Download or read book 3D IC and RF SiPs Advanced Stacking and Planar Solutions for 5G Mobility written by Lih-Tyng Hwang and published by John Wiley & Sons. This book was released on 2018-03-28 with total page 464 pages. Available in PDF, EPUB and Kindle. Book excerpt: An interdisciplinary guide to enabling technologies for 3D ICs and 5G mobility, covering packaging, design to product life and reliability assessments Features an interdisciplinary approach to the enabling technologies and hardware for 3D ICs and 5G mobility Presents statistical treatments and examples with tools that are easily accessible, such as Microsoft’s Excel and Minitab Fundamental design topics such as electromagnetic design for logic and RF/passives centric circuits are explained in detail Provides chapter-wise review questions and powerpoint slides as teaching tools

Download or read book Advanced Nanoscale MOSFET Architectures written by Kalyan Biswas and published by John Wiley & Sons. This book was released on 2024-07-03 with total page 340 pages. Available in PDF, EPUB and Kindle. Book excerpt: Comprehensive reference on the fundamental principles and basic physics dictating metal–oxide–semiconductor field-effect transistor (MOSFET) operation Advanced Nanoscale MOSFET Architectures provides an in-depth review of modern metal–oxide–semiconductor field-effect transistor (MOSFET) device technologies and advancements, with information on their operation, various architectures, fabrication, materials, modeling and simulation methods, circuit applications, and other aspects related to nanoscale MOSFET technology. The text begins with an introduction to the foundational technology before moving on to describe challenges associated with the scaling of nanoscale devices. Other topics covered include device physics and operation, strain engineering for highly scaled MOSFETs, tunnel FET, graphene based field effect transistors, and more. The text also compares silicon bulk and devices, nanosheet transistors and introduces low-power circuit design using advanced MOSFETs. Additional topics covered include: High-k gate dielectrics and metal gate electrodes for multi-gate MOSFETs, covering gate stack processing and metal gate modification Strain engineering in 3D complementary metal-oxide semiconductors (CMOS) and its scaling impact, and strain engineering in silicon–germanium (SiGe) FinFET and its challenges and future perspectives TCAD simulation of multi-gate MOSFET, covering model calibration and device performance for analog and RF applications Description of the design of an analog amplifier circuit using digital CMOS technology of SCL for ultra-low power VLSI applications Advanced Nanoscale MOSFET Architectures helps readers understand device physics and design of new structures and material compositions, making it an important resource for the researchers and professionals who are carrying out research in the field, along with students in related programs of study.

Download or read book Heterogeneous Integrations written by John H. Lau and published by Springer. This book was released on 2019-04-03 with total page 368 pages. Available in PDF, EPUB and Kindle. Book excerpt: Heterogeneous integration uses packaging technology to integrate dissimilar chips, LED, MEMS, VCSEL, etc. from different fabless houses and with different functions and wafer sizes into a single system or subsystem. How are these dissimilar chips and optical components supposed to talk to each other? The answer is redistribution layers (RDLs). This book addresses the fabrication of RDLs for heterogeneous integrations, and especially focuses on RDLs on: A) organic substrates, B) silicon substrates (through-silicon via (TSV)-interposers), C) silicon substrates (bridges), D) fan-out substrates, and E) ASIC, memory, LED, MEMS, and VCSEL systems. The book offers a valuable asset for researchers, engineers, and graduate students in the fields of semiconductor packaging, materials sciences, mechanical engineering, electronic engineering, telecommunications, networking, etc.

Download or read book Antenna in Package Technology and Applications written by Duixian Liu and published by John Wiley & Sons. This book was released on 2020-03-31 with total page 416 pages. Available in PDF, EPUB and Kindle. Book excerpt: A comprehensive guide to antenna design, manufacturing processes, antenna integration, and packaging Antenna-in-Package Technology and Applications contains an introduction to the history of AiP technology. It explores antennas and packages, thermal analysis and design, as well as measurement setups and methods for AiP technology. The authors—well-known experts on the topic—explain why microstrip patch antennas are the most popular and describe the myriad constraints of packaging, such as electrical performance, thermo-mechanical reliability, compactness, manufacturability, and cost. The book includes information on how the choice of interconnects is governed by JEDEC for automatic assembly and describes low-temperature co-fired ceramic, high-density interconnects, fan-out wafer level packaging–based AiP, and 3D-printing-based AiP. The book includes a detailed discussion of the surface laminar circuit–based AiP designs for large-scale mm-wave phased arrays for 94-GHz imagers and 28-GHz 5G New Radios. Additionally, the book includes information on 3D AiP for sensor nodes, near-field wireless power transfer, and IoT applications. This important book: • Includes a brief history of antenna-in-package technology • Describes package structures widely used in AiP, such as ball grid array (BGA) and quad flat no-leads (QFN) • Explores the concepts, materials and processes, designs, and verifications with special consideration for excellent electrical, mechanical, and thermal performance Written for students in electrical engineering, professors, researchers, and RF engineers, Antenna-in-Package Technology and Applications offers a guide to material selection for antennas and packages, antenna design with manufacturing processes and packaging constraints, antenna integration, and packaging.

