Download or read book Advanced Liquid Metal Cooling For Chip Device And System written by Jing Liu and published by World Scientific. This book was released on 2022-04-08 with total page 961 pages. Available in PDF, EPUB and Kindle. Book excerpt: This compendium summarizes the core principles and practical applications of a brand-new advanced chip cooling category — liquid metal cooling. It illustrates the science and art of room temperature liquid metal enabled cooling for chip, device and system. The concise volume features unique scientific and practical merits, and clarified intriguing liquid metal coolant or medium behaviors in making new generation powerful cooling system.With both uniquely important fundamental and practical values, this useful reference text benefits researchers to set up their foundation and then find new ways of making advanced cooling system to fulfil the increasingly urgent needs in modern highly integrated chip industry.
Download or read book Liquid Metals written by Lei Fu and published by John Wiley & Sons. This book was released on 2022-03-15 with total page 436 pages. Available in PDF, EPUB and Kindle. Book excerpt: An up-to-date exploration of the properties and most recent applications of liquid metals In Liquid Metal: Properties, Mechanisms, and Applications, a pair of distinguished researchers delivers a comprehensive exploration of liquid metals with a strong focus on their structure and physicochemical properties, preparation methods, and tuning strategies. The book also illustrates the applications of liquid metals in fields as varied as mediated synthesis, 3D printing, flexible electronics, biomedicine, energy storage, and energy conversion. The authors include coverage of reactive mediums for synthesizing and assembling nanomaterials and direct-writing electronics, and the book offers access to supplementary video materials to highlight the concepts discussed within. Recent advancements in the field of liquid metals are also discussed, as are new opportunities for research and development in this rapidly developing area. The book also includes: A thorough introduction to the fundamentals of liquid metal, including a history of its discovery, its structure and physical properties, and its preparation Comprehensive explorations of the external field tuning of liquid metal, including electrical, magnetic, and chemical tuning Practical discussions of liquid metal as a new reaction medium, including nanomaterial synthesis and alloy preparation In-depth examinations of constructing techniques of liquid metal-based architectures, including injection, imprinting, and mask-assisted depositing Perfect for materials scientists, electrochemists, and catalytic chemists, Liquid Metal: Properties, Mechanisms, and Applications also belongs in the libraries of inorganic chemists, electronics engineers, and biochemists.
Download or read book Advanced Materials for Thermal Management of Electronic Packaging written by Xingcun Colin Tong and published by Springer Science & Business Media. This book was released on 2011-01-05 with total page 633 pages. Available in PDF, EPUB and Kindle. Book excerpt: The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry’s ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility with the die and electronic packaging. In response to critical needs, there have been revolutionary advances in thermal management materials and technologies for active and passive cooling that promise integrable and cost-effective thermal management solutions. This book meets the need for a comprehensive approach to advanced thermal management in electronic packaging, with coverage of the fundamentals of heat transfer, component design guidelines, materials selection and assessment, air, liquid, and thermoelectric cooling, characterization techniques and methodology, processing and manufacturing technology, balance between cost and performance, and application niches. The final chapter presents a roadmap and future perspective on developments in advanced thermal management materials for electronic packaging.
Download or read book Liquid Metal Soft Machines written by Jing Liu and published by Springer. This book was released on 2018-09-19 with total page 372 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book discusses the core principles and practical applications of a brand new machine category: liquid-metal soft machines and motors. After a brief introduction on the conventional soft robot and its allied materials, it presents the new conceptual liquid-metal machine, which revolutionizes existing rigid robots, both large and small. It outlines the typical features of the soft liquid-metal materials and describes the various transformation capabilities, mergence of separate metal droplets, self-rotation and planar locomotion of liquid-metal objects under external or internal mechanism. Further, it introduces a series of unusual phenomena discovered while developing the shape changeable smart soft machine and interprets the related mechanisms regarding the effects of the shape, size, voltage, orientation and geometries of the external fields to control the liquid-metal transformers. Moreover, the book illustrates typical strategies to construct a group of different advanced functional liquid-metal soft machines, since such machines or robots are hard to fabricate using rigid-metal or conventional materials. With highly significant fundamental and practical findings, this book is intended for researchers interested in establishing a general method for making future smart soft machine and accompanying robots.
Download or read book Qpedia Thermal Management Electronics Cooling Book Volume 2 written by Advanced Thermal Solutions and published by Advanced Thermal Solutions. This book was released on 2008 with total page 206 pages. Available in PDF, EPUB and Kindle. Book excerpt: The complete editorial contents of Qpedia Thermal eMagazine, Volume 2, Issues 1 - 12 features in-depth, technical articles on the most critical topics in the thermal management of electronics.
Download or read book Nanotechnology for Energy Sustainability written by Baldev Raj and published by John Wiley & Sons. This book was released on 2017-01-30 with total page 1316 pages. Available in PDF, EPUB and Kindle. Book excerpt: In three handy volumes, this ready reference provides a detailed overview of nanotechnology as it is applied to energy sustainability. Clearly structured, following an introduction, the first part of the book is dedicated to energy production, renewable energy, energy storage, energy distribution, and energy conversion and harvesting. The second part then goes on to discuss nano-enabled materials, energy conservation and management, technological and intellectual property-related issues and markets and environmental remediation. The text concludes with a look at and recommendations for future technology advances. An essential handbook for all experts in the field - from academic researchers and engineers to developers in industry.
Download or read book Thermoelectric Energy Conversion written by Diana Davila Pineda and published by John Wiley & Sons. This book was released on 2017-09-12 with total page 250 pages. Available in PDF, EPUB and Kindle. Book excerpt: The latest volume in the well-established AMN series, this ready reference provides an up-to-date, self-contained summary of recent developments in the technologies and systems for thermoelectricity. Following an initial chapter that introduces the fundamentals and principles of thermoelectricity, subsequent chapters discuss the synthesis and integration of various bulk thermoelectric as well as nanostructured materials. The book then goes on to discuss characterization techniques, including various light and mechanic microscopy techniques, while also summarizing applications for thermoelectric materials, such as micro- and nano-thermoelectric generators, wearable electronics and energy conversion devices. The result is a bridge between industry and scientific researchers seeking to develop thermoelectric generators.
Download or read book Liquid Metal Heat Transfer Media written by S. S. Kutateladze and published by Springer. This book was released on 2014-09-12 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Qpedia Thermal Management Electronics Cooling Book Volume 1 written by and published by Advanced Thermal Solutions. This book was released on with total page 186 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Liquid Metal Heat Transfer Media written by S. S. Kutateladze and published by Springer. This book was released on 2013-12-07 with total page 149 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Advances in Heat Transfer written by Ephraim M. Sparrow and published by Academic Press. This book was released on 2018-11-07 with total page 394 pages. Available in PDF, EPUB and Kindle. Book excerpt: Advances in Heat Transfer, Volume 50, provides in-depth review articles from a broader scope than in traditional journals or texts, with this comprehensive release covering chapters on Heat Transfer in Rotating Channels, Advances in Liquid Metal Science and Technology in Chip Cooling and Thermal Management, Heat Transfer in Rotating Cooling Channel, Anomalous Heat Transfer: Examples, Fundamentals, and Fractional Calculus Models, and much more. Fills the information gap between regularly scheduled journals and university-level textbooks by providing in-depth review articles over a broader scope than in traditional journals or texts Essential reading for all mechanical, chemical and industrial engineers working in the field of heat transfer, or in graduate schools or industry
Download or read book Maximum PC written by and published by . This book was released on 2005-11 with total page 108 pages. Available in PDF, EPUB and Kindle. Book excerpt: Maximum PC is the magazine that every computer fanatic, PC gamer or content creator must read. Each and every issue is packed with punishing product reviews, insightful and innovative how-to stories and the illuminating technical articles that enthusiasts crave.
Download or read book Adaptive Cooling of Integrated Circuits Using Digital Microfluidics written by Philip Y. Paik and published by Artech House Publishers. This book was released on 2007 with total page 216 pages. Available in PDF, EPUB and Kindle. Book excerpt: Thanks to increasing power consumption and component density, localized hot spots are becoming a serious challenge in IC (integrated circuit) chip design - so serious, in fact, that Intel recently had to yank a circuit because it was literally burning. For IC engineers grappling with high power dissipation and thermal issues, new droplet-based cooling techniques using digital microfluidics technology could provide the solution. This definitive guide paves the way, with design and implementation methodologies and prototypes for utilizing this groundbreaking technology. After reviewing cooling principles and current bulk cooling methods, the book brings engineers up to speed on emerging droplet-based architectures. Amply illustrated, this milestone work will prove invaluable in tackling IC heat issues that existing methods can no longer address.
Download or read book 1998 5th International Conference on Solid State and Integrated Circuit Technology written by Min Zhang and published by . This book was released on 1998 with total page 1016 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Proceedings written by and published by . This book was released on 1998 with total page 1008 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Electronic and Photonic Packaging Integration and Packaging of Micro nano electronic Systems 2005 written by and published by American Society of Mechanical Engineers. This book was released on 2005 with total page 632 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Computer System Architecture written by P. V. S. RAO and published by PHI Learning Pvt. Ltd.. This book was released on 2008-12-30 with total page 524 pages. Available in PDF, EPUB and Kindle. Book excerpt: Intended as a text for undergraduate and postgraduate students of engineering in Computer Science and Engineering, Information Technology, and students pursuing courses in computer applications (BCA/MCA) and computer science (B.Sc./M.Sc.), this state-of-the-art study acquaints the students with concepts and implementations in computer architectures. Though a new title, it is a completely reorganized, thoroughly revised and fully updated version of the author’s earlier book Perspectives in Computer Architecture. The text begins with a brief account of the very early history of computers and describes the von Neumann IAS type of computers; then it goes on to give a brief introduction to the subsequent advances in computer systems covering device technologies, operational aspects, system organization and applications. This is followed by an analysis of the advances and innovations that have taken place in these areas. Advanced concepts such as look-ahead, pipelining, RISC architectures, and multi-programming are fully analyzed. The text concludes with a discussion on such topical subjects as computer networks, microprocessors and microcomputers, microprocessor families, Intel Pentium series, and newer high-power processors. HALLMARKS OF THE BOOK The text fully reflects Professor P.V.S. Rao’s long experience as an eminent academic and his professional experience as an adviser to leading telecommunications/software companies. Gives a systematic account of the evolution of computers Provides a large number of exercises to drill the students in self-study. The five Appendices at the end of the text, cover the basic concepts to enable the students to have a better understanding of the subject. Besides students, practising engineers should also find this book to be of immense value to them.
