transistor-level) necessary to design, model, verify, implement, and test a silicon system. It bridges the gap between the system-world and the transistor-world (between communication, system, circuit, device, and test engineers).It is extremely important nowadays (and will be more important in the future) for communication, system, and circuit engineers to understand the physical implications of system and circuit solutions based on hardware/software co-design as well as for device and test engineers to cope with the system and circuit requirements in terms of power, speed, and data throughput.Related Link(s)

Download or read book Advances in Smart Grid Technology written by Pierluigi Siano and published by Springer Nature. This book was released on 2020-09-22 with total page 531 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book comprises the select proceedings of the International Conference on Power Engineering Computing and Control (PECCON) 2019. This volume focuses on the different renewable energy sources which are integrated in a smart grid and their operation both in the grid connected mode and islanded mode. The contents highlight the role of power converters in the smart grid environment, battery management, electric vehicular technology and electric charging station as a load for the power network. This book can be useful for beginners, researchers as well as professionals interested in the area of smart grid technology.

Download or read book Industrial Engineering and Applications written by L.-C. Tang and published by IOS Press. This book was released on 2023-08-09 with total page 880 pages. Available in PDF, EPUB and Kindle. Book excerpt: The field of industrial engineering (IE) has a very wide scope, from production processes and automation to supply chain management, but the scope of IE techniques has expanded beyond the traditional domains of application, and is now relevant to areas that matter most to society at large. This book presents the proceedings of ICIEA 2023, the 10th International Conference on Industrial Engineering and Applications, held in Phuket, Thailand, from 4 to 6 April 2023. The conference was conducted in hybrid mode, with close to 100 delegates attending in person and about 50 participants attending online. A total of 272 submissions were received for the conference, of which 120 were accepted for presentation with 83 of those published here as full papers. These papers cover a wide range of topics within the scope of industrial and systems engineering, including but not limited to: supply chain and logistics; quality and reliability; advanced manufacturing; and production scheduling to ergonomics and man-machine systems interfaces. In particular, a significant number of papers are devoted to machine learning techniques and applications beyond the traditional manufacturing sector, to include healthcare, sustainability assessment, and other social issues. Offering an overview of recent research and novel applications, the book will be of interest to all those whose work involves the application of industrial engineering techniques.

Download or read book Testing Static Random Access Memories written by Said Hamdioui and published by Springer Science & Business Media. This book was released on 2013-06-29 with total page 231 pages. Available in PDF, EPUB and Kindle. Book excerpt: Testing Static Random Access Memories covers testing of one of the important semiconductor memories types; it addresses testing of static random access memories (SRAMs), both single-port and multi-port. It contributes to the technical acknowledge needed by those involved in memory testing, engineers and researchers. The book begins with outlining the most popular SRAMs architectures. Then, the description of realistic fault models, based on defect injection and SPICE simulation, are introduced. Thereafter, high quality and low cost test patterns, as well as test strategies for single-port, two-port and any p-port SRAMs are presented, together with some preliminary test results showing the importance of the new tests in reducing DPM level. The impact of the port restrictions (e.g., read-only ports) on the fault models, tests, and test strategies is also discussed. Features: -Fault primitive based analysis of memory faults, -A complete framework of and classification memory faults, -A systematic way to develop optimal and high quality memory test algorithms, -A systematic way to develop test patterns for any multi-port SRAM, -Challenges and trends in embedded memory testing.

