Download or read book Advanced Materials Conference AMC 2012 written by Rosdi Ibrahim and published by Trans Tech Publications Ltd. This book was released on 2014-01-16 with total page 272 pages. Available in PDF, EPUB and Kindle. Book excerpt: Selected, peer reviewed papers from the Advanced Materials Conference (AMC 2012), December 12-13th, 2012, Langkawi, Malaysia

Download or read book Advanced Materials Conference AMC 2012 written by and published by . This book was released on 2014 with total page 280 pages. Available in PDF, EPUB and Kindle. Book excerpt: AMC 2012 is held with the aim of being a platform for reviewing the latest research and technology in the area of Advanced Materials. It also to bring together researchers, scientists, engineers and scholar students to exchange and share their experiences, new ideas and results in all aspects of Advanced Material Research and discuss the practical challenges encountered and the solutions adopted. Latest advances and innovation in the area of advanced material will be discussed. A total of more than 100 scientific papers in various field of Advanced Materials have been received and accepted for presentation in this conference. Temporary description, more details to follow.

Download or read book Advanced Interconnects for ULSI Technology written by Mikhail Baklanov and published by John Wiley & Sons. This book was released on 2012-04-02 with total page 616 pages. Available in PDF, EPUB and Kindle. Book excerpt: Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects, and discusses: Interconnect functions, characterisations, electrical properties and wiring requirements Low-k materials: fundamentals, advances and mechanical properties Conductive layers and barriers Integration and reliability including mechanical reliability, electromigration and electrical breakdown New approaches including 3D, optical, wireless interchip, and carbon-based interconnects Intended for postgraduate students and researchers, in academia and industry, this book provides a critical overview of the enabling technology at the heart of the future development of computer chips.

Download or read book Proceedings of the 8th Pacific Rim International Conference on Advanced Materials and Processing PRICM 8 written by FernD.S. Marquis and published by Springer. This book was released on 2017-03-21 with total page 3431 pages. Available in PDF, EPUB and Kindle. Book excerpt: PRICM-8 features the most prominent and largest-scale interactions in advanced materials and processing in the Pacific Rim region. The conference is unique in its intrinsic nature and architecture which crosses many traditional discipline and cultural boundaries. This is a comprehensive collection of papers from the 15 symposia presented at this event.

Download or read book Proceedings of the 7th International Conference and Exhibition on Sustainable Energy and Advanced Materials ICE SEAM 2021 Melaka Malaysia written by Mohd Fadzli Bin Abdollah and published by Springer Nature. This book was released on 2022-06-30 with total page 481 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book gathers the proceedings of the 7th International Conference and Exhibition on Sustainable Energy and Advanced Materials (ICE-SEAM), held on November 2021, a virtual conference organized in Melaka, Malaysia. It focuses on two relatively broad areas—advanced materials and sustainable energy—and a diverse range of subtopics: Advanced materials and related technologies: liquid crystals, semiconductors, superconductors, optics, lasers, sensors, mesoporous materials, nanomaterials, smart ferrous materials, amorphous materials, crystalline materials, biomaterials, metamaterials, composites, polymers, design, analysis, development, manufacturing, processing and testing for advanced materials. Sustainable energy and related technologies: energy management, storage, conservation, industrial energy efficiency, energy-efficient buildings, energy-efficient traffic systems, energy distribution, energy modeling, hybrid and integrated energy systems, fossil energy, nuclear energy, bioenergy, biogas, biomass geothermal power, non-fossil energies, wind energy, hydropower, solar photovoltaic, fuel cells, electrification, and electrical power systems and controls.

Download or read book Sustainable Issues in Transportation Engineering written by Louay Mohammad and published by Springer Nature. This book was released on 2019-11-01 with total page 150 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book of the GeoMEast 2019 proceedings includes a collection of research and practical papers from an international research and technology activities on recent developments in pavement design, modeling and performance, and effects on infrastructure, green energy, technology, and integration. Sustainability is increasingly a key priority in engineering practices. With the aging transportation infrastructure and renewed emphasis on infrastructure renovation by transportation agencies, innovations are urgently needed to develop materials, designs, and practices to ensure the sustainability of transportation infrastructure.