Download or read book OFDM Baseband Receiver Design for Wireless Communications written by Tzi-Dar Chiueh and published by John Wiley & Sons. This book was released on 2008-04-15 with total page 278 pages. Available in PDF, EPUB and Kindle. Book excerpt: Orthogonal frequency-division multiplexing (OFDM) access schemes are becoming more prevalent among cellular and wireless broadband systems, accelerating the need for smaller, more energy efficient receiver solutions. Up to now the majority of OFDM texts have dealt with signal processing aspects. To address the current gap in OFDM integrated circuit (IC) instruction, Chiueh and Tsai have produced this timely text on baseband design. OFDM Baseband Receiver Design for Wireless Communications covers the gamut of OFDM technology, from theories and algorithms to architectures and circuits. Chiueh and Tsai give a concise yet comprehensive look at digital communications fundamentals before explaining modulation and signal processing algorithms in OFDM receivers. Moreover, the authors give detailed treatment of hardware issues -- from design methodology to physical IC implementation. Closes the gap between OFDM theory and implementation Enables the reader to transfer communication receiver concepts into hardware design wireless receivers with acceptable implementation loss achieve low-power designs Contains numerous figures to illustrate techniques Features concrete design examples of MC-CDMA systems and cognitive radio applications Presents theoretical discussions that focus on concepts rather than mathematical derivation Provides a much-needed single source of material from numerous papers Based on course materials for a class in digital communication IC design, this book is ideal for advanced undergraduate or post-graduate students from either VLSI design or signal processing backgrounds. New and experienced engineers in industry working on algorithms or hardware for wireless communications devices will also find this book to be a key reference.

Download or read book Baseband Receiver Design for Wireless MIMO OFDM Communications written by Tzi-Dar Chiueh and published by John Wiley & Sons. This book was released on 2012-04-24 with total page 388 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Second Edition of OFDM Baseband Receiver Design for Wirless Communications, this book expands on the earlier edition with enhanced coverage of MIMO techniques, additional baseband algorithms, and more IC design examples. The authors cover the full range of OFDM technology, from theories and algorithms to architectures and circuits. The book gives a concise yet comprehensive look at digital communication fundamentals before explaining signal processing algorithms in receivers. The authors give detailed treatment of hardware issues - from architecture to IC implementation. Links OFDM and MIMO theory with hardware implementation Enables the reader to transfer communication received concepts into hardware; design wireless receivers with acceptable implemntation loss; achieve low-power designs Covers the latest standards, such as DVB-T2, WiMax, LTE and LTE-A Includes more baseband algorithms, like soft-decoding algorithms such as BCJR and SOVA Expanded treatment of channel models, detection algorithms and MIMO techniques Features concrete design examples of WiMAX systems and cognitive radio apllications Companion website with lecture slides for instructors Based on materials developed for a course in digital communication IC design, this book is ideal for graduate students and researchers in VLSI design, wireless communications, and communications signal processing. Practicing engineers working on algorithms or hardware for wireless communications devices will also find this to be a key reference.

Download or read book Microelectronics Electromagnetics and Telecommunications written by P. Satish Rama Chowdary and published by Springer Nature. This book was released on 2020-06-24 with total page 762 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book discusses the latest developments and outlines future trends in the fields of microelectronics, electromagnetics and telecommunication. It includes original research presented at the International Conference on Microelectronics, Electromagnetics and Telecommunication (ICMEET 2019), organized by the Department of ECE, Raghu Institute of Technology, Andhra Pradesh, India. Written by scientists, research scholars and practitioners from leading universities, engineering colleges and R&D institutes around the globe, the papers share the latest breakthroughs in and promising solutions to the most important issues facing today’s society.

