Download or read book A Study of Bonding Formation in the Ultrasonic Welding of Aluminum and Copper written by Soo-Woong Choi (Welding engineer) and published by . This book was released on 1981 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book An Investigation of Bonding Formation in Ultrasonic Welding of Aluminum written by Kuang-Liang Hsu and published by . This book was released on 1980 with total page 194 pages. Available in PDF, EPUB and Kindle. Book excerpt: Abstract: The main objective in this experimental investi¬gation is to test the validity of various proposed bonding mechanisms in ultrasonic welding. The bonding interfaces of ultrasonic aluminum welds were examined by means of cross section metallography, microhardness tests and SEM observations. Adhesion produced by local plastic deformation was found to be the most plausible mechanism. Based on the appearance of fracture surfaces of peeled welds, a relationship between surface contact asperities and bonding formation is suggested. The ef¬fects of weld time and clamping force on the weld strength were also examined. Weld strength was found to be an asymptotic increasing function of weld time and an optimal clamping force was obtained.
Download or read book Ultrasonic Welding of Metal Sheets written by Susanta Kumar Sahoo and published by CRC Press. This book was released on 2020-11-18 with total page 241 pages. Available in PDF, EPUB and Kindle. Book excerpt: Ultrasonic Welding of Metal Sheets covers various aspects of ultrasonic welding (USW) of metal sheets, including the discussion on modeling and numerical simulations of ultrasonic welding to improve this welding process and performance. This book aims to provide an accessible, comprehensive and up-to-date exposition of the various aspects of joining of dissimilar metal sheets ranging from its fundamentals thorough to metallurgical characteristics covering fundamental concepts, in-detailed explanation about the USW including its implementation, design criteria, work material, welding, thermo-mechanical and research scopes. The book is aimed at researchers, professionals and graduate students in manufacturing, welding, mechanical engineering. Features The ultrasonic spot welding of various metal sheets is described in simplified expression and concepts are elucidated by relevant illustrations. Discusses modeling and numerical simulations of ultrasonic welding to improve the ultrasonic welding process and performance As opposed to competition in the market, this title provides thorough clarification of ultrasonic spot welding of metal sheets with its applications.
Download or read book Ultrasonic Welding of Metals written by J. Byron Jones and published by . This book was released on 1955 with total page 126 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Advanced Joining Processes written by Lucas F. M. da Silva and published by Elsevier. This book was released on 2020-10-31 with total page 402 pages. Available in PDF, EPUB and Kindle. Book excerpt: Advanced Joining Processes: Welding, Plastic Deformation, and Adhesion brings together a range of advanced thermal, mechanical, and chemical methods of joining, offering an up-to-date resource for those looking to understand and utilize the very latest techniques. Efficient joining techniques are critical to a range of innovative applications, with technology in constant development. The first section of the book provides in-depth information on advanced welding techniques, including friction stir, explosive, ultrasonic, laser, electron beam, and computational weld analysis and fatigue of structures. The second section highlights key developments in joining by plastic deformation, adhesive bonding, and hybrid joining. The coverage of each technique is supported by practical guidance, detailed analysis, and finite element simulations. This is an essential reference for researchers and advanced students in joining, welding, adhesion, materials processing, mechanical engineering, plastics engineering, manufacturing, civil engineering, and automotive/aerospace engineering, as well as engineers, scientists, and R&D professionals, using joining, welding, and adhesion methods, across a range of industries. Presents the latest research findings and developments across welding, joining by plastic deformation, and adhesion Includes state-of-the-art methods, such as laser, ultrasonic and electron beam welding, hybrid joining, and the use of electromagnetic pulses Offers practical guidance, detailed analysis, and finite element simulations, for all techniques covered
Download or read book Ultrasonic Welding of Aluminum written by J. Byron Jones and published by . This book was released on 1955 with total page 50 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Microjoining and Nanojoining written by Y N Zhou and published by Elsevier. This book was released on 2008-03-27 with total page 835 pages. Available in PDF, EPUB and Kindle. Book excerpt: Many important advances in technology have been associated with nanotechnology and the miniaturization of components, devices and systems. Microjoining has been closely associated with the evolution of microelectronic packaging, but actually covers a much broader area, and is essential for manufacturing many electronic, precision and medical products.Part one reviews the basics of microjoining, including solid-state bonding and fusion microwelding. Part two covers microjoining and nanojoining processes, such as bonding mechanisms and metallurgy, process development and optimization, thermal stresses and distortion, positioning and fixturing, sensing, and numerical modelling. Part three discusses microjoining of materials such as plastics, ceramics, metals and advanced materials such as shape memory alloys and nanomaterials. The book also discusses applications of microjoining such as joining superconductors, the manufacture of medical devices and the sealing of solid oxide fuel cells.This book provides a comprehensive overview of the fundamental aspects of microjoining processes and techniques. It is a valuable reference for production engineers, designers and researchers using or studying microjoining technologies in such industries as microelectronics and biomedical engineering. Reviews the basics of nanojoining including solid-state bonding and fusion microwelding Covers microjoining and nanojoining processes such as bonding mechanisms and metallurgy, sensing and numerical modelling Examines applications of microjoining such as the manufacturing of medical devices, and the sealing of solid oxide fuel cells
Download or read book A Thermomechanical Analysis of an Ultrasonic Bonding Mechanism written by Chunbo Zhang and published by . This book was released on 2011 with total page 121 pages. Available in PDF, EPUB and Kindle. Book excerpt: A systematic experimental and numerical combined study of the thermomechanical bonding mechanisms in the ultrasonic welding (UW) process was conducted. A fully coupled thermomechanical finite element model has been built to fully understand the evolution and coupling between the in-process thermomechanical variables. The severe, localized, plastic deformation at the bond region is believed to be the major phenomenon for bond formation in ultrasonic welding. The influences of substrate dimensions on bond formation were studied and explained with an analytical vibration model. The formation of banded and cyclic stress-strain maxima in the substrate was found to be caused by superposition of vibrations. A push-pin type, combined experimental and numerical, method has been developed, validated, and applied to quantitatively determine the bond strength of UW parts. The best bond strength produced using the set of process parameters in this study was 75% of the ultimate tensile strength of the base material (Al3003-H18). Effects of UW parameters (normal pressure, vibration amplitude, and travel velocity) on bond strength have been characterized. Due to the weak vertical bond strength of UW parts, the pressurized post-weld heat treatment (PWHT) approach is originally proposed to improve the bond strength. The results show that the modified bond strength, up to 96% of the strength of the base material, can be achieved under the optimum parameters of 2.5 MPa pressure, 450 C temperature, and 1.5 h time.
Download or read book Copper Wire Bonding written by Preeti S Chauhan and published by Springer Science & Business Media. This book was released on 2013-09-20 with total page 254 pages. Available in PDF, EPUB and Kindle. Book excerpt: This critical volume provides an in-depth presentation of copper wire bonding technologies, processes and equipment, along with the economic benefits and risks. Due to the increasing cost of materials used to make electronic components, the electronics industry has been rapidly moving from high cost gold to significantly lower cost copper as a wire bonding material. However, copper wire bonding has several process and reliability concerns due to its material properties. Copper Wire Bonding book lays out the challenges involved in replacing gold with copper as a wire bond material, and includes the bonding process changes—bond force, electric flame off, current and ultrasonic energy optimization, and bonding tools and equipment changes for first and second bond formation. In addition, the bond–pad metallurgies and the use of bare and palladium-coated copper wires on aluminum are presented, and gold, nickel and palladium surface finishes are discussed. The book also discusses best practices and recommendations on the bond process, bond–pad metallurgies, and appropriate reliability tests for copper wire-bonded electronic components. In summary, this book: Introduces copper wire bonding technologies Presents copper wire bonding processes Discusses copper wire bonding metallurgies Covers recent advancements in copper wire bonding including the bonding process, equipment changes, bond–pad materials and surface finishes Covers the reliability tests and concerns Covers the current implementation of copper wire bonding in the electronics industry Features 120 figures and tables Copper Wire Bonding is an essential reference for industry professionals seeking detailed information on all facets of copper wire bonding technology.
Download or read book Advanced Joining Processes written by Lucas F. M. da Silva and published by Springer Nature. This book was released on 2020-03-31 with total page 178 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents recent material science-based and mechanical analysis-based advances in joining processes. It includes all related processes, e.g. friction stir welding, joining by plastic deformation, laser welding, clinch joining, and adhesive bonding, as well as hybrid joints. It gathers selected full-length papers from the 1st Conference on Advanced Joining Processes.
Download or read book Physical Principles of Ultrasonic Technology written by L. Rozenberg and published by Springer Science & Business Media. This book was released on 2013-12-11 with total page 532 pages. Available in PDF, EPUB and Kindle. Book excerpt: This is the third work in a series of monographs* written by a col lective group of authors and is devoted to the physical mechanisms of specific ultrasonic technological processes that have already come into general use, as well as those which have just begun to enjoy practical applications. The problems covered in the book are exceedingly important insofar as the understanding of the phys ical mechanisms of ultrasonic processes forms the solitary basis of an intelligent approach to the design of industrial equipment and proper choice of optimum working conditions. The purely em pirical approach to the solution of these problems does not afford satisfactory results, because the state of affairs in a high-inten sity acoustic field is complex and diversified. Many papers in the Soviet Union and abroad have been con cerned with the practical utilization of ultrasound, but the over whelming majority is limited to the solution of highly individual ized practical problems, usually under conditions that are not amenable to comparison. Systematic studies have been initiated in the Ultrasonics Section of the Acoustics Institute of the Academy of Sciences of the USSR on the physics of high-intensity ultrasonic waves and their effects on matter; the results of these studies form the basis of the present book.
Download or read book Fundamental Understanding of Bond Formation During Solid State Welding of Dissimilar Metals written by Sridharan, Niyanth S and published by . This book was released on 2016 with total page 157 pages. Available in PDF, EPUB and Kindle. Book excerpt: Dissimilar metal welds are used in a wide range of applications to effect light weighting and for corrosion resistance. While fusion welding techniques are limited in their ability to fabricate dissimilar metal welds, solid state welding techniques are limited in their ability to fabricate complex geometries with dissimilar metal combinations. Hence alternative techniques need to be explored to fabricate complex geometries with dissimilar metals welds in the solid state. Ultrasonic additive manufacturing in a solid state additive manufacturing process that combines ultrasonic welding with mechanized tape layering to fabricate dissimilar metal welds in the solid state. Though extensive feasibility studies have been performed to fabricate dissimilar metal welds using ultrasonic additive manufacturing, the fundamental mechanisms related to the bond formation mechanism are not fully understood. In this work multi scale characterization using scanning electron microscopy, electron backscatter diffraction, nano indentation and atom probe tomography was performed to rationalize the mechanism of bond formation in dissimilar metal welds. The fundamental questions that needed to be answered were 1. Is possible for a solid state bond to form with extensive plastic deformation occurring only on one metal in a dissimilar metal combination 2. The effect of plastic deformation on the oxide layer at the interface of dissimilar metal welds. To answer the above questions various dissimilar metal combinations (Steel-Ta) BCC-BCC, (Al-Ti) FCC-HCP, (Al-Steel) FCC-BCC were fabricated using ultrasonic additive manufacturing and characterized using the above-mentioned techniques. Bonded regions were characterized to study the role of plastic deformation by analyzing the micro texture developed at the interface. The general conclusion is the presence of a strong shear texture in the softer metal while the harder metal did not show any evidence of change in texture. To understand the effect of plastic deformation on the oxide dispersion atom probe tomography analysis was performed and the results indicate the possibility of oxide breakdown resulting in oxygen super saturation in the lattice. The bond formation is hypothesized to occur as a result of plastic deformation localized in the softer metal alone.
Download or read book Bond Formation in Ultrasonically Welded Aluminum Sheet Metal written by Daniel Edward Wilkosz and published by . This book was released on 2007 with total page 456 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Advances in Industrial and Production Engineering written by Kripa Shanker and published by Springer. This book was released on 2019-04-23 with total page 870 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book comprises select proceedings of the International Conference on Future Learning Aspects of Mechanical Engineering (FLAME 2018). The book discusses different topics of industrial and production engineering such as sustainable manufacturing systems, computer-aided engineering, rapid prototyping, manufacturing management and automation, metrology, manufacturing process optimization, casting, welding, machining, and machine tools. The contents of this book will be useful for researchers as well as professionals.
