Download or read book A Study in the Procedure of Electronic Products Reliability Through Quality Control written by Hsiang-Chiang Way and published by . This book was released on 1975 with total page 176 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Quality and Reliability of Technical Systems written by Alessandro Birolini and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 516 pages. Available in PDF, EPUB and Kindle. Book excerpt: High reliability, maintanability, and safety are expected fro complex equipment and systems. This book presents state-of-the-art methods and procedures used for cost and time effective quality and reliability assurance during the design and production of equipment and systems. It is based on more than 20 years experience gained by the author in research and industry. The book covers theory, practice, and management aspects and addresses the needs of scientists, system-oriented engineers, engineers in development and production and project and quality assurance managers. The second edition has been completely updated revised and includes modern concepts such as Total Quality Management (TQM) and Concurrent Engineering.
Download or read book Reliability and Failure of Electronic Materials and Devices written by Milton Ohring and published by Academic Press. This book was released on 2014-10-14 with total page 759 pages. Available in PDF, EPUB and Kindle. Book excerpt: Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer, and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects, and radiation damage. This new edition adds cutting-edge knowledge gained both in research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices. Covers all major types of electronics materials degradation and their causes, including dielectric breakdown, hot-electron effects, electrostatic discharge, corrosion, and failure of contacts and solder joints New updated sections on "failure physics," on mass transport-induced failure in copper and low-k dielectrics, and on reliability of lead-free/reduced-lead solder connections New chapter on testing procedures, sample handling and sample selection, and experimental design Coverage of new packaging materials, including plastics and composites
Download or read book Reliability Through Process Capability Studies written by G. O. Hawley and published by . This book was released on 1962 with total page 16 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Masters Theses in the Pure and Applied Sciences written by Wade H. Shafer and published by Springer Science & Business Media. This book was released on 2013-11-21 with total page 307 pages. Available in PDF, EPUB and Kindle. Book excerpt: Masters Theses in the Pure and Applied Sciences was first conceived, published, and dis· seminated by the Center for Information and Numerical Data Analysis and Synthesis (CINDAS) *at Purdue University in 1957, starting its coverage of theses with the academic year 1955. Beginning with Volume 13, the printing and dissemination phases of the ac· tivity were transferred to University Microfilms/Xerox of Ann Arbor, Michigan, with the thought that such an arrangement would be more beneficial to the academic and general scientific and technical community. After five years of this joint undertaking we had concluded that it was in the interest of all concerned if the printing and distribution of the volume were handled by an international publishing house to assure improved service and broader dissemination. Hence, starting with Volume 18, Masters Theses in the Pure and Applied Sciences has been disseminated on a worldwide basis by Plenum Publishing Corporation of New York, and in the same year the coverage was broadened to include Canadian universities. All back issues can also be ordered from Plenum. We have reported in Volume 20 (thesis year 1975) a total of 10,374 theses titles from 28 Canadian and 239 United States universities. We are sure that this broader base for theses titles reported will greatly enhance the value of this important annual reference work. The organization of Volume 20 is identical to that of past years. It consists of theses titles arranged by discipline and by university within each discipline.
Download or read book Reliability Abstracts and Technical Reviews written by United States. National Aeronautics and Space Administration. Office of Reliability and Quality Assurance and published by . This book was released on 1962 with total page 730 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Quality Control Reliability and Engineering Design written by Balbir S. Dhillon and published by CRC Press. This book was released on 1985-03-19 with total page 316 pages. Available in PDF, EPUB and Kindle. Book excerpt: For the first time in a single volume, quality control, reliability, and design engineers have a comprehensive overview of how each of their disciplines interact to achieve optimum product and/or project success. Thoroughly covering every stage of each phase, this outstanding reference provides detailed discussions of techniques and methods, ensuring cost-effective and time-saving procedures ... contains over 80 solved problems -- as well as numerous end-of-chapter exercises -- for reinforcement of essential material ... presents a complete, relevant mathematics chapter that eliminates the need to refer to other math texts ... offers self-contained chapters with introductions, summaries, and extensive references for quick, easy reading and additional study. Quality Control, Reliability, and Engineering Design is a key, on-the-job source for quality control, reliability, and design engineers and managers; system engineers and managers; and mechanical, electrical and electronic, industrial, and project engineers and managers. The book also serves as an ideal reference for professional seminars and in-house training programs, as well as for upper-level undergraduate and graduate courses in Quality Control, Reliability, Quality Control and Reliability, and Quality Control of Engineering Design. Book jacket.
Download or read book U S Government Research Reports written by and published by . This book was released on 1964 with total page 1310 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Practical Reliability Of Electronic Equipment And Products written by Eugene R. Hnatek and published by CRC Press. This book was released on 2002-10-25 with total page 472 pages. Available in PDF, EPUB and Kindle. Book excerpt: Examining numerous examples of highly sensitive products, this book reviews basic reliability mathematics, describes robust design practices, and discusses the process of selecting suppliers and components. He focuses on the specific issues of thermal management, electrostatic discharge, electromagnetic compatibility, printed wiring assembly, environmental stress testing, and failure analysis. The book presents methods for meeting the reliability goals established for the manufacture of electronic product hardware and addresses the development of reliable software. The appendix provides example guidelines for the derating of electrical and electromechanical components.
Download or read book Failure Analysis written by Marius Bazu and published by John Wiley & Sons. This book was released on 2011-03-08 with total page 372 pages. Available in PDF, EPUB and Kindle. Book excerpt: Failure analysis is the preferred method to investigate product or process reliability and to ensure optimum performance of electrical components and systems. The physics-of-failure approach is the only internationally accepted solution for continuously improving the reliability of materials, devices and processes. The models have been developed from the physical and chemical phenomena that are responsible for degradation or failure of electronic components and materials and now replace popular distribution models for failure mechanisms such as Weibull or lognormal. Reliability engineers need practical orientation around the complex procedures involved in failure analysis. This guide acts as a tool for all advanced techniques, their benefits and vital aspects of their use in a reliability programme. Using twelve complex case studies, the authors explain why failure analysis should be used with electronic components, when implementation is appropriate and methods for its successful use. Inside you will find detailed coverage on: a synergistic approach to failure modes and mechanisms, along with reliability physics and the failure analysis of materials, emphasizing the vital importance of cooperation between a product development team involved the reasons why failure analysis is an important tool for improving yield and reliability by corrective actions the design stage, highlighting the ‘concurrent engineering' approach and DfR (Design for Reliability) failure analysis during fabrication, covering reliability monitoring, process monitors and package reliability reliability resting after fabrication, including reliability assessment at this stage and corrective actions a large variety of methods, such as electrical methods, thermal methods, optical methods, electron microscopy, mechanical methods, X-Ray methods, spectroscopic, acoustical, and laser methods new challenges in reliability testing, such as its use in microsystems and nanostructures This practical yet comprehensive reference is useful for manufacturers and engineers involved in the design, fabrication and testing of electronic components, devices, ICs and electronic systems, as well as for users of components in complex systems wanting to discover the roots of the reliability flaws for their products.
Download or read book NASA SP 7500 written by United States. National Aeronautics and Space Administration and published by . This book was released on 1980 with total page 180 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Reliability of Electronic Components written by Titu I. Bajenescu and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 547 pages. Available in PDF, EPUB and Kindle. Book excerpt: This application-oriented professional book explains why components fail, addressing the needs of engineers who apply reliability principles in design, manufacture, testing and field service. A detailed index, a glossary, acronym lists, reliability dictionaries and a rich specific bibliography complete the book.
Download or read book Reliability Abstracts and Technical Reviews written by and published by . This book was released on 1966 with total page 556 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Reliability Technology written by Norman Pascoe and published by John Wiley & Sons. This book was released on 2011-03-08 with total page 420 pages. Available in PDF, EPUB and Kindle. Book excerpt: A unique book that describes the practical processes necessary to achieve failure free equipment performance, for quality and reliability engineers, design, manufacturing process and environmental test engineers. This book studies the essential requirements for successful product life cycle management. It identifies key contributors to failure in product life cycle management and particular emphasis is placed upon the importance of thorough Manufacturing Process Capability reviews for both in-house and outsourced manufacturing strategies. The readers? attention is also drawn to the many hazards to which a new product is exposed from the commencement of manufacture through to end of life disposal. Revolutionary in focus, as it describes how to achieve failure free performance rather than how to predict an acceptable performance failure rate (reliability technology rather than reliability engineering) Author has over 40 years experience in the field, and the text is based on classroom tested notes from the reliability technology course he taught at Massachusetts Institute of Technology (MIT), USA Contains graphical interpretations of mathematical models together with diagrams, tables of physical constants, case studies and unique worked examples
Download or read book A Quality Process Approach to Electronic System Reliability Handbook Procedure written by and published by . This book was released on 1993 with total page 196 pages. Available in PDF, EPUB and Kindle. Book excerpt: This handbook defines a new approach to reliability assurance and control based on principles of Total Quality Management. The new approach is process oriented with the elements of the process tailored to each DoD acquisition phase. The handbook provides, for each acquisition phase, a time phased description of all critical activities necessary for reduction and elimination of all potential product and process defects. For each critical activity, relevent inputs, outputs, customers and suppliers are defined. Elements required to attack all sources of defects are combined in the process with linkages across the diverse functional specialties required to implement a coordinated concurrent engineering process. Tracking metrics are recommended and defined for each DoD acquisition phase. The new process outlined in the handbook requires a pre-award supplier quality assessment. Volume II contains criteria and procedures for supplier quality assessment, certification and audit. The procedures parallel the highly accepted Malcolm Baldrige Award Criteria. They define a scoring system, a methodology and a set of detailed evaluation sheets with scoring instructions included. DoD Program Managers can use the handbook set for the construction of Requests For Proposals, Instructions to Offerors, Statements of Work, and Evaluation Criteria for electronic systems procurement. Reliability, Total quality management, Design process, Concurrent engineering, Integrated product development.
Download or read book Quality Conformance and Qualification of Microelectronic Packages and Interconnects written by Michael Pecht and published by John Wiley & Sons. This book was released on 1994-12-13 with total page 498 pages. Available in PDF, EPUB and Kindle. Book excerpt: All packaging engineers and technologists who want to ensure thatthey give their customers the highest quality, most cost-effectiveproducts should know that the paradigm has shifted. It has shiftedaway from the MIL-STDs and other government standards and testprocedures that don't cost-effectively address potential failuremechanisms or the manufacturing processes of the product. It hasshifted decisively towards tackling the root causes of failure andthe appropriate implementation of cost-effective process controls,qualityscreens, and tests. This book's groundbreaking, science-based approach to developingqualification and quality assurance programs helps engineers reacha new level of reliability in today's high-performancemicroelectronics. It does this with powerful... * Techniques for identifying and modeling failure mechanismsearlier in the design cycle, breaking the need to rely on fielddata * Physics-of-failure product reliability assessment methods thatcan be proactively implemented throughout the design andmanufacture of the product * Process controls that decrease variabilities in the end productand reduce end-of-line screening and testing A wide range of microelectronic package and interconnectconfigurations for both single-and multi-chip modules is examined,including chip and wire-bonds, tape-automated (TAB), flip-TAB,flip-chip bonds, high-density interconnects, chip-on-board designs(COB), MCM, 3-D stack, and many more. The remaining packageelements, such as die attachment, case and lid, leads, and lid andlead seals are also discussed in detail. The product of a distinguished team of authors and editors, thisbook's guidelines for avoiding potential high-risk manufacturingand qualification problems, as well as for implementing ongoingquality assurance, are sure to prove invaluable to both studentsand practicing professionals. For the professional engineer involved in the design andmanufacture of products containing electronic components, here is acomprehensive handbook to the theory and methods surrounding theassembly of microelectronic and electronic components. The bookfocuses on computers and consumer electronic products with internalsubsystems that reflect mechanical design constraints, costlimitations, and aesthetic and ergonomic concerns. Taking a totalsystem approach to packaging, the book systematically examines:basic chip and computer architecture; design and layout;interassembly and interconnections; cooling scheme; materialsselection, including ceramics, glasses, and metals; stress,vibration, and acoustics; and manufacturing and assemblytechnology. 1994 (0-471-53299-1) 800 pp. INTEGRATED CIRCUIT, HYBRID, AND MULTICHIP MODULE PACKAGE DESIGNGUIDELINES: A Focus on Reliability --Michael Pecht This comprehensive guide features a uniquely organized time-phasedapproach to design, development, qualification, manufacture, andin-service management. It provides step-by-step instructions on howto define realistic system requirements, define the system usageenvironment, identify potential failure modes, characterizematerials and processes by the key control label factors, and useexperiment, step-stress, and accelerated methods to ensure optimumdesign before production begins. Topics covered include: detaileddesign guidelines for substrate...wire and wire, tape automated,and flip-chip bonding...element attachment and case, lead, lead andlid seals--incorporating dimensional and geometric configurationsof package elements, manufacturing and assembly conditions,materials selection, and loading conditions. 1993 (0-471-59446-6)454 pp.
Download or read book Government Reports Announcements Index written by and published by . This book was released on 1976 with total page 256 pages. Available in PDF, EPUB and Kindle. Book excerpt:
