Download or read book 3rd IEEE International Conference on Design Test of Integrated Micro Nano Systems written by and published by . This book was released on 2021 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book 2006 International Conference on Design Test of Integrated Systems in Nanoscale Technology written by and published by Institute of Electrical & Electronics Engineers(IEEE). This book was released on 2006-01-01 with total page 447 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Computational Vision and Bio Inspired Computing written by S. Smys and published by Springer Nature. This book was released on 2022-03-30 with total page 877 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book includes selected papers from the 5th International Conference on Computational Vision and Bio Inspired Computing (ICCVBIC 2021), held in Coimbatore, India, during November 25–26, 2021. This book presents state-of-the-art research innovations in computational vision and bio-inspired techniques. The book reveals the theoretical and practical aspects of bio-inspired computing techniques, like machine learning, sensor-based models, evolutionary optimization and big data modeling and management that make use of effectual computing processes in the bio-inspired systems. It also contributes to the novel research that focuses on developing bio-inspired computing solutions for various domains, such as human–computer interaction, image processing, sensor-based single processing, recommender systems and facial recognition, which play an indispensable part in smart agriculture, smart city, biomedical and business intelligence applications.
Download or read book Physical Design for 3D Integrated Circuits written by Aida Todri-Sanial and published by CRC Press. This book was released on 2017-12-19 with total page 397 pages. Available in PDF, EPUB and Kindle. Book excerpt: Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology. The book begins by offering an overview of physical design challenges with respect to conventional 2D circuits, and then each chapter delivers an in-depth look at a specific physical design topic. This comprehensive reference: Contains extensive coverage of the physical design of 2.5D/3D ICs and monolithic 3D ICs Supplies state-of-the-art solutions for challenges unique to 3D circuit design Features contributions from renowned experts in their respective fields Physical Design for 3D Integrated Circuits provides a single, convenient source of cutting-edge information for those pursuing 2.5D/3D technology.
Download or read book 2008 3rd IEEE International Conference on Nano Micro Engineered and Molecular Systems Sanya China 6 9 January 2008 written by IEEE International Conference on Nano/Micro Engineered and Molecular Systems and published by . This book was released on 2008 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Design of Semiconductor QCA Systems written by Weiqiang Liu and published by Artech House. This book was released on 2013-10-01 with total page 253 pages. Available in PDF, EPUB and Kindle. Book excerpt: Integrated circuits have become smaller, cheaper, and more reliable and certainly have revolutionized the world of electronics. Integrated circuits are used in almost all electronic devices and systems, many of which, such as the Internet, computers, and mobile phones, have become essential parts of modern life and have changed the way we live. Quantum-dot cellular automata (QCA) provides a revolutionary approach to computing with device-to-device interactions. The design of a QCA circuit is radically different from a conventional digital design due to its unique characteristics at both the physical level and logic level. Research on both circuit architecture and device design is required for a profound understanding of QCA nanotechnologies. This detailed reference presents practical design aspects of QCA with an emphasis on developing real-world implementations.
Download or read book Designing TSVs for 3D Integrated Circuits written by Nauman Khan and published by Springer Science & Business Media. This book was released on 2012-09-22 with total page 82 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book explores the challenges and presents best strategies for designing Through-Silicon Vias (TSVs) for 3D integrated circuits. It describes a novel technique to mitigate TSV-induced noise, the GND Plug, which is superior to others adapted from 2-D planar technologies, such as a backside ground plane and traditional substrate contacts. The book also investigates, in the form of a comparative study, the impact of TSV size and granularity, spacing of C4 connectors, off-chip power delivery network, shared and dedicated TSVs, and coaxial TSVs on the quality of power delivery in 3-D ICs. The authors provide detailed best design practices for designing 3-D power delivery networks. Since TSVs occupy silicon real-estate and impact device density, this book provides four iterative algorithms to minimize the number of TSVs in a power delivery network. Unlike other existing methods, these algorithms can be applied in early design stages when only functional block- level behaviors and a floorplan are available. Finally, the authors explore the use of Carbon Nanotubes for power grid design as a futuristic alternative to Copper.
Download or read book 3rd International Conference on Micro and Nanosystems written by and published by . This book was released on 2010 with total page 476 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Electronic Design Automation for IC Implementation Circuit Design and Process Technology written by Luciano Lavagno and published by CRC Press. This book was released on 2017-02-03 with total page 893 pages. Available in PDF, EPUB and Kindle. Book excerpt: The second of two volumes in the Electronic Design Automation for Integrated Circuits Handbook, Second Edition, Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology thoroughly examines real-time logic (RTL) to GDSII (a file format used to transfer data of semiconductor physical layout) design flow, analog/mixed signal design, physical verification, and technology computer-aided design (TCAD). Chapters contributed by leading experts authoritatively discuss design for manufacturability (DFM) at the nanoscale, power supply network design and analysis, design modeling, and much more. New to This Edition: Major updates appearing in the initial phases of the design flow, where the level of abstraction keeps rising to support more functionality with lower non-recurring engineering (NRE) costs Significant revisions reflected in the final phases of the design flow, where the complexity due to smaller and smaller geometries is compounded by the slow progress of shorter wavelength lithography New coverage of cutting-edge applications and approaches realized in the decade since publication of the previous edition—these are illustrated by new chapters on 3D circuit integration and clock design Offering improved depth and modernity, Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology provides a valuable, state-of-the-art reference for electronic design automation (EDA) students, researchers, and professionals.
Download or read book Micro Nanosystems and Systems on Chips written by Alina Voda and published by John Wiley & Sons. This book was released on 2013-05-10 with total page 254 pages. Available in PDF, EPUB and Kindle. Book excerpt: Micro- and nanosystems represent an area of major scientific and technological opportunity and challenge, with actual and potential applications in almost all fields of human activity. The aim of this book is to present the central concepts of dynamic control systems (modeling, estimation, observation, identification, feedback control) and to show how they can be adapted and applied to the development of novel very small-scale systems and their associated human interfaces. The application fields presented here come from micro- and nano-robotics, biochips, near-field microscopy (AFM and STM) and nano-systems networks. Alina Voda has assembled contributions from leading experts at top research universities to produce the first overview of the major role that control systems science will play in the development of micro and nano-science and technologies.
Download or read book Design of 3D Integrated Circuits and Systems written by Rohit Sharma and published by CRC Press. This book was released on 2018-09-03 with total page 328 pages. Available in PDF, EPUB and Kindle. Book excerpt: Three-dimensional (3D) integration of microsystems and subsystems has become essential to the future of semiconductor technology development. 3D integration requires a greater understanding of several interconnected systems stacked over each other. While this vertical growth profoundly increases the system functionality, it also exponentially increases the design complexity. Design of 3D Integrated Circuits and Systems tackles all aspects of 3D integration, including 3D circuit and system design, new processes and simulation techniques, alternative communication schemes for 3D circuits and systems, application of novel materials for 3D systems, and the thermal challenges to restrict power dissipation and improve performance of 3D systems. Containing contributions from experts in industry as well as academia, this authoritative text: Illustrates different 3D integration approaches, such as die-to-die, die-to-wafer, and wafer-to-wafer Discusses the use of interposer technology and the role of Through-Silicon Vias (TSVs) Presents the latest improvements in three major fields of thermal management for multiprocessor systems-on-chip (MPSoCs) Explores ThruChip Interface (TCI), NAND flash memory stacking, and emerging applications Describes large-scale integration testing and state-of-the-art low-power testing solutions Complete with experimental results of chip-level 3D integration schemes tested at IBM and case studies on advanced complementary metal–oxide–semiconductor (CMOS) integration for 3D integrated circuits (ICs), Design of 3D Integrated Circuits and Systems is a practical reference that not only covers a wealth of design issues encountered in 3D integration but also demonstrates their impact on the efficiency of 3D systems.
Download or read book Micro and Nanoelectronics Devices Circuits and Systems written by Trupti Ranjan Lenka and published by Springer Nature. This book was released on 2022-09-12 with total page 519 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents select proceedings of the International Conference on Micro and Nanoelectronics Devices, Circuits and Systems (MNDCS-2022). The book includes cutting-edge research papers in the emerging fields of micro and nanoelectronics devices, circuits, and systems from experts working in these fields over the last decade. The book is a unique collection of chapters from different areas with a common theme and is immensely useful to academic researchers and practitioners in the industry who work in this field.
Download or read book Nano Micro Engineered and Molecular Systems 2008 NEMS 2008 3rd IEEE International Conference on written by and published by . This book was released on 2008 with total page 1236 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Energy Autonomous Micro and Nano Systems written by Marc Belleville and published by John Wiley & Sons. This book was released on 2012-12-17 with total page 247 pages. Available in PDF, EPUB and Kindle. Book excerpt: Providing a detailed overview of the fundamentals and latest developments in the field of energy autonomous microsystems, this book delivers an in-depth study of the applications in the fields of health and usage monitoring in aeronautics, medical implants, and home automation, drawing out the main specifications on such systems. Introductory information on photovoltaic, thermal and mechanical energy harvesting, and conversion, is given, along with the latest results in these fields. This book also provides a state of the art of ultra-low power sensor interfaces, digital signal processing and wireless communications. In addition, energy optimizations at the sensor node and sensors network levels are discussed, thus completing this overview. This book details the challenges and latest techniques available to readers who are interested in this field. A major strength of this book is that the first three chapters are application orientated and thus, by setting the landscape, introduce the technical chapters. There is also a good balance between the technical application, covering all the system-related aspects and, within each chapter, details on the physics, materials and technologies associated with electronics. Contents Introduction. Introduction to Energy Autonomous Micro and Nano Systems and Presentation of Contributions, Marc Belleville and Cyril Condemine. 1. Sensors at the Core of Building Control, Gilles Chabanis, Laurent Chiesi, Hynek Raisigel, Isabelle Ressejac and Véronique Boutin. 2. Toward Energy Autonomous MedicalImplants, Raymond Campagnolo and Daniel Kroiss. 3. Energy Autonomous Systems in Aeronautic Applications, Thomas Becker, Jirka Klaue and Martin Kluge. 4. Energy Harvesting by Photovoltaic Effect, Emmanuelle Rouvière, Simon Perraud, Cyril Condemine and Guy Waltisperger. 5. Mechanical Energy Harvesting, Ghislain Despesse, Jean Jacques Chaillout, Sébastien Boisseau and Claire Jean-Mistral. 6. Thermal Energy Harvesting, Tristan Caroff, Emmanuelle Rouvière and Jérôme Willemin. 7. Lithium Micro-Batteries, Raphaël Salot. 8. Ultra-Low-Power Sensors, Pascal Nouet, Norbert Dumas, Laurent Latorre and Frédérick Mailly. 9. Ultra-Low-Power Signal Processing in Autonomous Systems, Christian Piguet. 10. Ultra-Low-Power Radio Frequency Communications and Protocols, Eric Mercier. 11. Energy Management in an Autonomous Microsystem, Jean-Frédéric Christmann, Edith Beigne, Cyril Condemine, Jérôme Willemin and Christian Piguet. 12. Optimizing Energy Efficiency of Sensor Networks, Olivier Sentieys and Olivier Berder.
Download or read book VLSI Design written by Esteban Tlelo-Cuautle and published by BoD – Books on Demand. This book was released on 2012-01-20 with total page 306 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides some recent advances in design nanometer VLSI chips. The selected topics try to present some open problems and challenges with important topics ranging from design tools, new post-silicon devices, GPU-based parallel computing, emerging 3D integration, and antenna design. The book consists of two parts, with chapters such as: VLSI design for multi-sensor smart systems on a chip, Three-dimensional integrated circuits design for thousand-core processors, Parallel symbolic analysis of large analog circuits on GPU platforms, Algorithms for CAD tools VLSI design, A multilevel memetic algorithm for large SAT-encoded problems, etc.
Download or read book The 4th Annual IEEE International Conference on Nano Micro Engineered and Molecular Systems written by and published by . This book was released on 2009 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Handbook of 3D Integration Volume 4 written by Paul D. Franzon and published by John Wiley & Sons. This book was released on 2019-05-06 with total page 488 pages. Available in PDF, EPUB and Kindle. Book excerpt: This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective. Edited and authored by key contributors from top research institutions and high-tech companies, the first part of the book provides an overview of the latest developments in 3D chip design, including challenges and opportunities. The second part focuses on the test methods used to assess the quality and reliability of the 3D-integrated circuits, while the third and final part deals with thermal management and advanced cooling technologies and their integration.
