Download or read book A Thermal Management Design for System on chip Circuits and Advanced Computer Systems written by Herming Chiueh and published by . This book was released on 2002 with total page 242 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book The Art of Software Thermal Management for Embedded Systems written by Mark Benson and published by Springer Science & Business Media. This book was released on 2014-01-03 with total page 130 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book introduces Software Thermal Management (STM) as a means of reducing power consumption in a computing system in order to manage heat, improve component reliability and increase system safety. Readers will benefit from this pragmatic guide to the field of STM for embedded systems and its catalog of software power management techniques. Since thermal management is a key bottleneck in embedded systems design, this book focuses on root cause of heat in embedded systems: power. Since software has an enormous impact on power consumption in an embedded system, this book urges software engineers to manage heat effectively by understanding, categorizing and developing new ways to reduce static and dynamic power consumption. Whereas most books on thermal management describe mechanisms to remove heat, this book focuses on ways for software engineers to avoid generating heat in the first place.
Download or read book Dissertation Abstracts International written by and published by . This book was released on 2006 with total page 886 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Advanced Materials for Thermal Management of Electronic Packaging written by Xingcun Colin Tong and published by Springer Science & Business Media. This book was released on 2011-01-05 with total page 633 pages. Available in PDF, EPUB and Kindle. Book excerpt: The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry’s ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility with the die and electronic packaging. In response to critical needs, there have been revolutionary advances in thermal management materials and technologies for active and passive cooling that promise integrable and cost-effective thermal management solutions. This book meets the need for a comprehensive approach to advanced thermal management in electronic packaging, with coverage of the fundamentals of heat transfer, component design guidelines, materials selection and assessment, air, liquid, and thermoelectric cooling, characterization techniques and methodology, processing and manufacturing technology, balance between cost and performance, and application niches. The final chapter presents a roadmap and future perspective on developments in advanced thermal management materials for electronic packaging.
Download or read book Advanced Circuits for Emerging Technologies written by Krzysztof Iniewski and published by John Wiley & Sons. This book was released on 2012-04-17 with total page 632 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book will address the-state-of-the-art in integrated circuit design in the context of emerging systems. New exciting opportunities in body area networks, wireless communications, data networking, and optical imaging are discussed. Emerging materials that can take system performance beyond standard CMOS, like Silicon on Insulator (SOI), Silicon Germanium (SiGe), and Indium Phosphide (InP) are explored. Three-dimensional (3-D) CMOS integration and co-integration with sensor technology are described as well. The book is a must for anyone serious about circuit design for future technologies. The book is written by top notch international experts in industry and academia. The intended audience is practicing engineers with integrated circuit background. The book will be also used as a recommended reading and supplementary material in graduate course curriculum. Intended audience is professionals working in the integrated circuit design field. Their job titles might be : design engineer, product manager, marketing manager, design team leader, etc. The book will be also used by graduate students. Many of the chapter authors are University Professors.
Download or read book Designing 2D and 3D Network on Chip Architectures written by Konstantinos Tatas and published by Springer Science & Business Media. This book was released on 2013-10-08 with total page 271 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book covers key concepts in the design of 2D and 3D Network-on-Chip interconnect. It highlights design challenges and discusses fundamentals of NoC technology, including architectures, algorithms and tools. Coverage focuses on topology exploration for both 2D and 3D NoCs, routing algorithms, NoC router design, NoC-based system integration, verification and testing, and NoC reliability. Case studies are used to illuminate new design methodologies.
Download or read book Thermally Aware Design written by Yong Zhan and published by Now Publishers Inc. This book was released on 2008 with total page 131 pages. Available in PDF, EPUB and Kindle. Book excerpt: Provides an overview of analysis and optimization techniques for thermally-aware chip design.
Download or read book Integrated Power thermal Management Circuits and Techniques for Next generation System on chips written by Chen Zheng and published by . This book was released on 2012 with total page 394 pages. Available in PDF, EPUB and Kindle. Book excerpt: All the power/thermal management systems have been fabricated and tested successfully to demonstrate the techniques proposed in this research. The measurement results show good performance in both steady state and transient times with high efficiency and effective noise suppression. The proposed techniques are thus evidently suitable for next-generation SoCs.
Download or read book Integrated Circuit and System Design Power and Timing Modeling Optimization and Simulation written by Jose L. Ayala and published by Springer Science & Business Media. This book was released on 2011-09-15 with total page 362 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book constitutes the refereed proceedings of the 21st International Conference on Integrated Circuit and System Design, PATMOS 2011, held in Madrid, Spain, in September 2011. The 34 revised full papers presented were carefully reviewed and selected from numerous submissions. The paper feature emerging challenges in methodologies and tools for the design of upcoming generations of integrated circuits and systems and focus especially on timing, performance and power consumption as well as architectural aspects with particular emphasis on modeling, design, characterization, analysis and optimization.
Download or read book Thermal Management Handbook For Electronic Assemblies written by Jerry E. Sergent and published by McGraw Hill Professional. This book was released on 1998 with total page 370 pages. Available in PDF, EPUB and Kindle. Book excerpt: Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product. The "hands-on" guide to thermal management! In recent years, heat-sensitive electronic systems have been miniaturized far more than their heat-producing power supplies, leading to major design and reliability challenges — and making thermal management a critical design factor. This timely handbook covers all the practical issues that any packaging engineer must consider with regard to the thermal management of printed circuit boards, hybrid circuits, and multichip modules. Readers will also benefit from the extensive data on material properties and circuit functions, thus enabling more intelligent decisions at the design stage — and preventing thermal-related problems from occurring in the first place.
Download or read book Design of 3D Integrated Circuits and Systems written by Rohit Sharma and published by CRC Press. This book was released on 2018-09-03 with total page 328 pages. Available in PDF, EPUB and Kindle. Book excerpt: Three-dimensional (3D) integration of microsystems and subsystems has become essential to the future of semiconductor technology development. 3D integration requires a greater understanding of several interconnected systems stacked over each other. While this vertical growth profoundly increases the system functionality, it also exponentially increases the design complexity. Design of 3D Integrated Circuits and Systems tackles all aspects of 3D integration, including 3D circuit and system design, new processes and simulation techniques, alternative communication schemes for 3D circuits and systems, application of novel materials for 3D systems, and the thermal challenges to restrict power dissipation and improve performance of 3D systems. Containing contributions from experts in industry as well as academia, this authoritative text: Illustrates different 3D integration approaches, such as die-to-die, die-to-wafer, and wafer-to-wafer Discusses the use of interposer technology and the role of Through-Silicon Vias (TSVs) Presents the latest improvements in three major fields of thermal management for multiprocessor systems-on-chip (MPSoCs) Explores ThruChip Interface (TCI), NAND flash memory stacking, and emerging applications Describes large-scale integration testing and state-of-the-art low-power testing solutions Complete with experimental results of chip-level 3D integration schemes tested at IBM and case studies on advanced complementary metal–oxide–semiconductor (CMOS) integration for 3D integrated circuits (ICs), Design of 3D Integrated Circuits and Systems is a practical reference that not only covers a wealth of design issues encountered in 3D integration but also demonstrates their impact on the efficiency of 3D systems.
Download or read book Advanced Computer Architectures written by Sajjan G. Shiva and published by CRC Press. This book was released on 2018-10-24 with total page 290 pages. Available in PDF, EPUB and Kindle. Book excerpt: Despite the tremendous advances in performance enabled by modern architectures, there are always new applications and demands arising that require ever-increasing capabilities. Keeping up with these demands requires a deep-seated understanding of contemporary architectures in concert with a fundamental understanding of basic principles that allows one to anticipate what will be possible over the system's lifetime. Advanced Computer Architectures focuses on the design of high performance supercomputers with balanced coverage of the hardware, software structures, and application characteristics. This book is a timeless distillation of underlying principles punctuated by real-world implementations in popular current and past commercially available systems. It briefly reviews the basics of uniprocessor architecture before outlining the most popular processing paradigms, performance evaluation, and cost factor considerations. This builds to a discussion of pipeline design and vector processors, data parallel architectures, and multiprocessor systems. Rounding out the book, the final chapter explores some important current and emerging trends such as Dataflow, Grid, biology-inspired, and optical computing. More than 220 figures, tables, and equations illustrate the concepts presented. Based on the author's more than thirty years of teaching and research, Advanced Computer Architectures endows you with the tools necessary to reach the limits of existing technology, and ultimately, to break them.
