Download or read book A Study of the Coarsening in Tin Lead Solders written by Wolfgang Dreyer and published by . This book was released on 1998 with total page 31 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book A Guide to Lead free Solders written by John W. Evans and published by Springer Science & Business Media. This book was released on 2007-01-05 with total page 212 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book is important because it reflects a trend, especially in microelectronics manufacture toward recyclability. Europe and Asia are moving towards legislation to ban the use of lead in solders and public demand in the US will likely have the same result. Producers of solders and manufacturers who use them will have to invent and employ suitable substitutes and A Guide to Lead-free Solders will show them how to do so.
Download or read book Tin Solders written by S. J. Nightingale and published by . This book was released on 1932 with total page 122 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book New Achievements in Continuum Mechanics and Thermodynamics written by Bilen Emek Abali and published by Springer. This book was released on 2019-03-13 with total page 586 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents a liber amicorum dedicated to Wolfgang H. Müller, and highlights recent advances in Prof. Müller’s major fields of research: continuum mechanics, generalized mechanics, thermodynamics, mechanochemistry, and geomechanics. Over 50 of Prof. Müller’s friends and colleagues contributed to this book, which commemorates his 60th birthday and was published in recognition of his outstanding contributions.
Download or read book Mathematical Methods and Models in Phase Transitions written by Alain Miranville and published by Nova Publishers. This book was released on 2005 with total page 306 pages. Available in PDF, EPUB and Kindle. Book excerpt: The modelling and the study of phase transition phenomena are capital issues as they have essential applications in material sciences and in biological and industrial processes. We can mention, e.g., phase separation in alloys, ageing of materials, microstructure evolution, crystal growth, solidification in complex alloys, surface diffusion in the presence of stress, evolution of the surface of a thin flow in heteroepitaxial growth, motion of voids in interconnects in integrated circuits, treatment of airway closure disease by surfactant injection, fuel injection, fire extinguishers etc., This book consists of 11 contributions from specialists in the mathematical modelling and analysis of phase transitions. The content of these contributions ranges from the modelling to the mathematical and numerical analysis. Furthermore, many numerical simulations are presented. Finally, the contributors have tried to give comprehensive and accurate reference lists. This book should thus serve as a reference book for researchers interested in phase transition phenomena.
Download or read book Analysis Modeling and Simulation of Multiscale Problems written by Alexander Mielke and published by Springer Science & Business Media. This book was released on 2006-10-14 with total page 704 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book reports recent mathematical developments in the Programme "Analysis, Modeling and Simulation of Multiscale Problems", which started as a German research initiative in 2006. Multiscale problems occur in many fields of science, such as microstructures in materials, sharp-interface models, many-particle systems and motions on different spatial and temporal scales in quantum mechanics or in molecular dynamics. The book presents current mathematical foundations of modeling, and proposes efficient numerical treatment.
Download or read book Applied Mechanics Reviews written by and published by . This book was released on 2000 with total page 776 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Lead Free Electronic Solders written by KV Subramanian and published by Springer Science & Business Media. This book was released on 2007-06-28 with total page 370 pages. Available in PDF, EPUB and Kindle. Book excerpt: Even though the effect of lead contamination on human health has been known for decades, very little attention has been paid to lead-based solders used in electronics until recently. This comprehensive book examines all the important issues associated with lead-free electronic solder. It collects the work of researchers recognized for their significant scientific contributions in the area.
Download or read book Tests for Tin lead Solders and Solder Joints written by Vernon R. Miller and published by . This book was released on 1967 with total page 36 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Continuum Models and Discrete Systems CMDS 11 written by Dominique Jeulin and published by Presses des MINES. This book was released on 2008 with total page 62 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Non Smooth Thermomechanics written by Michel Fremond and published by Springer Science & Business Media. This book was released on 2013-03-14 with total page 487 pages. Available in PDF, EPUB and Kindle. Book excerpt: Based on practical problems in mechanical engineering, here the author develops the fundamental concepts of non-smooth mechanics and introduces the necessary background material needed to deal with mechanics involving discontinuities and non-smooth constraints.