Download or read book Integrated Circuits microchips written by Kim Ho Yeap and published by . This book was released on 2020 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Analysis and Design of Transmitarray Antennas written by Ahmed H. Abdelrahman and published by Springer Nature. This book was released on 2022-06-01 with total page 151 pages. Available in PDF, EPUB and Kindle. Book excerpt: In recent years, transmitarray antennas have attracted growing interest with many antenna researchers. Transmitarrays combines both optical and antenna array theory, leading to a low profile design with high gain, high radiation efficiency, and versatile radiation performance for many wireless communication systems. In this book, comprehensive analysis, new methodologies, and novel designs of transmitarray antennas are presented. Detailed analysis for the design of planar space-fed array antennas is presented. The basics of aperture field distribution and the analysis of the array elements are described. The radiation performances (directivity and gain) are discussed using array theory approach, and the impacts of element phase errors are demonstrated. The performance of transmitarray design using multilayer frequency selective surfaces (M-FSS) approach is carefully studied, and the transmission phase limit which are generally independent from the selection of a specific element shape is revealed. The maximum transmission phase range is determined based on the number of layers, substrate permittivity, and the separations between layers. In order to reduce the transmitarray design complexity and cost, three different methods have been investigated. As a result, one design is performed using quad-layer cross-slot elements with no dielectric material and another using triple-layer spiral dipole elements. Both designs were fabricated and tested at X-Band for deep space communications. Furthermore, the radiation pattern characteristics were studied under different feed polarization conditions and oblique angles of incident field from the feed. New design methodologies are proposed to improve the bandwidth of transmitarray antennas through the control of the transmission phase range of the elements. These design techniques are validated through the fabrication and testing of two quad-layer transmitarray antennas at Ku-band. A single-feed quad-beam transmitarray antenna with 50 degrees elevation separation between the beams is investigated, designed, fabricated, and tested at Ku-band. In summary, various challenges in the analysis and design of transmitarray antennas are addressed in this book. New methodologies to improve the bandwidth of transmitarray antennas have been demonstrated. Several prototypes have been fabricated and tested, demonstrating the desirable features and potential new applications of transmitarray antennas.

Download or read book Advances in Communication Devices and Networking written by Rabindranath Bera and published by Springer. This book was released on 2018-05-23 with total page 952 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book provides insights of International Conference in Communication, Devices and Networking (ICCDN 2017) organized by the Department of Electronics and Communication Engineering, Sikkim Manipal Institute of Technology, Sikkim, India during 3 – 4 June, 2017. The book discusses latest research papers presented by researchers, engineers, academicians and industry professionals. It also assists both novice and experienced scientists and developers, to explore newer scopes, collect new ideas and establish new cooperation between research groups and exchange ideas, information, techniques and applications in the field of electronics, communication, devices and networking.

Download or read book Flip Chip Technologies written by John H. Lau and published by McGraw-Hill Professional Publishing. This book was released on 1996 with total page 600 pages. Available in PDF, EPUB and Kindle. Book excerpt: A guide to flip chip technologies, for professionals in flip chip and MCM research and development, and for engineers and technical managers choosing design and manufacturing processes for electronic packaging and interconnect systems. Discusses economic, design, material, quality, and reliability issues of flip chip technologies, and details aspects of classical solder-bumped flip chip interconnect technologies; the next generations of flip chip technologies; and known-good-die testing for multiple module applications. Annotation copyright by Book News, Inc., Portland, OR

Download or read book Low Power Design Essentials written by Jan Rabaey and published by Springer Science & Business Media. This book was released on 2009-04-21 with total page 371 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book contains all the topics of importance to the low power designer. It first lays the foundation and then goes on to detail the design process. The book also discusses such special topics as power management and modal design, ultra low power, and low power design methodology and flows. In addition, coverage includes projections of the future and case studies.

Download or read book 3D Microelectronic Packaging written by Yan Li and published by Springer Nature. This book was released on 2020-11-23 with total page 629 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging. It provides readers an in-depth understanding of the latest research and development findings regarding this key industry trend, including TSV, die processing, micro-bumps for LMI and MMI, direct bonding and advanced materials, as well as quality, reliability, fault isolation, and failure analysis for 3D microelectronic packages. Images, tables, and didactic schematics are used to illustrate and elaborate on the concepts discussed. Readers will gain a general grasp of 3D packaging, quality and reliability concerns, and common causes of failure, and will be introduced to developing areas and remaining gaps in 3D packaging that can help inspire future research and development.

Download or read book Applications in Electronics Pervading Industry Environment and Society written by Sergio Saponara and published by Springer Nature. This book was released on 2020-03-20 with total page 524 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides a thorough overview of cutting-edge research on electronics applications relevant to industry, the environment, and society at large. It covers a broad spectrum of application domains, from automotive to space and from health to security, while devoting special attention to the use of embedded devices and sensors for imaging, communication and control. The book is based on the 2019 ApplePies Conference, held in Pisa, Italy in September 2019, which brought together researchers and stakeholders to consider the most significant current trends in the field of applied electronics and to debate visions for the future. Areas addressed by the conference included information communication technology; biotechnology and biomedical imaging; space; secure, clean and efficient energy; the environment; and smart, green and integrated transport. As electronics technology continues to develop apace, constantly meeting previously unthinkable targets, further attention needs to be directed toward the electronics applications and the development of systems that facilitate human activities. This book, written by industrial and academic professionals, represents a valuable contribution in this endeavor.

Download or read book More than Moore written by Guo Qi Zhang and published by Springer Science & Business Media. This book was released on 2010-01-23 with total page 338 pages. Available in PDF, EPUB and Kindle. Book excerpt: In the past decades, the mainstream of microelectronics progression was mainly powered by Moore's law focusing on IC miniaturization down to nano scale. However, there is a fast increasing need for "More than Moore" (MtM) products and technology that are based upon or derived from silicon technologies, but do not simply scale with Moore’s law. This book provides new vision, strategy and guidance for the future technology and business development of micro/nanoelectronics.

Download or read book Encyclopedia of Thermal Packaging Set 1 Thermal Packaging Techniques a 6 Volume Set written by Avram Bar-Cohen and published by World Scientific. This book was released on 2012-02-01 with total page 1582 pages. Available in PDF, EPUB and Kindle. Book excerpt: Packaging, the physical design and implementation of electronic systems is responsible for much of the progress in miniaturization, reliability and functional density achieved by the full range of electronic, microelectronic and nanoelectronic products during the past several decades. The inherent inefficiency of electronic devices and their sensitivity to heat have placed thermal management on the critical path of nearly every organization dealing with traditional electronic product development, as well as emerging, product categories. Successful thermal packaging is the key differentiator in electronic products, as diverse as supercomputers and cell phones, and continues to be of critical importance in the refinement of traditional products and in the development of products for new applications.The Encyclopedia of Thermal Packaging, compiled into four 5-volume sets (Thermal Packaging Techniques, Thermal Packaging Configurations, Thermal Packaging Tools and Thermal Packaging Applications), will provide comprehensive, one-stop treatment of the techniques, configurations, tools and applications of electronic thermal packaging. Each volume in a set comprises 250–350 pages and is written by world experts in thermal management of electronics.

Download or read book Innovative and Emerging Technologies for Textile Dyeing and Finishing written by Luqman Jameel Rather and published by John Wiley & Sons. This book was released on 2021-02-17 with total page 432 pages. Available in PDF, EPUB and Kindle. Book excerpt: With the public enhanced awareness towards eco-preservation, eco-safety and health concerns, environmentally benign, nontoxic and sustainable bioresource materials produced mainly from non-food crops have revolutionized all industrial sectors particularly textile industry. In recent years, textile industries in developed countries are getting increasing interest in global interest due to the varied and changing world market conditions in terms of price, durability and fiber mixtures as well as design, colors, weight, ease of handling and product safety. The increasing environmental and health concerns owing to the use of large quantities of water and hazardous chemicals in conventional textile finishing processes lead to the design and development of new dyeing strategies and technologies. Effluents produced from these textiles wet processing industries are very diverse in chemical composition, ranging from inorganic finishing agents, surfactants, chlorine compounds, salts, total phosphate to polymers and organic products. This aspect forced western countries to exploit their high technical skills in the advancements of textile materials for high quality technical performances, and development of cleaner production technologies for cost effective and value-added textile materials. Therefore, vast and effective research investigations have been undertaken all over the world to minimize the negative environmental impact of synthetic chemical agents through the sustainable harvest of eco-friendly bioresource materials. The book will discuss following research developments in academic and industry: Improvement in dye extraction and its applications Impact of textile dyeing on environment Textile finishing by natural and ecofriendly means Natural dyes as environmental-friendly bioresource products Textile effluent remediation via physical, chemical and biological processes.