Download or read book Advanced Metallization for Future ULSI Volume 427 written by Materials Research Society. Meeting and published by . This book was released on 1996-11-08 with total page 624 pages. Available in PDF, EPUB and Kindle. Book excerpt: The feature sizes of microelectronic devices have entered the deep submicron regime. The process integration and structure-properties control of the multilevel metal circuitry demand an interdisciplinary interaction and understanding between manufacturing and research. To realize the vision presented in the national technology road map, material and technological challenges will need to be overcome. For example Cu conductor and its barrier metals and low-dielectric constant insulators are at issue. For materials processing, chemical-mechanical planarization and low-temperature filling of high-aspect ratio vias are challenges. For materials examination, the metrology of submicron structures is nontrivial and for materials reliability, the interplay among multiple driving forces and the response in small-dimension microstructures are intriguing. These issues are the focus of this book from MRS. Topics include: road map, technology and metrology of submicron device structures; reliability issues for Cu metallization; Al interconnects and vias; barrier metal; interlevel low-K dielectrics and contact to Si and compound semiconductors.
Download or read book CVD XV written by Mark Donald Allendorf and published by The Electrochemical Society. This book was released on 2000 with total page 826 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Advanced Catalytic Materials written by and published by . This book was released on 1997 with total page 334 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Electromigration in Metals written by Paul S. Ho and published by Cambridge University Press. This book was released on 2022-05-12 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: Learn to assess electromigration reliability and design more resilient chips in this comprehensive and practical resource. Beginning with fundamental physics and building to advanced methodologies, this book enables the reader to develop highly reliable on-chip wiring stacks and power grids. Through a detailed review on the role of microstructure, interfaces and processing on electromigration reliability, as well as characterisation, testing and analysis, the book follows the development of on-chip interconnects from microscale to nanoscale. Practical modeling methodologies for statistical analysis, from simple 1D approximation to complex 3D description, can be used for step-by-step development of reliable on-chip wiring stacks and industrial-grade power/ground grids. This is an ideal resource for materials scientists and reliability and chip design engineers.
Download or read book Liquid Crystals for Advanced Technologies Volume 425 written by Timothy J. Bunning and published by . This book was released on 1996-11-20 with total page 368 pages. Available in PDF, EPUB and Kindle. Book excerpt: Liquid crystals have emerged as a class of organic materials with potential applications to optics, photonics and optoelectronics. Although a large number of liquid crystals have been discovered or synthesized, fundamental understanding of structure-property relationships at the molecular level is still lacking. Regardless, liquid-crystalline materials have found use in many areas of technology and their scope has been extended with the development of liquid-crystalline polymers, elastomers and composite systems. In addition, emerging advanced technologies, such as flat-panel displays, optical computing and communications, and imaging will call for improved materials as well as novel multifunctional materials. This book presents recent advances in both the fundamental science and application-specific research of LC technology. New synthetic approaches are featured, as are developments in novel glass forming, low-molecular-weight liquid crystals and their utility in both display and optical applications. Topics include: PDLC composites; display and optical applications of LC-based compounds; modelling; rheology; chiral smectics and thermosets.
Download or read book Ferroelectric Thin Films written by and published by . This book was released on 1996 with total page 486 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Amorphous Silicon Technology written by and published by . This book was released on 1996 with total page 946 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Rapid Thermal and Integrated Processing written by and published by . This book was released on 1996 with total page 416 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Flat Panel Display Materials written by and published by . This book was released on 1996 with total page 544 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Advances in Microcrystalline and Nanocrystalline Volume 452 written by Robert W. Collins and published by . This book was released on 1997-03-13 with total page 1098 pages. Available in PDF, EPUB and Kindle. Book excerpt: Proceedings of the December 1996 symposium. Contains 159 papers which describe materials advances involving stuctures spanning more than five orders of magnitude in size--from Group IV molecular clusters to single-crystal grains large enough for fabrication of thin-film transistors within their boundaries. Sections cover topics such as the theory of semiconductor molecular clusters and nanocrystals; luminescent Group IV clusters/nanocrystals and quantum wells; semiconductor systems confined in three and one dimensions; Group III- V, Group II-VI, and metal sulfide, iodide, and oxide nanocrystals; porous silicon; applications of nanocrystal and porous semiconductors; light-emitting properties and applications of porous Si; and research results on the nano-, micro-, and polycrystalline thin films. Annotation copyrighted by Book News, Inc., Portland, OR
Download or read book Ceramic Integration and Joining Technologies written by Mrityunjay Singh and published by John Wiley & Sons. This book was released on 2011-09-26 with total page 830 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book joins and integrates ceramics and ceramic-based materials in various sectors of technology. A major imperative is to extract scientific information on joining and integration response of real, as well as model, material systems currently in a developmental stage. This book envisions integration in its broadest sense as a fundamental enabling technology at multiple length scales that span the macro, millimeter, micrometer and nanometer ranges. Consequently, the book addresses integration issues in such diverse areas as space power and propulsion, thermoelectric power generation, solar energy, micro-electro-mechanical systems (MEMS), solid oxide fuel cells (SOFC), multi-chip modules, prosthetic devices, and implanted biosensors and stimulators. The engineering challenge of designing and manufacturing complex structural, functional, and smart components and devices for the above applications from smaller, geometrically simpler units requires innovative development of new integration technology and skillful adaptation of existing technology.
Download or read book High Temperature Ordered Intermetallic Alloys VII Volume 460 written by C. C. Koch and published by . This book was released on 1997-07-30 with total page 818 pages. Available in PDF, EPUB and Kindle. Book excerpt: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. This book focuses specifically on processing and microstructural control, alloy design, mechanical properties and industrial applications. Examples of structural applications of the 'mature' intermetallics, TiAl and Ni3Al are also featured.
Download or read book Subject Guide to Books in Print written by and published by . This book was released on 1996 with total page 2476 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Applications of Accelerators in Research and Industry Proceedings of the Fifteenth International Conference written by Jerome L. Duggan and published by American Institute of Physics. This book was released on 1999-06-18 with total page 662 pages. Available in PDF, EPUB and Kindle. Book excerpt: The papers in this proceedings volume describe the research and applications of low energy accelerators. The research is primarily in the field of nuclear and atomic physics. The applications are: ion implantation and all of the ion beam diagnostic techniques that are currently in use with small accelerators.
Download or read book Materials Reliability in Microelectronics VI Volume 428 written by William F. Filter and published by . This book was released on 1996-11-18 with total page 616 pages. Available in PDF, EPUB and Kindle. Book excerpt: MRS books on materials reliability in microelectronics have become the snapshot of progress in this field. Reduced feature size, increased speed, and larger area are all factors contributing to the continual performance and functionality improvements in integrated circuit technology. These same factors place demands on the reliability of the individual components that make up the IC. Achieving increased reliability requires an improved understanding of both thin-film and patterned-feature materials properties and their degradation mechanisms, how materials and processes used to fabricate ICs interact, and how they may be tailored to enable reliability improvements. This book focuses on the physics and materials science of microelectronics reliability problems rather than the traditional statistical, accelerated electrical testing aspects. Studies are grouped into three large sections covering electromigration, gate oxide reliability and mechanical stress behavior. Topics include: historical summary; reliability issues for Cu metallization; characterization of electromigration phenomena; modelling; microstructural evolution and influences; oxide and device reliability; thin oxynitride dielectrics; noncontact diagnostics; stress effects in thin films and interconnects and microbeam X-ray techniques for stress measurements.
Download or read book Boundaries and Interfaces in Materials written by R. C. Pond and published by Minerals, Metals, & Materials Society. This book was released on 1998 with total page 392 pages. Available in PDF, EPUB and Kindle. Book excerpt: The symposium from Materials Week '97 dedicated to the memory of Lehigh University Professor David A. Smith covers all aspects of internal and external interfaces of materials, from atomistic calculations and experimental observations of structure to the role of interfaces in determining properties and their inclusion in materials engineering. This book provides researchers, teachers, and students with a review of current materials interface understanding.
Download or read book Rapid Thermal and Integrated Processing V Volume 429 written by J. C. Gelpey and published by . This book was released on 1996-10-14 with total page 416 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is the latest in a continuing series on rapid thermal processing and related topics. It embraces a diversity of research, development and manufacturing activities that require rapid thermal and integrated processing techniques which are recognized by their acronyms, such as rapid thermal annealing (RTA), rapid thermal processing (RTP), rapid thermal chemical vapor deposition (RTCVP), rapid thermal oxidation (RTO), and others. This fifth anniversary volume reports notable advances in the use of rapid thermal techniques in processing science and technology, and for process control in industrial fabrication facilities. It is organized around progress obtained through: evaluation methodology; equipment and process modelling; temperature control; defects and diffusion associated with annealing; metallizations such as silicidation; novel processing of sol-gel and magnetic films; dielectric growth and deposition; and silicon or silicon-germanium film deposition.