Download or read book Embedded Computer Systems Architectures Modeling and Simulation written by Alex Orailoglu and published by Springer Nature. This book was released on 2022-08-13 with total page 435 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book constitutes the proceedings of the 22st International Conference on Embedded Computer Systems: Architectures, Modeling, and Simulation, SAMOS 2021, which took place in July 2022 in Samos, Greece. The 21 full papers presented in this volume were carefully reviewed and selected from 44 submissions. The papers are organized in topics as follows: High level synthesis; memory systems; processor architecture; embedded software systems and beyond; deep learning optimization; extra-functional property estimation; innovative architectures and tools for security; european research projects on digital systems, services, and platforms.
Download or read book Thermal and Power Management of Integrated Circuits written by Arman Vassighi and published by Springer. This book was released on 2008-11-01 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: In Thermal and Power Management of Integrated Circuits, power and thermal management issues in integrated circuits during normal operating conditions and stress operating conditions are addressed. Thermal management in VLSI circuits is becoming an integral part of the design, test, and manufacturing. Proper thermal management is the key to achieve high performance, quality and reliability. Performance and reliability of integrated circuits are strong functions of the junction temperature. A small increase in junction temperature may result in significant reduction in the device lifetime. This book reviews the significance of the junction temperature as a reliability measure under nominal and burn-in conditions. The latest research in the area of electro-thermal modeling of integrated circuits will also be presented. Recent models and associated CAD tools are covered and various techniques at the circuit and system levels are reviewed. Subsequently, the authors provide an insight into the concept of thermal runaway and how it may best be avoided. A section on low temperature operation of integrated circuits concludes the book.
Download or read book Modeling Analysis and Optimization of Network on Chip Communication Architectures written by Umit Y. Ogras and published by Springer Science & Business Media. This book was released on 2013-03-12 with total page 182 pages. Available in PDF, EPUB and Kindle. Book excerpt: Traditionally, design space exploration for Systems-on-Chip (SoCs) has focused on the computational aspects of the problem at hand. However, as the number of components on a single chip and their performance continue to increase, the communication architecture plays a major role in the area, performance and energy consumption of the overall system. As a result, a shift from computation-based to communication-based design becomes mandatory. Towards this end, network-on-chip (NoC) communication architectures have emerged recently as a promising alternative to classical bus and point-to-point communication architectures. In this dissertation, we study outstanding research problems related to modeling, analysis and optimization of NoC communication architectures. More precisely, we present novel design methodologies, software tools and FPGA prototypes to aid the design of application-specific NoCs.
Download or read book Transactions on High Performance Embedded Architectures and Compilers IV written by Per Stenström and published by Springer Science & Business Media. This book was released on 2011-11-22 with total page 446 pages. Available in PDF, EPUB and Kindle. Book excerpt: Transactions on HiPEAC aims at the timely dissemination of research contributions in computer architecture and compilation methods for high-performance embedded computer systems. Recognizing the convergence of embedded and general-purpose computer systems, this journal publishes original research on systems targeted at specific computing tasks as well as systems with broad application bases. The scope of the journal therefore covers all aspects of computer architecture, code generation and compiler optimization methods of interest to researchers and practitioners designing future embedded systems. This 4th issue contains 21 papers carefully reviewed and selected out of numerous submissions and is divided in four sections. The first section contains five regular papers. The second section consists of the top four papers from the 4th International Conference on High-Performance Embedded Architectures and Compilers, HiPEAC 2009, held in Paphos, Cyprus, in January 2009. The third section contains a set of six papers providing a snap-shot from the Workshop on Software and Hardware Challenges of Manycore Platforms, SHCMP 2008 held in Beijing, China, in June 2008. The fourth section consists of six papers from the 8th IEEE International Symposium on Systems, Architectures, Modeling and Simulation, SAMOS VIII (2008) held in Samos, Greece, in July 2008.
Download or read book Proceedings of the Midwest Symposium on Circuits and Systems written by and published by . This book was released on 2000 with total page 600 pages. Available in PDF, EPUB and Kindle. Book excerpt:
