Download or read book ESD Protection Device and Circuit Design for Advanced CMOS Technologies written by Oleg Semenov and published by Springer Science & Business Media. This book was released on 2008-04-26 with total page 237 pages. Available in PDF, EPUB and Kindle. Book excerpt: ESD Protection Device and Circuit Design for Advanced CMOS Technologies is intended for practicing engineers working in the areas of circuit design, VLSI reliability and testing domains. As the problems associated with ESD failures and yield losses become significant in the modern semiconductor industry, the demand for graduates with a basic knowledge of ESD is also increasing. Today, there is a significant demand to educate the circuits design and reliability teams on ESD issues. This book makes an attempt to address the ESD design and implementation in a systematic manner. A design procedure involving device simulators as well as circuit simulator is employed to optimize device and circuit parameters for optimal ESD as well as circuit performance. This methodology, described in ESD Protection Device and Circuit Design for Advanced CMOS Technologies has resulted in several successful ESD circuit design with excellent silicon results and demonstrates its strengths.
Download or read book Principles of Electronic Devices Circuits written by BL Theraja | RS Sedha and published by S. Chand Publishing. This book was released on 2007 with total page 592 pages. Available in PDF, EPUB and Kindle. Book excerpt: In this book we have included more examples,tutorial problems and objective test questions in almost all the chapters.The chapter on Optoelectronic Devices has been expanded to include more application examples in the area of optical fibre networks.The chapter on Regulated Power Supply carries more detailed study of fixed positive-Fixed negative and adjustable-linear IC voltage regulators as well as swithching voltage regulator.The topic on OP-AMPs has been separated from the chapter on integrated Circuits.A new chapter is prepard on OP-AMPs and its Applications.The Chapter on OP-AMPs and its Applications includes OP-AMP based Oscillator circuits,active filters etc.
Download or read book Electronics Engineer s Reference Book written by F. F. Mazda and published by Butterworth-Heinemann. This book was released on 2013-10-22 with total page 1032 pages. Available in PDF, EPUB and Kindle. Book excerpt: Electronics Engineer's Reference Book, Sixth Edition is a five-part book that begins with a synopsis of mathematical and electrical techniques used in the analysis of electronic systems. Part II covers physical phenomena, such as electricity, light, and radiation, often met with in electronic systems. Part III contains chapters on basic electronic components and materials, the building blocks of any electronic design. Part IV highlights electronic circuit design and instrumentation. The last part shows the application areas of electronics such as radar and computers.
Download or read book Fundamentals of Digital Electronics written by Dhanasekharan Natarajan and published by Springer Nature. This book was released on 2020-03-25 with total page 313 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents the fundamentals of digital electronics in a focused and comprehensivemanner with many illustrations for understanding of the subject with high clarity. DigitalSignal Processing (DSP) application information is provided for many topics of the subjectto appreciate the practical significance of learning. To summarize, this book lays afoundation for students to become DSP engineers.
Download or read book CMOS written by R. Jacob Baker and published by John Wiley & Sons. This book was released on 2008 with total page 1074 pages. Available in PDF, EPUB and Kindle. Book excerpt: This edition provides an important contemporary view of a wide range of analog/digital circuit blocks, the BSIM model, data converter architectures, and more. The authors develop design techniques for both long- and short-channel CMOS technologies and then compare the two.
Download or read book Predicasts F S Index United States written by Predicasts, inc and published by . This book was released on 1992 with total page 1286 pages. Available in PDF, EPUB and Kindle. Book excerpt: A comprehensive index to company and industry information in business journals.
Download or read book Scaling And Integration Of High speed Electronics And Optomechanical Systems written by Magnus Willander and published by World Scientific. This book was released on 2017-04-17 with total page 150 pages. Available in PDF, EPUB and Kindle. Book excerpt: Coined as the third revolution in electronics is under way; Manufacturing is going digital, driven by computing revolution, powered by MOS technology, in particular, by the CMOS technology and its development.In this book, the scaling challenges for CMOS: SiGe BiCMOS, THz and niche technology are covered; the first article looks at scaling challenges for CMOS from an industrial point of view (review of the latest innovations); the second article focuses on SiGe BiCMOS technologies (deals with high-speed up to the THz-region), and the third article reports on circuits associated with source/drain integration in 14 nm and beyond FinFET technology nodes. Followed by the last two articles on niche applications for emerging technologies: one deals with carbon nanotube network and plasmonics for the THz region carbon, while the other reviews the recent developments in integrated on-chip nano-optomechanical systems.
Download or read book Design of 3D Integrated Circuits and Systems written by Rohit Sharma and published by CRC Press. This book was released on 2018-09-03 with total page 328 pages. Available in PDF, EPUB and Kindle. Book excerpt: Three-dimensional (3D) integration of microsystems and subsystems has become essential to the future of semiconductor technology development. 3D integration requires a greater understanding of several interconnected systems stacked over each other. While this vertical growth profoundly increases the system functionality, it also exponentially increases the design complexity. Design of 3D Integrated Circuits and Systems tackles all aspects of 3D integration, including 3D circuit and system design, new processes and simulation techniques, alternative communication schemes for 3D circuits and systems, application of novel materials for 3D systems, and the thermal challenges to restrict power dissipation and improve performance of 3D systems. Containing contributions from experts in industry as well as academia, this authoritative text: Illustrates different 3D integration approaches, such as die-to-die, die-to-wafer, and wafer-to-wafer Discusses the use of interposer technology and the role of Through-Silicon Vias (TSVs) Presents the latest improvements in three major fields of thermal management for multiprocessor systems-on-chip (MPSoCs) Explores ThruChip Interface (TCI), NAND flash memory stacking, and emerging applications Describes large-scale integration testing and state-of-the-art low-power testing solutions Complete with experimental results of chip-level 3D integration schemes tested at IBM and case studies on advanced complementary metal–oxide–semiconductor (CMOS) integration for 3D integrated circuits (ICs), Design of 3D Integrated Circuits and Systems is a practical reference that not only covers a wealth of design issues encountered in 3D integration but also demonstrates their impact on the efficiency of 3D systems.
Download or read book A Textbook of Electrical Technology Volume IV written by BL Theraja and published by S. Chand Publishing. This book was released on 2006 with total page 2736 pages. Available in PDF, EPUB and Kindle. Book excerpt: A Textbook of Electrical Technology(Vol. IV)Multicolorpictures have been added to enchance the contenet value and give to the students an idea of what he will be dealing in realityand to bridge the gap between theory and practice.A notable feature is the inclusion of chapter on Flip-Flops and related Devices as per latest development in the subject.Latest tutorial problems and objective type questions specially for GATE have been included at relevant places.
Download or read book BiCMOS CMOS Systems Design written by James Edgar Buchanan and published by McGraw-Hill Companies. This book was released on 1991 with total page 344 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Foundation of Digital Electronics and Logic Design written by Subir Kumar Sarkar and published by CRC Press. This book was released on 2014-12-10 with total page 372 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book focuses on the basic principles of digital electronics and logic design. It is designed as a textbook for undergraduate students of electronics, electrical engineering, computer science, physics, and information technology. The text covers the syllabi of several Indian and foreign universities. It depicts the comprehensive resources
Download or read book Advanced Industrial Control Technology written by Peng Zhang and published by William Andrew. This book was released on 2010-08-26 with total page 866 pages. Available in PDF, EPUB and Kindle. Book excerpt: Control engineering seeks to understand physical systems, using mathematical modeling, in terms of inputs, outputs and various components with different behaviors. It has an essential role in a wide range of control systems, from household appliances to space flight. This book provides an in-depth view of the technologies that are implemented in most varieties of modern industrial control engineering. A solid grounding is provided in traditional control techniques, followed by detailed examination of modern control techniques such as real-time, distributed, robotic, embedded, computer and wireless control technologies. For each technology, the book discusses its full profile, from the field layer and the control layer to the operator layer. It also includes all the interfaces in industrial control systems: between controllers and systems; between different layers; and between operators and systems. It not only describes the details of both real-time operating systems and distributed operating systems, but also provides coverage of the microprocessor boot code, which other books lack. In addition to working principles and operation mechanisms, this book emphasizes the practical issues of components, devices and hardware circuits, giving the specification parameters, install procedures, calibration and configuration methodologies needed for engineers to put the theory into practice. - Documents all the key technologies of a wide range of industrial control systems - Emphasizes practical application and methods alongside theory and principles - An ideal reference for practicing engineers needing to further their understanding of the latest industrial control concepts and techniques
Download or read book Electronic Materials Handbook written by and published by ASM International. This book was released on 1989-11-01 with total page 1234 pages. Available in PDF, EPUB and Kindle. Book excerpt: Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.
Download or read book Index of Specifications and Standards written by and published by . This book was released on with total page 960 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Wafer Level 3 D ICs Process Technology written by Chuan Seng Tan and published by Springer Science & Business Media. This book was released on 2009-06-29 with total page 365 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses the technology platform for pre-packaging wafer lever 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging. This is an edited book based on chapters contributed by various experts in the field of wafer-level 3-D ICs process technology. They are from academia, research labs and industry.
Download or read book BoogarLists Directory of Electronics Technologies written by and published by BoogarLists. This book was released on with total page 107 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Reliability Yield and Stress Burn In written by Way Kuo and published by Springer Science & Business Media. This book was released on 2013-11-27 with total page 407 pages. Available in PDF, EPUB and Kindle. Book excerpt: The international market is very competitive for high-tech manufacturers to day. Achieving competitive quality and reliability for products requires leader ship from the top, good management practices, effective and efficient operation and maintenance systems, and use of appropriate up-to-date engineering de sign tools and methods. Furthermore, manufacturing yield and reliability are interrelated. Manufacturing yield depends on the number of defects found dur ing both the manufacturing process and the warranty period, which in turn determines the reliability. the production of microelectronics has evolved into Since the early 1970's, one of the world's largest manufacturing industries. As a result, an important agenda is the study of reliability issues in fabricating microelectronic products and consequently the systems that employ these products, particularly, the new generation of microelectronics. Such an agenda should include: • the economic impact of employing the microelectronics fabricated by in dustry, • a study of the relationship between reliability and yield, • the progression toward miniaturization and higher reliability, and • the correctness and complexity of new system designs, which include a very significant portion of software.