Download or read book Modeling and Numerical Simulation of Materials Behavior and Evolution Volume 731 written by Antonios Zavaliangos and published by . This book was released on 2002-08-09 with total page 344 pages. Available in PDF, EPUB and Kindle. Book excerpt: In recent years, numerical simulation and modeling of materials coupling multiple-length scales has received much attention. While challenges remain, significant advances have been made. An equally important area of materials modeling, one that has received much less attention, is the integration of multiple physical phenomena for simulation of complex materials behavior. This volume offers a review of current capabilities in materials modeling and simulation that (1) bridge length scales and time scales and (2) couple a variety of physical phenomena to either provide insight into fundamental aspects of materials structure or predict materials behavior. By bringing together the materials modeling community from around the world, the volume provides a current snapshot of the field. Topics include: multiscale modeling; mechanical properties; transport phenomena; phase transformations; microstructure and its evolution; atomistic modeling; and materials structure and properties.
Download or read book Tin Solders written by S. J. Nightingale and published by . This book was released on 1942 with total page 140 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Proceedings of 3rd Electronics Packaging Technology Conference EPTC 2000 written by Thiam Beng Lim and published by Institute of Electrical & Electronics Engineers(IEEE). This book was released on 2000 with total page 492 pages. Available in PDF, EPUB and Kindle. Book excerpt: Topics covered by this title include: packaging materials; packaging trends; thermal design and modelling; solder joint metallurgy; process and reliability modelling; thermal characterization; materials characterization techniques; and assembly/manufacturing technologies.
Download or read book Phase Structure and Cyclic Deformation in Eutectic Tin Lead Alloy written by and published by . This book was released on 1999 with total page 20 pages. Available in PDF, EPUB and Kindle. Book excerpt: This study is devoted to providing a mechanistic rationale of coarsening induced failure in solder alloys during thermomechanical fatigue. Micromechanical modeling of cyclic deformation of eutectic tin-lead alloy was undertaken using the finite element method. The models consist of regularly arranged tin-rich and lead-rich phases, simulating the lamellar array and colony structure in a typical eutectic system. A fine structure and a coarse structure, bearing the same phase fraction but different in the aspect ratio of each lead-rich layer and in the number of lead-rich layers in each colony, are utilized for representing the microstructure before and after coarsening, respectively. Both phases are treated as elastic-plastic solids with their respective properties. For simplicity the creep effect is ignored without compromising the main objective of this study. Cyclic loading under pure shear and uniaxial conditions is modeled. It is found that both the fine and coarse structures exhibit essentially the same macroscopic stress-strain response. The coarse structure, however, shows a greater maximum effective plastic strain on a local scale throughout the deformation. The numerical result implies that, in a solder joint, a locally coarsened region may not be mechanically weaker than its surrounding, but it is subject to early damage initiation due to accumulated plasticity. Other implications regarding solder alloy failure and micromechanical modeling of two-phase materials are discussed.
Download or read book Handbook of Lead Free Solder Technology for Microelectronic Assemblies written by Karl J. Puttlitz and published by CRC Press. This book was released on 2004-02-27 with total page 1044 pages. Available in PDF, EPUB and Kindle. Book excerpt: This reference provides a complete discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for low-end and high-end applications. Written by more than 45 world-class researchers and practitioners, the book discusses general reliability issues concerning microelectronic assemblies, as well as factors specific to the tin-rich replacement alloys commonly utilized in lead-free solders. It provides real-world manufacturing accounts of the introduction of reduced-lead and lead-free technology and discusses the functionality and cost effectiveness of alternative solder alloys and non-solder alternatives replacing lead-tin solders in microelectronics.
Download or read book The Chemical Analysis of Tin lead Solders written by J. W. Price and published by . This book was released on 1942 with total page 3 pages. Available in PDF, EPUB and Kindle. Book excerpt:
