Download or read book Advanced Production Testing of RF SoC and SiP Devices written by Joe Kelly and published by Artech House Publishers. This book was released on 2007 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: Featuring invaluable input from industry-leading companies and highly-regarded experts in the field, this first-of-its kind resource offers experienced engineers a comprehensive understanding of the advanced topics in RF, SiP (system-in-package), and SoC (system-on-a-chip) production testing that are critical to their work involving semiconductor devices. The book covers key measurement concepts for semiconductor device testing and assists engineers in explaining these concepts to management to aid in the reduction of project cost, time, and resources. Based on real-world experience and packed with time-saving equations, this in-depth volume offers professionals practical information on essential topics that have never been presented in a single reference before.
Download or read book Production Testing of RF and System on a chip Devices for Wireless Communications written by Keith B. Schaub and published by Artech House. This book was released on 2004 with total page 276 pages. Available in PDF, EPUB and Kindle. Book excerpt: Technological advances have created a need for the merger and rethinking of past testing approaches for wireless equipment. This first-of-its-kind resource offers professionals an in-depth overview of cutting-edge RF (radio frequency) and SOC (system on a chip) product testing for wireless communications.
Download or read book An Engineer s Guide to Automated Testing of High Speed Interfaces Second Edition written by Jose Moreira and published by Artech House. This book was released on 2016-04-30 with total page 709 pages. Available in PDF, EPUB and Kindle. Book excerpt: This second edition of An Engineer's Guide to Automated Testing of High-Speed Interfaces provides updates to reflect current state-of-the-art high-speed digital testing with automated test equipment technology (ATE). Featuring clear examples, this one-stop reference covers all critical aspects of automated testing, including an introduction to high-speed digital basics, a discussion of industry standards, ATE and bench instrumentation for digital applications, and test and measurement techniques for characterization and production environment. Engineers learn how to apply automated test equipment for testing high-speed digital I/O interfaces and gain a better understanding of PCI-Express 4, 100Gb Ethernet, and MIPI while exploring the correlation between phase noise and jitter. This updated resource provides expanded material on 28/32 Gbps NRZ testing and wireless testing that are becoming increasingly more pertinent for future applications. This book explores the current trend of merging high-speed digital testing within the fields of photonic and wireless testing.
Download or read book Critical mm Wave Components for Synthetic Automatic Test Systems written by Michael Hrobak and published by Springer. This book was released on 2015-04-29 with total page 449 pages. Available in PDF, EPUB and Kindle. Book excerpt: Michael Hrobak studied hybrid integrated front end modules for high frequency measurement equipment and especially for synthetic automatic test systems. Recent developments of innovative, critical millimeter-wave components like frequency multipliers, directional couplers, filters, triple balanced mixers and power detectors are illustrated by the author separately and in combination.
Download or read book VLSI Circuits for Biomedical Applications written by Krzysztof Iniewski and published by Artech House. This book was released on 2008 with total page 453 pages. Available in PDF, EPUB and Kindle. Book excerpt: Supported with over 280 illustrations and over 160 equations, the book offers cutting-edge guidance on designing integrated circuits for wireless biosensing, body implants, biosensing interfaces, and molecular biology. You discover innovative design techniques and novel materials to help you achieve higher levels circuit and system performance.
Download or read book Microwave Journal written by and published by . This book was released on 2007 with total page 1400 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Advanced Packaging written by and published by . This book was released on 2008-08 with total page 56 pages. Available in PDF, EPUB and Kindle. Book excerpt: Advanced Packaging serves the semiconductor packaging, assembly and test industry. Strategically focused on emerging and leading-edge methods for manufacturing and use of advanced packages.
Download or read book Introduction to Advanced System on Chip Test Design and Optimization written by Erik Larsson and published by Springer Science & Business Media. This book was released on 2005-11-07 with total page 418 pages. Available in PDF, EPUB and Kindle. Book excerpt: Testing of Integrated Circuits is important to ensure the production of fault-free chips. However, testing is becoming cumbersome and expensive due to the increasing complexity of these ICs. Technology development has made it possible to produce chips where a complete system, with an enormous transistor count, operating at a high clock frequency, is placed on a single die - SOC (System-on-Chip). The device size miniaturization leads to new fault types, the increasing clock frequencies enforces testing for timing faults, and the increasing transistor count results in a higher number of possible fault sites. Testing must handle all these new challenges in an efficient manner having a global system perspective. Test design is applied to make a system testable. In a modular core-based environment where blocks of reusable logic, the so called cores, are integrated to a system, test design for each core include: test method selection, test data (stimuli and responses) generation (ATPG), definition of test data storage and partitioning [off-chip as ATE (Automatic Test Equipment) and/or on-chip as BIST (Built-In Self-Test)], wrapper selection and design (IEEE std 1500), TAM (test access mechanism) design, and test scheduling minimizing a cost function whilst considering limitations and constraint. A system test design perspective that takes all the issues above into account is required in order to develop a globally optimized solution. SOC test design and its optimization is the topic of this book. It gives an introduction to testing, describes the problems related to SOC testing, discusses the modeling granularity and the implementation into EDA (electronic design automation) tools. The book is divided into three sections: i) test concepts, ii) SOC design for test, and iii) SOC test applications. The first part covers an introduction into test problems including faults, fault types, design-flow, design-for-test techniques such as scan-testing and Boundary Scan. The second part of the book discusses SOC related problems such as system modeling, test conflicts, power consumption, test access mechanism design, test scheduling and defect-oriented scheduling. Finally, the third part focuses on SOC applications, such as integrated test scheduling and TAM design, defect-oriented scheduling, and integrating test design with the core selection process.
Download or read book Efficient Production Testing of High performance RF Modules and Systems Using Low cost ATE written by Ganesh Parasuram Srinivasan and published by . This book was released on 2006 with total page 247 pages. Available in PDF, EPUB and Kindle. Book excerpt: All the above mentioned components contribute to enabling efficient production testing of high-performance RF modules and systems using low-cost, low-speed ATE. The contribution of each of these components in developing the efficient testing framework is highlighted in Figure 1.
Download or read book Advanced Packaging written by and published by . This book was released on 2008-05 with total page 32 pages. Available in PDF, EPUB and Kindle. Book excerpt: Advanced Packaging serves the semiconductor packaging, assembly and test industry. Strategically focused on emerging and leading-edge methods for manufacturing and use of advanced packages.
Download or read book System on chip Test Architectures written by Laung-Terng Wang and published by Morgan Kaufmann. This book was released on 2008 with total page 856 pages. Available in PDF, EPUB and Kindle. Book excerpt: Written by a stellar team of field experts, this title is a comprehensive guide to new VLSI Testing and Design-for-Testability techniques that allow VSLI designers, DFT practitioners, and students to master quickly System-on-Chip Test architectures, memory, and analog/mixed-signal designs.
Download or read book RF Bulk Acoustic Wave Filters for Communications written by Ken-ya Hashimoto and published by Artech House. This book was released on 2009 with total page 293 pages. Available in PDF, EPUB and Kindle. Book excerpt: This timely book presents a thorough overview of RF BAW filters, covering a vast range of technologies, optimal device design, filter topologies, packaging, fabrication processes, and high quality piezoelectric thin films. Moreover, the book discusses the integration of BAW filters in RF systems.
Download or read book Semiconductor Manufacturing Handbook 2E PB written by Hwaiyu Geng and published by McGraw Hill Professional. This book was released on 2017-10-06 with total page 560 pages. Available in PDF, EPUB and Kindle. Book excerpt: Thoroughly Revised, State-of-the-Art Semiconductor Design, Manufacturing, and Operations Information Written by 70 international experts and reviewed by a seasoned technical advisory board, this fully updated resource clearly explains the cutting-edge processes used in the design and fabrication of IC chips, MEMS, sensors, and other electronic devices. Semiconductor Manufacturing Handbook, Second Edition, covers the emerging technologies that enable the Internet of Things, the Industrial Internet of Things, data analytics, artificial intelligence, augmented reality, and and smart manufacturing. You will get complete details on semiconductor fundamentals, front- and back-end processes, nanotechnology, photovoltaics, gases and chemicals, fab yield, and operations and facilities. •Nanotechnology and microsystems manufacturing •FinFET and nanoscale silicide formation •Physical design for high-performance, low-power 3D circuits •Epitaxi, anneals, RTP, and oxidation •Microlithography, etching, and ion implantations •Physical, chemical, electrochemical, and atomic layer vapor deposition •Chemical mechanical planarization •Atomic force metrology •Packaging, bonding, and interconnects •Flexible hybrid electronics •Flat-panel,flexible display electronics, and photovoltaics •Gas distribution systems •Ultrapure water and filtration •Process chemicals handling and abatement •Chemical and slurry handling systems •Yield management, CIM, and factory automation •Manufacturing execution systems •Advanced process control •Airborne molecular contamination •ESD controls in clean-room environments •Vacuum systems and RF plasma systems •IC manufacturing parts cleaning technology •Vibration and noise design •And much more
Download or read book The British National Bibliography written by Arthur James Wells and published by . This book was released on 2007 with total page 870 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Advanced Electronic Packaging Volume 968 written by Vasudeva P. Atluri and published by . This book was released on 2007-04-09 with total page 226 pages. Available in PDF, EPUB and Kindle. Book excerpt: Microelectronic packaging architecture evolutions are being driven by silicon technology advancements and new form factors, used models and emerging technologies. High-performance mobile computer and communication systems will require higher I/O counts, greater density, lower cost, lighter weight and improved performance in the electronic package. The book focuses on silicon technology dimension scaling and performance improvement, Pb-free or 'green' assembly, and system-in-package (SIP) technologies. It explores the key thermomechanical failure modes and mitigating solutions associated with integration of silicon with weak interlayer dielectrics during the assembly process, under bump metallurgy integrity with lead-free assembly, and the impact of stress on die-cracking and transistor performance in 3D thin-die stacking. The interaction of these failures with silicon and assembly materials, processes and design features is covered and includes: system in package; advanced packaging/nanotechnology in packaging; physical behavior and mechanical behavior in packaging; electromigration and thermal behavior in packaging and thin films and adhesives in packaging.
Download or read book Micro and Nanotechnology Enabled Applications for Portable Miniaturized Analytical Systems written by Sabu Thomas and published by Elsevier. This book was released on 2021-10-12 with total page 440 pages. Available in PDF, EPUB and Kindle. Book excerpt: Micro- and Nanotechnology Enabled Applications for Portable Miniaturized Analytical Systems outlines the basic principles of miniaturized analytical devices, such as spectrometric, separation, imaging and electrochemical miniaturized instruments. Concepts such as smartphone-enabled miniaturized detection systems and micro/nanomachines are also reviewed. Subsequent chapters explore the emerging application of these mobile devices for miniaturized analysis in various fields, including medicine and biomedicine, environmental chemistry, food chemistry, and forensic chemistry. This is an important reference source for materials scientists and engineers wanting to understand how miniaturization techniques are being used to create a range of efficient, sustainable electronic and optical devices. Miniaturization describes the concept of manufacturing increasingly smaller mechanical, optical, and electronic products and devices. These smaller instruments can be used to produce micro- and nanoscale components required for analytical procedures. A variety of micro/nanoscale materials have been synthesized and used in analytical procedures, such as sensing materials, sorbents, adsorbents, catalysts, and reactors. The miniaturization of analytical instruments can be applied to the different steps of analytical procedures, such as sample preparation, analytical separation, and detection, reducing the total cost of manufacturing the instruments and the needed reagents and organic solvents. - Outlines how miniaturization techniques can be used to create new optical and electronic micro- and nanodevices - Explores major application areas, including biomedicine, environmental science and security - Assesses the major challenges of using miniaturization techniques
Download or read book Heterogeneous Integration of Materials for Passive Components and Smart Systems Volume 969 written by Juan C. Nino and published by . This book was released on 2007-05-30 with total page 184 pages. Available in PDF, EPUB and Kindle. Book excerpt: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. This book, first published in 2007, discusses advances, the current status, and future challenges in the broad area of materials integration for passive components and smart systems.