Download or read book Rad hard Semiconductor Memories written by Cristiano Calligaro and published by CRC Press. This book was released on 2022-09-01 with total page 417 pages. Available in PDF, EPUB and Kindle. Book excerpt: Rad-hard Semiconductor Memories is intended for researchers and professionals interested in understanding how to design and make a preliminary evaluation of rad-hard semiconductor memories, making leverage on standard CMOS manufacturing processes available from different silicon foundries and using different technology nodes.In the first part of the book, a preliminary overview of the effects of radiation in space, with a specific focus on memories, will be conducted to enable the reader to understand why specific design solutions are adopted to mitigate hard and soft errors. The second part will be devoted to RHBD (Radiation Hardening by Design) techniques for semiconductor components with a specific focus on memories. The approach will follow a top-down scheme starting from RHBD at architectural level (how to build a rad-hard floor-plan), at circuit level (how to mitigate radiation effects by handling transistors in the proper way) and at layout level (how to shape a layout to mitigate radiation effects).After the description of the mitigation techniques, the book enters in the core of the topic covering SRAMs (synchronous, asynchronous, single port and dual port) and PROMs (based on AntiFuse OTP technologies), describing how to design a rad-hard flash memory and fostering RHBD toward emerging memories like ReRAM. The last part will be a leap into emerging memories at a very early stage, not yet ready for industrial use in silicon but candidates to become an option for the next wave of rad-hard components. Technical topics discussed in the book include:  Radiation effects on semiconductor components (TID, SEE) Radiation Hardening by Design (RHBD) Techniques Rad-hard SRAMs Rad-hard PROMs Rad-hard Flash NVMs Rad-hard ReRAMs Rad-hard emerging technologies

Download or read book Advanced Informatics for Computing Research written by Ashish Kumar Luhach and published by Springer Nature. This book was released on 2019-09-16 with total page 409 pages. Available in PDF, EPUB and Kindle. Book excerpt: ​This two-volume set (CCIS 1075 and CCIS 1076) constitutes the refereed proceedings of the Third International Conference on Advanced Informatics for Computing Research, ICAICR 2019, held in Shimla, India, in June 2019. The 78 revised full papers presented were carefully reviewed and selected from 382 submissions. The papers are organized in topical sections on computing methodologies; hardware; information systems; networks; software and its engineering.

Download or read book Design and Test Technology for Dependable Systems on chip written by Raimund Ubar and published by IGI Global. This book was released on 2011-01-01 with total page 550 pages. Available in PDF, EPUB and Kindle. Book excerpt: "This book covers aspects of system design and efficient modelling, and also introduces various fault models and fault mechanisms associated with digital circuits integrated into System on Chip (SoC), Multi-Processor System-on Chip (MPSoC) or Network on Chip (NoC)"--

Download or read book VLSI SoC Opportunities and Challenges Beyond the Internet of Things written by Michail Maniatakos and published by Springer. This book was released on 2019-05-16 with total page 257 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book contains extended and revised versions of the best papers presented at the 25th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2017, held in Abu Dhabi, United Arab Emirates, in August 2017. The 11 papers included in this book were carefully reviewed and selected from the 33 full papers presented at the conference. The papers cover a wide range of topics in VLSI technology and advanced research. They address the latest scientific and industrial results and developments as well as future trends in the field of System-on-Chip (SoC) Design. On the occasion of the silver jubilee of the VLSI-SoC conference series the book also includes a special chapter that presents the history of the VLSI-SoC series of conferences and its relation with VLSI-SoC evolution since the early 80s up to the present.

Download or read book Multi run Memory Tests for Pattern Sensitive Faults written by Ireneusz Mrozek and published by Springer. This book was released on 2018-07-06 with total page 135 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book describes efficient techniques for production testing as well as for periodic maintenance testing (specifically in terms of multi-cell faults) in modern semiconductor memory. The author discusses background selection and address reordering algorithms in multi-run transparent march testing processes. Formal methods for multi-run test generation and many solutions to increase their efficiency are described in detail. All methods presented ideas are verified by both analytical investigations and numerical simulations. Provides the first book related exclusively to the problem of multi-cell fault detection by multi-run tests in memory testing process; Presents practical algorithms for design and implementation of efficient multi-run tests; Demonstrates methods verified by analytical and experimental investigations.

Download or read book CMOS SRAM Circuit Design and Parametric Test in Nano Scaled Technologies written by Andrei Pavlov and published by Springer Science & Business Media. This book was released on 2008-06-01 with total page 203 pages. Available in PDF, EPUB and Kindle. Book excerpt: The monograph will be dedicated to SRAM (memory) design and test issues in nano-scaled technologies by adapting the cell design and chip design considerations to the growing process variations with associated test issues. Purpose: provide process-aware solutions for SRAM design and test challenges.