Download or read book Ruthenium written by Yao-Feng Chang and published by BoD – Books on Demand. This book was released on 2023-12-20 with total page 150 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Handbook of Thin Film Deposition written by Dominic Schepis and published by Elsevier. This book was released on 2024-10-08 with total page 428 pages. Available in PDF, EPUB and Kindle. Book excerpt: Handbook of Thin Film Deposition, Fifth Edition, is a comprehensive reference focusing on thin film technologies and applications used in the semiconductor industry. When pursuing patents, there is a phase called 'reduction to practice' where the idea for a technology transitions from a concept to actual use. The section 'Thin Film Reduction to Practice' includes chapters that review the most relevant methods to fabricate thin films towards practical applications. Then, the latest applications of thin film deposition technologies are discussed. Handbook of Thin Film Deposition, 5th Edition is suitable for materials scientists and engineers in academia and working in semiconductor R&D. - Offers a practical survey of thin film technologies including design, fabrication, and reliability - Covers core processes and applications in the semiconductor industry and discusses latest advances in new thin film development - Features new chapters that review methods on front-end and back-end thin films

Download or read book Chemistry in Microelectronics written by Yannick Le Tiec and published by John Wiley & Sons. This book was released on 2013-02-28 with total page 261 pages. Available in PDF, EPUB and Kindle. Book excerpt: Microelectronics is a complex world where many sciences need to collaborate to create nano-objects: we need expertise in electronics, microelectronics, physics, optics and mechanics also crossing into chemistry, electrochemistry, as well as biology, biochemistry and medicine. Chemistry is involved in many fields from materials, chemicals, gases, liquids or salts, the basics of reactions and equilibrium, to the optimized cleaning of surfaces and selective etching of specific layers. In addition, over recent decades, the size of the transistors has been drastically reduced while the functionality of circuits has increased. This book consists of five chapters covering the chemicals and sequences used in processing, from cleaning to etching, the role and impact of their purity, along with the materials used in “Front End Of the Line” which corresponds to the heart and performance of individual transistors, then moving on to the “Back End Of the Line” which is related to the interconnection of all the transistors. Finally, the need for specific functionalization also requires key knowledge on surface treatments and chemical management to allow new applications. Contents 1. Chemistry in the “Front End of the Line” (FEOL): Deposits, Gate Stacks, Epitaxy and Contacts, François Martin, Jean-Michel Hartmann, Véronique Carron and Yannick Le Tiec. 2. Chemistry in Interconnects, Vincent Jousseaume, Paul-Henri Haumesser, Carole Pernel, Jeffery Butterbaugh, Sylvain Maîtrejean and Didier Louis. 3. The Chemistry of Wet Surface Preparation: Cleaning, Etching and Drying, Yannick Le Tiec and Martin Knotter. 4. The Use and Management of Chemical Fluids in Microelectronics, Christiane Gottschalk, Kevin Mclaughlin, Julie Cren, Catherine Peyne and Patrick Valenti. 5. Surface Functionalization for Micro- and Nanosystems: Application to Biosensors, Antoine Hoang, Gilles Marchand, Guillaume Nonglaton, Isabelle Texier-Nogues and Francoise Vinet. About the Authors Yannick Le Tiec is a technical expert at CEA-Leti, Minatec since 2002. He is a CEA-Leti assignee at IBM, Albany (NY) to develop the advanced 14 nm CMOS node and the FDSOI technology. He held different technical positions from the advanced 300 mm SOI CMOS pilot line to different assignments within SOITEC for advanced wafer development and later within INES to optimize solar cell ramp-up and yield. He has been part of the ITRS Front End technical working group at ITRS since 2008.

Download or read book Advances in Chemical Mechanical Planarization CMP written by Babu Suryadevara and published by Woodhead Publishing. This book was released on 2021-09-10 with total page 650 pages. Available in PDF, EPUB and Kindle. Book excerpt: Advances in Chemical Mechanical Planarization (CMP), Second Edition provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The second edition includes the recent advances of CMP and its emerging materials, methods, and applications, including coverage of post-CMP cleaning challenges and tribology of CMP. This important book offers a systematic review of fundamentals and advances in the area. Part one covers CMP of dielectric and metal films, with chapters focusing on the use of current and emerging techniques and processes and on CMP of various materials, including ultra low-k materials and high-mobility channel materials, and ending with a chapter reviewing the environmental impacts of CMP processes. New content addressed includes CMP challenges with tungsten, cobalt, and ruthenium as interconnect and barrier films, consumables for ultralow topography and CMP for memory devices. Part two addresses consumables and process control for improved CMP and includes chapters on CMP pads, diamond disc pad conditioning, the use of FTIR spectroscopy for characterization of surface processes and approaches for defection characterization, mitigation, and reduction. Advances in Chemical Mechanical Planarization (CMP), Second Edition is an invaluable resource and key reference for materials scientists and engineers in academia and R&D. - Reviews the most relevant techniques and processes for CMP of dielectric and metal films - Includes chapters devoted to CMP for current and emerging materials - Addresses consumables and process control for improved CMP, including post-CMP

Download or read book 13th International Conference on Aluminum Alloys ICAA 13 written by Hasso Weiland and published by Springer. This book was released on 2017-02-28 with total page 1857 pages. Available in PDF, EPUB and Kindle. Book excerpt: This is a collection of papers presented at the 13th International Conference on Aluminum Alloys (ICAA-13), the premier global conference for exchanging emerging knowledge on the structure and properties of aluminum materials. The papers are organized around the topics of the science of aluminum alloy design for a range of market applications; the accurate prediction of material properties; novel aluminum products and processes; and emerging developments in recycling and applications using both monolithic and multi-material solutions.

Download or read book Additive Manufacturing of Metals written by John O. Milewski and published by Springer. This book was released on 2017-06-28 with total page 351 pages. Available in PDF, EPUB and Kindle. Book excerpt: This engaging volume presents the exciting new technology of additive manufacturing (AM) of metal objects for a broad audience of academic and industry researchers, manufacturing professionals, undergraduate and graduate students, hobbyists, and artists. Innovative applications ranging from rocket nozzles to custom jewelry to medical implants illustrate a new world of freedom in design and fabrication, creating objects otherwise not possible by conventional means. The author describes the various methods and advanced metals used to create high value components, enabling readers to choose which process is best for them. Of particular interest is how harnessing the power of lasers, electron beams, and electric arcs, as directed by advanced computer models, robots, and 3D printing systems, can create otherwise unattainable objects. A timeline depicting the evolution of metalworking, accelerated by the computer and information age, ties AM metal technology to the rapid evolution of global technology trends. Charts, diagrams, and illustrations complement the text to describe the diverse set of technologies brought together in the AM processing of metal. Extensive listing of terms, definitions, and acronyms provides the reader with a quick reference guide to the language of AM metal processing. The book directs the reader to a wealth of internet sites providing further reading and resources, such as vendors and service providers, to jump start those interested in taking the first steps to establishing AM metal capability on whatever scale. The appendix provides hands-on example exercises for those ready to engage in experiential self-directed learning.

Download or read book New Trends in Civil Aviation written by Vladimir Socha and published by CRC Press. This book was released on 2018-06-27 with total page 598 pages. Available in PDF, EPUB and Kindle. Book excerpt: The NTCA conference series is dedicated to publishing peer-reviewed proceedings of the conference. The goal is to disseminate state-of the- art scientific results available in the domain of civil aviation. These proceedings contain a collection of scientific contributions to the NTCA 2017 conference, which took place in Prague from 7-8 December 2017 and was hosted by the Department of Air Transport, Czech Technical University in Prague with the cooperation of the Faculty of Aeronautics, Technical University of Košice; Institute of Aerospace Engineering, Brno University of Technology; Air Transport Department, University of Žilina, and the Czech Aerospace Society. The NTCA conference aims to build and extend a platform for interaction between communities interested in aviation problems and applications. NTCA 2017 followed this established practice and provided room for discussing and sharing views on the current issues in the field of aviation. As a result, these proceedings include contributions on air transport operations, air traffic management and economic aspects, aviation safety and security, aircraft technologies, unmanned aerial systems, human factors and ergonomics in aviation.

Download or read book Antenna in Package Technology and Applications written by Duixian Liu and published by John Wiley & Sons. This book was released on 2020-03-03 with total page 492 pages. Available in PDF, EPUB and Kindle. Book excerpt: A comprehensive guide to antenna design, manufacturing processes, antenna integration, and packaging Antenna-in-Package Technology and Applications contains an introduction to the history of AiP technology. It explores antennas and packages, thermal analysis and design, as well as measurement setups and methods for AiP technology. The authors—well-known experts on the topic—explain why microstrip patch antennas are the most popular and describe the myriad constraints of packaging, such as electrical performance, thermo-mechanical reliability, compactness, manufacturability, and cost. The book includes information on how the choice of interconnects is governed by JEDEC for automatic assembly and describes low-temperature co-fired ceramic, high-density interconnects, fan-out wafer level packaging–based AiP, and 3D-printing-based AiP. The book includes a detailed discussion of the surface laminar circuit–based AiP designs for large-scale mm-wave phased arrays for 94-GHz imagers and 28-GHz 5G New Radios. Additionally, the book includes information on 3D AiP for sensor nodes, near-field wireless power transfer, and IoT applications. This important book: • Includes a brief history of antenna-in-package technology • Describes package structures widely used in AiP, such as ball grid array (BGA) and quad flat no-leads (QFN) • Explores the concepts, materials and processes, designs, and verifications with special consideration for excellent electrical, mechanical, and thermal performance Written for students in electrical engineering, professors, researchers, and RF engineers, Antenna-in-Package Technology and Applications offers a guide to material selection for antennas and packages, antenna design with manufacturing processes and packaging constraints, antenna integration, and packaging.

Download or read book Advanced in Creative Technology added Value Innovations in Engineering Materials and Manufacturing written by Pichai Janmanee and published by Springer Nature. This book was released on with total page 435 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Nanocarbon Electronics written by Changjian Zhou and published by CRC Press. This book was released on 2020-12-30 with total page 279 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents a comprehensive review of research on applications of carbon nanotubes (CNTs) and graphene to electronic devices. As nanocarbons in general, and CNTs and graphene in particular, are becoming increasingly recognized as the most promising materials for future generations of electronic devices, including transistors, sensors, and interconnects, a knowledge gap still exists between the basic science of nanocarbons and their feasibility for cost-effective product manufacturing. The book highlights some of the issues surrounding this missing link by providing a detailed review of the nanostructure and electronic properties, materials, and device fabrication and of the structure–property–application relationships.

Download or read book Atomic Layer Deposition of Nanostructured Materials written by Nicola Pinna and published by John Wiley & Sons. This book was released on 2012-09-19 with total page 472 pages. Available in PDF, EPUB and Kindle. Book excerpt: Atomic layer deposition, formerly called atomic layer epitaxy, was developed in the 1970s to meet the needs of producing high-quality, large-area fl at displays with perfect structure and process controllability. Nowadays, creating nanomaterials and producing nanostructures with structural perfection is an important goal for many applications in nanotechnology. As ALD is one of the important techniques which offers good control over the surface structures created, it is more and more in the focus of scientists. The book is structured in such a way to fi t both the need of the expert reader (due to the systematic presentation of the results at the forefront of the technique and their applications) and the ones of students and newcomers to the fi eld (through the first part detailing the basic aspects of the technique). This book is a must-have for all Materials Scientists, Surface Chemists, Physicists, and Scientists in the Semiconductor Industry.