Download or read book Encyclopedia Of Packaging Materials Processes And Mechanics Set 1 Die attach And Wafer Bonding Technology A 4 volume Set written by and published by World Scientific. This book was released on 2019-08-27 with total page 1079 pages. Available in PDF, EPUB and Kindle. Book excerpt: Packaging materials, assembly processes, and the detailed understanding of multilayer mechanics have enabled much of the progress in miniaturization, reliability, and functional density achieved by modern electronic, microelectronic, and nanoelectronic products. The design and manufacture of miniaturized packages, providing low-loss electrical and/or optical communication, while protecting the semiconductor chips from environmental stresses and internal power cycling, require a carefully balanced selection of packaging materials and processes. Due to the relative fragility of these semiconductor chips, as well as the underlying laminated substrates and the bridging interconnect, selection of the packaging materials and processes is inextricably bound with the mechanical behavior of the intimately packaged multilayer structures, in all phases of development for traditional, as well as emerging, electronic product categories.The Encyclopedia of Packaging Materials, Processes, and Mechanics, compiled in 8, multi-volume sets, provides comprehensive coverage of the configurations and techniques, assembly materials and processes, modeling and simulation tools, and experimental characterization and validation techniques for electronic packaging. Each of the volumes presents the accumulated wisdom and shared perspectives of leading researchers and practitioners in the packaging of electronic components. The Encyclopedia of Packaging Materials, Processes, and Mechanics will provide the novice and student with a complete reference for a quick ascent on the packaging 'learning curve,' the practitioner with a validated set of techniques and tools to face every challenge in packaging design and development, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in the assembly and mechanical behavior of electronic and photonic components and systems. It will be most beneficial to undergraduate and graduate students studying materials, mechanical, electrical, and electronic engineering, with a strong interest in electronic packaging applications.
Download or read book Technology of Welding and Joining written by Tomasz Wegrzyn and published by MDPI. This book was released on 2021-06-22 with total page 196 pages. Available in PDF, EPUB and Kindle. Book excerpt: In this book, you will find information on new materials and new welding technologies. Problems related to the welding of difficult-to-weld materials are considered and solved. The latest welding technologies and processes are presented. This book provides an opportunity to learn about the latest trends and developments in the welding industry. Enjoy reading.
Download or read book Ultrasonics written by Dale Ensminger and published by CRC Press. This book was released on 2024-02-21 with total page 904 pages. Available in PDF, EPUB and Kindle. Book excerpt: Updated, revised, and restructured to reflect the latest advances in science and applications, the fourth edition of this best-selling industry and research reference covers the fundamental physical acoustics of ultrasonics and transducers, with a focus on piezoelectric and magnetostrictive modalities. It then discusses the full breadth of ultrasonics applications involving low power (sensing) and high power (processing) for research, industrial, and medical use. This book includes new content covering computer modeling used for acoustic and elastic wave phenomena, including scattering, mode conversion, transmission through layered media, Rayleigh and Lamb waves and flexural plates, modern horn design tools, Langevin transducers, and material characterization. There is more attention on process monitoring and advanced nondestructive testing and evaluation (NDT/NDE), including phased array ultrasound (PAUT), long-range inspection, using guided ultrasonic waves (GUW), internally rotary inspection systems (IRIS), time-of-flight diffraction (TOFD), and acoustic emission (AE). These methods are discussed and applied to both metals and nonmetals using illustrations in various industries, including now additionally for food and beverage products. The topics of defect sizing, capabilities, and limitations, including the probability of detection (POD), are introduced. Three chapters provide a new treatment of high-power ultrasonics, for both fluids and solids, and again, with examples of industrial engineering, food and beverage, pharmaceuticals, petrochemicals, and other process applications. Expanded coverage is given to medical and biological applications, covering diagnostics, therapy, and, at the highest powers, surgery. Key Features Provides an overview of fundamental analysis and transducer technologies needed to design and develop both measurement and processing systems Considers applications in material characterization and metrology Covers ultrasonic nondestructive testing and evaluation and high-power ultrasonics, which involves interactions that change the state of material Highlights medical and biomedical applications of ultrasound, focusing on the physical acoustics and the technology employed for diagnosis, therapy, surgery, and research This book is intended for both the undergraduate and graduate scientists and engineers, as well as the working professional, who seeks to understand the fundamentals together with a holistic treatment of the field of ultrasonics and its diversity of applications.
