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EBookClubs

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Book Advanced Interconnects and Contact Materials and Processes for Future Integrated Circuits  Volume 514

Download or read book Advanced Interconnects and Contact Materials and Processes for Future Integrated Circuits Volume 514 written by S. P. Murarka and published by . This book was released on 1998-11-02 with total page 596 pages. Available in PDF, EPUB and Kindle. Book excerpt: Comprising the proceedings of an MRS symposium held in April of 1998, contributions in this volume are divided into ten sections: interconnection frontiers; aluminum interconnects; cobalt and other silicides; titanium silicide; MOSFET, source, drain, and interconnect engineering; copper interconnects and barriers; a poster session on advanced interconnects and contacts; contacts to compound semiconductor devices; novel interconnect materials and schemes; and diffusion barriers. Annotation copyrighted by Book News, Inc., Portland, OR

Book Advanced Interconnects and Contacts  Volume 564

Download or read book Advanced Interconnects and Contacts Volume 564 written by Daniel C. Edelstein and published by . This book was released on 1999-10-07 with total page 606 pages. Available in PDF, EPUB and Kindle. Book excerpt: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.

Book Proceedings of the Symposia on Electrochemical Processing in ULSI Fabrication I

Download or read book Proceedings of the Symposia on Electrochemical Processing in ULSI Fabrication I written by Electrochemical Society. Dielectric Science and Technology Division and published by . This book was released on 1999 with total page 290 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Book Fundamental Aspects of Electrochemical Deposition and Dissolution

Download or read book Fundamental Aspects of Electrochemical Deposition and Dissolution written by M. Matlosz and published by The Electrochemical Society. This book was released on 2000 with total page 456 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Book GaN and Related Alloys

Download or read book GaN and Related Alloys written by and published by . This book was released on 1999 with total page 1074 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Book Solid State Ionics

Download or read book Solid State Ionics written by and published by . This book was released on 1999 with total page 752 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Book Advanced Catalytic Materials

Download or read book Advanced Catalytic Materials written by and published by . This book was released on 1999 with total page 296 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Book Thin Films   Stresses and Mechanical Properties VIII  Volume 594

Download or read book Thin Films Stresses and Mechanical Properties VIII Volume 594 written by Richard Vinci and published by Mrs Proceedings. This book was released on 2000-09-25 with total page 576 pages. Available in PDF, EPUB and Kindle. Book excerpt: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.

Book Solid Freeform and Additive Fabrication  Volume 542

Download or read book Solid Freeform and Additive Fabrication Volume 542 written by Duane Dimos and published by Mrs Proceedings. This book was released on 1999-04-27 with total page 200 pages. Available in PDF, EPUB and Kindle. Book excerpt: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.

Book High Temperature Ordered Intermetallic Alloys VIII  Volume 552

Download or read book High Temperature Ordered Intermetallic Alloys VIII Volume 552 written by Easo P. George and published by . This book was released on 1999-07-19 with total page 864 pages. Available in PDF, EPUB and Kindle. Book excerpt: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.

Book Electronic Packaging Materials Science X  Volume 515

Download or read book Electronic Packaging Materials Science X Volume 515 written by Daniel J. Belton and published by . This book was released on 1998-10 with total page 288 pages. Available in PDF, EPUB and Kindle. Book excerpt: Proceedings of the April 1998 symposium, which focused on high-density package solutions, with an emphasis on flip-chip technology. Topics include interfacial adhesion behavior, flip-chip interconnections, high-density substrates, thermomechanical behavior, and packaging reliability issues. Articles address the fracture of polymer interfaces and the delamination tendencies seen with flip-chip interconnections on organic substrates, under-bump metallurgy issues, and overall reliability issues. Annotation copyrighted by Book News, Inc., Portland, OR

Book Silicon Front end Technology  materials Processing and Modelling

Download or read book Silicon Front end Technology materials Processing and Modelling written by Nicholas E. B. Cowern and published by . This book was released on 1998 with total page 258 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Book Ti Si N as a Cu Diffusion Barrier in Microelectronic Metallization

Download or read book Ti Si N as a Cu Diffusion Barrier in Microelectronic Metallization written by Warren Franklin McArthur and published by . This book was released on 1999 with total page 284 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Book Quasicrystals

Download or read book Quasicrystals written by and published by . This book was released on 1998 with total page 552 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Book III V and IV IV Materials and Processing Challenges for Highly Integrated Microelectronics and Optoelectronics  Volume 535

Download or read book III V and IV IV Materials and Processing Challenges for Highly Integrated Microelectronics and Optoelectronics Volume 535 written by S. A. Ringel and published by . This book was released on 1999-08-11 with total page 338 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book contains the proceedings of two symposia - 'Integration of Dissimilar Materials in Micro- and Optoelectronics' and 'III-V and SiGe Group IV Device/IC Processing Challenges for Commercial Applications'. The publication stems from the desire to achieve new levels of device functionality and higher levels of performance via integration of devices based on dissimilar semiconductors, where the constraint of lattice-matching on the breadth of attainable devices can be reduced. It covers fundamental topics germane to integration of a wide range of dissimilar materials spanning wide-bandgap III-V nitrides, III-V/Si integration, II-VI and II-VI/III-V compounds, heterovalent structures, oxides, photonic bandgap structures and others. Topics such as compliancy, dislocation control, selective area growth, bonding methodologies, etc. are featured. It also addresses processing issues in the manufacturing of III-V and Si-based heterostructures for commercial products. Here, the success enjoyed by silicon germanium technology is contrasted by the promise of silicon-carbon alloys which have opportunities and challenges for the new generation of process developers.

Book Advances in Rapid Thermal Processing

Download or read book Advances in Rapid Thermal Processing written by Fred Roozeboom and published by The Electrochemical Society. This book was released on 1999 with total page 470 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Book Index of Conference Proceedings

Download or read book Index of Conference Proceedings written by British Library. Document Supply Centre and published by . This book was released on 1999 with total page 844 pages. Available in PDF, EPUB and Kindle. Book excerpt: