Download or read book Integrated Interconnect Technologies for 3D Nanoelectronic Systems written by Muhannad S. Bakir and published by Artech House. This book was released on 2008-11-30 with total page 551 pages. Available in PDF, EPUB and Kindle. Book excerpt: This cutting-edge book on off-chip technologies puts the hottest breakthroughs in high-density compliant electrical interconnects, nanophotonics, and microfluidics at your fingertips, integrating the full range of mathematics, physics, and technology issues together in a single comprehensive source. You get full details on state-of-the-art I/O interconnects and packaging, including mechanically compliant I/O approaches, fabrication, and assembly, followed by the latest advances and applications in power delivery design, analysis, and modeling. The book explores interconnect structures, materials, and packages for achieving high-bandwidth off-chip electrical communication, including optical interconnects and chip-to-chip signaling approaches, and brings you up to speed on CMOS integrated optical devices, 3D integration, wafer stacking technology, and through-wafer interconnects.
Download or read book Design for High Performance Low Power and Reliable 3D Integrated Circuits written by Sung Kyu Lim and published by Springer Science & Business Media. This book was released on 2012-11-27 with total page 573 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides readers with a variety of algorithms and software tools, dedicated to the physical design of through-silicon-via (TSV) based, three-dimensional integrated circuits. It describes numerous “manufacturing-ready” GDSII-level layouts of TSV-based 3D ICs developed with the tools covered in the book. This book will also feature sign-off level analysis of timing, power, signal integrity, and thermal analysis for 3D IC designs. Full details of the related algorithms will be provided so that the readers will be able not only to grasp the core mechanics of the physical design tools, but also to be able to reproduce and improve upon the results themselves. This book will also offer various design-for-manufacturability (DFM), design-for-reliability (DFR), and design-for-testability (DFT) techniques that are considered critical to the physical design process.
Download or read book Wireless Interface Technologies for 3D IC and Module Integration written by Tadahiro Kuroda and published by Cambridge University Press. This book was released on 2021-09-30 with total page 337 pages. Available in PDF, EPUB and Kindle. Book excerpt: Synthesising fifteen years of research, this authoritative text provides a comprehensive treatment of two major technologies for wireless chip and module interface design, covering technology fundamentals, design considerations and tradeoffs, practical implementation considerations, and discussion of practical applications in neural network, reconfigurable processors, and stacked SRAM. It explains the design principles and applications of two near-field wireless interface technologies for 2.5-3D IC and module integration respectively, and describes system-level performance benefits, making this an essential resource for researchers, professional engineers and graduate students performing research in next-generation wireless chip and module interface design.
Download or read book Design of 3D Integrated Circuits and Systems written by Rohit Sharma and published by CRC Press. This book was released on 2018-09-03 with total page 328 pages. Available in PDF, EPUB and Kindle. Book excerpt: Three-dimensional (3D) integration of microsystems and subsystems has become essential to the future of semiconductor technology development. 3D integration requires a greater understanding of several interconnected systems stacked over each other. While this vertical growth profoundly increases the system functionality, it also exponentially increases the design complexity. Design of 3D Integrated Circuits and Systems tackles all aspects of 3D integration, including 3D circuit and system design, new processes and simulation techniques, alternative communication schemes for 3D circuits and systems, application of novel materials for 3D systems, and the thermal challenges to restrict power dissipation and improve performance of 3D systems. Containing contributions from experts in industry as well as academia, this authoritative text: Illustrates different 3D integration approaches, such as die-to-die, die-to-wafer, and wafer-to-wafer Discusses the use of interposer technology and the role of Through-Silicon Vias (TSVs) Presents the latest improvements in three major fields of thermal management for multiprocessor systems-on-chip (MPSoCs) Explores ThruChip Interface (TCI), NAND flash memory stacking, and emerging applications Describes large-scale integration testing and state-of-the-art low-power testing solutions Complete with experimental results of chip-level 3D integration schemes tested at IBM and case studies on advanced complementary metal–oxide–semiconductor (CMOS) integration for 3D integrated circuits (ICs), Design of 3D Integrated Circuits and Systems is a practical reference that not only covers a wealth of design issues encountered in 3D integration but also demonstrates their impact on the efficiency of 3D systems.
Download or read book Designing TSVs for 3D Integrated Circuits written by Nauman Khan and published by Springer Science & Business Media. This book was released on 2012-09-22 with total page 82 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book explores the challenges and presents best strategies for designing Through-Silicon Vias (TSVs) for 3D integrated circuits. It describes a novel technique to mitigate TSV-induced noise, the GND Plug, which is superior to others adapted from 2-D planar technologies, such as a backside ground plane and traditional substrate contacts. The book also investigates, in the form of a comparative study, the impact of TSV size and granularity, spacing of C4 connectors, off-chip power delivery network, shared and dedicated TSVs, and coaxial TSVs on the quality of power delivery in 3-D ICs. The authors provide detailed best design practices for designing 3-D power delivery networks. Since TSVs occupy silicon real-estate and impact device density, this book provides four iterative algorithms to minimize the number of TSVs in a power delivery network. Unlike other existing methods, these algorithms can be applied in early design stages when only functional block- level behaviors and a floorplan are available. Finally, the authors explore the use of Carbon Nanotubes for power grid design as a futuristic alternative to Copper.
Download or read book Networks on Chips written by Fayez Gebali and published by CRC Press. This book was released on 2011-06-03 with total page 570 pages. Available in PDF, EPUB and Kindle. Book excerpt: The implementation of networks-on-chip (NoC) technology in VLSI integration presents a variety of unique challenges. To deal with specific design solutions and research hurdles related to intra-chip data exchange, engineers are challenged to invoke a wide range of disciplines and specializations while maintaining a focused approach. Leading Researchers Present Cutting-Edge Designs Tools Networks-on-Chips: Theory and Practice facilitates this process, detailing the NoC paradigm and its benefits in separating IP design and functionality from chip communication requirements and interfacing. It starts with an analysis of 3-D NoC architectures and progresses to a discussion of NoC resource allocation, processor traffic modeling, and formal verification, with an examination of protocols at different layers of abstraction. An exploration of design methodologies, CAD tool development, and system testing, as well as communication protocol, the text highlights important emerging research issues, such as Resource Allocation for Quality of Service (QoS) on-chip communication Testing, verification, and network design methodologies Architectures for interconnection, real-time monitoring, and security requirements Networks-on-Chip Protocols Presents a flexible MPSoC platform to easily implement multimedia applications and evaluate future video encoding standards This useful guide tackles power and energy issues in NoC-based designs, addressing the power constraints that currently limit the embedding of more processing elements on a single chip. It covers traffic modeling and discusses the details of traffic generators. Using unique case studies and examples, it covers theoretical and practical issues, guiding readers through every phase of system design.
Download or read book 3D Integration for VLSI Systems written by Chuan Seng Tan and published by CRC Press. This book was released on 2016-04-19 with total page 376 pages. Available in PDF, EPUB and Kindle. Book excerpt: Three-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC) as the conventional scaling approach is faced with unprecedented challenges in fundamental and economic limits. Wafer level 3D IC can take several forms, and they usually include a stack of several thinned IC layers th
Download or read book More than Moore Technologies for Next Generation Computer Design written by Rasit O. Topaloglu and published by Springer. This book was released on 2015-02-09 with total page 225 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides a comprehensive overview of key technologies being used to address challenges raised by continued device scaling and the extending gap between memory and central processing unit performance. Authors discuss in detail what are known commonly as “More than Moore” (MtM), technologies, which add value to devices by incorporating functionalities that do not necessarily scale according to “Moore's Law”. Coverage focuses on three key technologies needed for efficient power management and cost per performance: novel memories, 3D integration and photonic on-chip interconnect.
Download or read book CMOSET 2014 Abstracts written by CMOS Emerging Technologies Research and published by CMOS Emerging Technologies. This book was released on 2014-03-26 with total page 63 pages. Available in PDF, EPUB and Kindle. Book excerpt: A collection of abstracts for talks presented at the 2014 CMOS Emerging Technologies Research Symposium in Grenoble, France, July 6-8, 2014. The CMOS Emerging Technologies Research Symposium is a research and business event for those who want to discuss and find out about new exciting high tech opportunities. The conference provides researchers, companies and academic institutions with a platform for showcasing their technology, innovations, products and services. By bringing together people from all areas of the high tech arena, we create a stimulating common ground for exploring collaborations and encouraging discussions on emerging technologies.
Download or read book Three Dimensional System Integration written by Antonis Papanikolaou and published by Springer Science & Business Media. This book was released on 2010-12-07 with total page 251 pages. Available in PDF, EPUB and Kindle. Book excerpt: Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream technology a few years from now, less than 10-15 years from its original conception. To achieve this type of end product, changes in the entire manufacturing and design process of electronic systems are taking place. This book provides readers with an accessible tutorial on a broad range of topics essential to the non-expert in 3D System Integration. It is an invaluable resource for anybody in need of an overview of the 3D manufacturing and design chain.
Download or read book Wafer Level 3 D ICs Process Technology written by Chuan Seng Tan and published by Springer Science & Business Media. This book was released on 2009-06-29 with total page 365 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses the technology platform for pre-packaging wafer lever 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging. This is an edited book based on chapters contributed by various experts in the field of wafer-level 3-D ICs process technology. They are from academia, research labs and industry.
Download or read book Three Dimensional Integrated Circuit Design written by Yuan Xie and published by Springer Science & Business Media. This book was released on 2009-12-02 with total page 292 pages. Available in PDF, EPUB and Kindle. Book excerpt: We live in a time of great change. In the electronics world, the last several decades have seen unprecedented growth and advancement, described by Moore’s law. This observation stated that transistor density in integrated circuits doubles every 1. 5–2 years. This came with the simultaneous improvement of individual device perf- mance as well as the reduction of device power such that the total power of the resulting ICs remained under control. No trend remains constant forever, and this is unfortunately the case with Moore’s law. The trouble began a number of years ago when CMOS devices were no longer able to proceed along the classical scaling trends. Key device parameters such as gate oxide thickness were simply no longer able to scale. As a result, device o- state currents began to creep up at an alarming rate. These continuing problems with classical scaling have led to a leveling off of IC clock speeds to the range of several GHz. Of course, chips can be clocked higher but the thermal issues become unmanageable. This has led to the recent trend toward microprocessors with mul- ple cores, each running at a few GHz at the most. The goal is to continue improving performance via parallelism by adding more and more cores instead of increasing speed. The challenge here is to ensure that general purpose codes can be ef?ciently parallelized. There is another potential solution to the problem of how to improve CMOS technology performance: three-dimensional integrated circuits (3D ICs).
Download or read book Nano Interconnects written by Afreen Khursheed and published by CRC Press. This book was released on 2021-12-23 with total page 187 pages. Available in PDF, EPUB and Kindle. Book excerpt: This textbook comprehensively covers on-chip interconnect dimension and application of carbon nanomaterials for modeling VLSI interconnect and buffer circuits. It provides analysis of ultra-low power high speed nano-interconnects based on different facets such as material modeling, circuit modeling and the adoption of repeater insertion strategies and measurement techniques. It covers important topics including on-chip interconnects, interconnect modeling, electrical impedance modeling of on-chip interconnects, modeling of repeater buffer and variability analysis. Pedagogical features including solved problems and unsolved exercises are interspersed throughout the text for better understanding. Aimed at senior undergraduate and graduate students in the field of electrical engineering, electronics and communications engineering for courses on Advanced VLSI Interconnects/Advanced VLSI Design/VLSI Interconnects/VLSI Design Automation and Techniques, this book: Provides comprehensive coverage of fundamental concepts related to nanotube transistors and interconnects. Discusses properties and performance of practical nanotube devices and related applications. Covers physical and electrical phenomena of carbon nanotubes, as well as applications enabled by this nanotechnology. Discusses the structure, properties, and characteristics of graphene-based on-chip interconnect. Examines interconnect power and interconnect delay issues arising due to downscaling of device size.
Download or read book Digital Enterprise Technology written by Pedro Filipe Cunha and published by Springer Science & Business Media. This book was released on 2007-09-18 with total page 599 pages. Available in PDF, EPUB and Kindle. Book excerpt: The first Digital Enterprise Technology (DET) International Conference was held in Durham, UK in 2002 and the second DET Conference in Seattle, USA in 2004. Sponsored by CIRP (College International pour la Recherche en Productique), the third DET Conference took place in Setúbal, Portugal in 2006. Digital Enterprise Technology: Perspectives and Future Challenges is an edited volume based on this conference. Topics include: distributed and collaborative design, process modeling and process planning, advanced factory equipment and layout design and modeling, physical-to-digital environment integrators, enterprise integration technologies, and entrepreneurship in DET.
Download or read book Through Silicon Vias written by Brajesh Kumar Kaushik and published by CRC Press. This book was released on 2016-11-30 with total page 232 pages. Available in PDF, EPUB and Kindle. Book excerpt: Recent advances in semiconductor technology offer vertical interconnect access (via) that extend through silicon, popularly known as through silicon via (TSV). This book provides a comprehensive review of the theory behind TSVs while covering most recent advancements in materials, models and designs. Furthermore, depending on the geometry and physical configurations, different electrical equivalent models for Cu, carbon nanotube (CNT) and graphene nanoribbon (GNR) based TSVs are presented. Based on the electrical equivalent models the performance comparison among the Cu, CNT and GNR based TSVs are also discussed.
Download or read book Handbook of Signal Processing Systems written by Shuvra S. Bhattacharyya and published by Springer Science & Business Media. This book was released on 2010-09-10 with total page 1099 pages. Available in PDF, EPUB and Kindle. Book excerpt: It gives me immense pleasure to introduce this timely handbook to the research/- velopment communities in the ?eld of signal processing systems (SPS). This is the ?rst of its kind and represents state-of-the-arts coverage of research in this ?eld. The driving force behind information technologies (IT) hinges critically upon the major advances in both component integration and system integration. The major breakthrough for the former is undoubtedly the invention of IC in the 50’s by Jack S. Kilby, the Nobel Prize Laureate in Physics 2000. In an integrated circuit, all components were made of the same semiconductor material. Beginning with the pocket calculator in 1964, there have been many increasingly complex applications followed. In fact, processing gates and memory storage on a chip have since then grown at an exponential rate, following Moore’s Law. (Moore himself admitted that Moore’s Law had turned out to be more accurate, longer lasting and deeper in impact than he ever imagined. ) With greater device integration, various signal processing systems have been realized for many killer IT applications. Further breakthroughs in computer sciences and Internet technologies have also catalyzed large-scale system integration. All these have led to today’s IT revolution which has profound impacts on our lifestyle and overall prospect of humanity. (It is hard to imagine life today without mobiles or Internets!) The success of SPS requires a well-concerted integrated approach from mul- ple disciplines, such as device, design, and application.
Download or read book Advanced Materials and Technologies for Micro Nano Devices Sensors and Actuators written by Evgeni Gusev and published by Springer. This book was released on 2010-03-03 with total page 310 pages. Available in PDF, EPUB and Kindle. Book excerpt: A NATO Advanced Research Workshop (ARW) entitled “Advanced Materials and Technologies for Micro/Nano Devices, Sensors and Actuators” was held in St. Petersburg, Russia, from June 29 to July 2, 2009. The main goal of the Workshop was to examine (at a fundamental level) the very complex scientific issues that pertain to the use of micro- and nano-electromechanical systems (MEMS and NEMS), devices and technologies in next generation commercial and defen- related applications. Micro- and nano-electromechanical systems represent rather broad and diverse technological areas, such as optical systems (micromirrors, waveguides, optical sensors, integrated subsystems), life sciences and lab equipment (micropumps, membranes, lab-on-chip, membranes, microfluidics), sensors (bio-sensors, chemical sensors, gas-phase sensors, sensors integrated with electronics) and RF applications for signal transmission (variable capacitors, tunable filters and antennas, switches, resonators). From a scientific viewpoint, this is a very multi-disciplinary field, including micro- and nano-mechanics (such as stresses in structural materials), electronic effects (e. g. charge transfer), general electrostatics, materials science, surface chemistry, interface science, (nano)tribology, and optics. It is obvious that in order to overcome the problems surrounding next-generation MEMS/NEMS devices and applications it is necessary to tackle them from different angles: theoreticians need to speak with mechanical engineers, and device engineers and modelers to listen to surface physicists. It was therefore one of the main objectives of the workshop to bring together a multidisciplinary team of distinguished researchers.