Download or read book Variation Aware Advanced CMOS Devices and SRAM written by Changhwan Shin and published by Springer. This book was released on 2016-06-06 with total page 140 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides a comprehensive overview of contemporary issues in complementary metal-oxide semiconductor (CMOS) device design, describing how to overcome process-induced random variations such as line-edge-roughness, random-dopant-fluctuation, and work-function variation, and the applications of novel CMOS devices to cache memory (or Static Random Access Memory, SRAM). The author places emphasis on the physical understanding of process-induced random variation as well as the introduction of novel CMOS device structures and their application to SRAM. The book outlines the technical predicament facing state-of-the-art CMOS technology development, due to the effect of ever-increasing process-induced random/intrinsic variation in transistor performance at the sub-30-nm technology nodes. Therefore, the physical understanding of process-induced random/intrinsic variations and the technical solutions to address these issues plays a key role in new CMOS technology development. This book aims to provide the reader with a deep understanding of the major random variation sources, and the characterization of each random variation source. Furthermore, the book presents various CMOS device designs to surmount the random variation in future CMOS technology, emphasizing the applications to SRAM.

Download or read book Microelectronics Failure Analysis written by and published by ASM International. This book was released on 2004-01-01 with total page 813 pages. Available in PDF, EPUB and Kindle. Book excerpt: For newcomers cast into the waters to sink or swim as well as seasoned professionals who want authoritative guidance desk-side, this hefty volume updates the previous (1999) edition. It contains the work of expert contributors who rallied to the job in response to a committee's call for help (the committee was assigned to the update by the Electron

Download or read book Aeronautics and Space Report of the President written by United States. President and published by . This book was released on 1990 with total page 602 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Aeronautics and Space Report of the President Activities written by United States. President and published by . This book was released on 1990 with total page 198 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Direct Copper Interconnection for Advanced Semiconductor Technology written by Dongkai Shangguan and published by CRC Press. This book was released on 2024-06-28 with total page 549 pages. Available in PDF, EPUB and Kindle. Book excerpt: In the “More than Moore” era, performance requirements for leading edge semiconductor devices are demanding extremely fine pitch interconnection in semiconductor packaging. Direct copper interconnection has emerged as the technology of choice in the semiconductor industry for fine pitch interconnection, with significant benefits for interconnect density and device performance. Low-temperature direct copper bonding, in particular, will become widely adopted for a broad range of highperformance semiconductor devices in the years to come. This book offers a comprehensive review and in-depth discussions of the key topics in this critical new technology. Chapter 1 reviews the evolution and the most recent advances in semiconductor packaging, leading to the requirement for extremely fine pitch interconnection, and Chapter 2 reviews different technologies for direct copper interconnection, with advantages and disadvantages for various applications. Chapter 3 offers an in-depth review of the hybrid bonding technology, outlining the critical processes and solutions. The area of materials for hybrid bonding is covered in Chapter 4, followed by several chapters that are focused on critical process steps and equipment for copper electrodeposition (Chapter 5), planarization (Chapter 6), wafer bonding (Chapter 7), and die bonding (Chapter 8). Aspects related to product applications are covered in Chapter 9 for design and Chapter 10 for thermal simulation. Finally, Chapter 11 covers reliability considerations and computer modeling for process and performance characterization, followed by the final chapter (Chapter 12) outlining the current and future applications of the hybrid bonding technology. Metrology and testing are also addressed throughout the chapters. Business, economic, and supply chain considerations are discussed as related to the product applications and manufacturing deployment of the technology, and the current status and future outlook as related to the various aspects of the ecosystem are outlined in the relevant chapters of the book. The book is aimed at academic and industry researchers as well as industry practitioners, and is intended to serve as a comprehensive source of the most up-to-date knowledge, and a review of the state-of-the art of the technology and applications, for direct copper interconnection and advanced semiconductor packaging in general.