EBookClubs

Read Books & Download eBooks Full Online

EBookClubs

Read Books & Download eBooks Full Online

Book 2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits  IPFA

Download or read book 2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits IPFA written by IEEE Staff and published by . This book was released on 2022-07-18 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: The 29th edition of the IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2022) be held in person as a physical conference at the iconic Marina Bay Sands, Singapore from 18 21 July 2022 IPFA will continue to focus on the fundamental understanding of the electrical and physical characterization techniques and associated technologies that assist in probing the nature of wear out and failure in conventional and new CMOS devices, in turn resulting in improved knowhow of the physics of device circuit module failure that serves as critical input for future design for reliability We are also soliciting submissions in new and upcoming research areas including failure analysis for hardware security, reliability and failure analysis of power electronics, photovoltaic technologies, 2D Nanodevices and applications of machine learning and artificial intelligence to the field of failure analysis and reliability assessments

Book 2021 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits  IPFA

Download or read book 2021 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits IPFA written by IEEE Staff and published by . This book was released on 2021-09-15 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: The 28th edition of the IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2021) will be held virtually for a month (with a half day live keynote session) from mid September to mid October IPFA will continue to focus on the fundamental understanding of the electrical and physical characterization techniques and associated technologies that assist in probing the nature of wear out and failure in conventional and new CMOS devices, in turn resulting in improved knowhow of the physics of device circuit module failure that serves as critical input for future design for reliability We are also soliciting submissions in new and upcoming areas of research that include failure analysis for hardware security, reliability and failure analysis of power electronics, photovoltaic technologies as well as 2D Nanodevices and applications of machine learning and artificial intelligence to the field of failure analysis and reliability assessment

Book 2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits  IPFA

Download or read book 2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits IPFA written by IEEE Staff and published by . This book was released on 2016-07-18 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: IPFA is devoted to the fundamental understanding of the physical mechanisms of semiconductor device failures and issues related to semiconductor device reliability, yield and performance, especially those related to advanced process technologies

Book 2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits  IPFA

Download or read book 2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits IPFA written by IEEE Staff and published by . This book was released on 2018-07-16 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: IPFA 2018 is devoted to the fundamental understanding of the electrical and physical characterization techniques and associated technologies that assist in probing the nature of wear out and failure in conventional and new CMOS devices, in turn resulting in improved knowhow of the physics of device circuit module failure that serves as critical input for future design for reliability

Book 2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits  IPFA

Download or read book 2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits IPFA written by IEEE Staff and published by . This book was released on 2017-07-04 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: The IPFA will be devoted to the fundamental understanding of the physical mechanisms of semiconductor device failures and issues related to semiconductor device reliability and yield, especially those related to advanced process technologies

Book 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits  IPFA

Download or read book 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits IPFA written by IEEE Staff and published by . This book was released on 2023-07-24 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: IPFA will continue to focus on the fundamental understanding of the electrical and physical characterization techniques and associated technologies that assist in probing the nature of wear out and failure in conventional and new CMOS devices, in turn resulting in improved know how of the physics of device circuit module failure that serves as critical input for future design for reliability We are also soliciting submissions in new and upcoming research areas including failure analysis for hardware security, reliability and failure analysis of power electronics, photovoltaic technologies, 2D Nano devices and applications of machine learning and artificial intelligence to the field of failure analysis and reliability assessments

Book Proceedings of the 2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits  IPFA

Download or read book Proceedings of the 2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits IPFA written by and published by . This book was released on 2016 with total page 438 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Book 2015 IEEE 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits  IPFA

Download or read book 2015 IEEE 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits IPFA written by IEEE Staff and published by . This book was released on 2015-06-29 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: IPFA 2015 will be devoted to the fundamental understanding of the physical mechanisms of semiconductor device failures and issues related to semiconductor device reliability and yield, especially those related to advanced process technologies, which include Sample Preparation, Metrology and Material Characterization Advanced Failure Analysis Techniques Die Level Package Level Failure Analysis Case Study & Failure Mechanisms Novel CMOS Gate Stack Dielectrics and FEOL Reliability and Failure Mechanisms Product Reliability Evaluation and Approaches Device (Ge, III V, TFT, Memory, MEMS, LED etc ) Reliability and Failure Mechanisms Advanced Interconnects and BEOL Reliability and Failure Mechanism

Book 2020 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits  IPFA

Download or read book 2020 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits IPFA written by IEEE Staff and published by . This book was released on 2020-07-20 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: The 27th edition of the IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2020) will be held at the Marina Bay Sands Convention Center in Singapore from July 20 23 IPFA will continue to focus on the fundamental understanding of the electrical and physical characterization techniques and associated technologies that assist in probing the nature of wear out and failure in conventional and new CMOS devices, in turn resulting in improved knowhow of the physics of device circuit module failure that serves as critical input for future design for reliability We are also soliciting submissions in new and upcoming areas of research that include failure analysis for hardware security, reliability and failure analysis of power electronics, photovoltaic technologies as well as 2D Nanodevices and applications of machine learning and artificial intelligence to the field of failure analysis and reliability assessment

Book 2013 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits  IPFA

Download or read book 2013 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits IPFA written by Institute of Electrical and Electronics Engineers (New York, NY). Nanjing Section and published by . This book was released on 2013-07-15 with total page 773 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Book Applied Mathematics  Modeling and Computer Simulation

Download or read book Applied Mathematics Modeling and Computer Simulation written by C.-H. Chen and published by IOS Press. This book was released on 2024-01-19 with total page 1266 pages. Available in PDF, EPUB and Kindle. Book excerpt: Applied mathematics, modelling, and computer simulation are central to many aspects of engineering and computer science, and continue to be of intrinsic importance to the development of modern technologies. This book presents the proceedings of AMMCS 2023, the 3rd International Conference on Applied Mathematics, Modeling and Computer Simulation, held on 12 and 13 August 2023 in Wuhan, China. The conference provided an ideal opportunity for scholars and researchers to communicate important recent developments in their areas of specialization to their colleagues, and to scientists in related disciplines. More than 250 submissions were received for the conference, of which 133 were selected for presentation at the conference and inclusion here after a thorough peer-review process. These range from the theoretical and conceptual to strongly pragmatic papers addressing industrial best practice, and cover topics such as mathematical modeling and application; engineering applications and scientific computations; and the simulation of intelligent systems. The book explores practical experiences and enlightening ideas, and will be of interest to researchers, practitioners, and to all those working in the fields of applied mathematics, modeling and computer simulation.

Book Security and Artificial Intelligence

Download or read book Security and Artificial Intelligence written by Lejla Batina and published by Springer Nature. This book was released on 2022-04-07 with total page 365 pages. Available in PDF, EPUB and Kindle. Book excerpt: AI has become an emerging technology to assess security and privacy, with many challenges and potential solutions at the algorithm, architecture, and implementation levels. So far, research on AI and security has looked at subproblems in isolation but future solutions will require sharing of experience and best practice in these domains. The editors of this State-of-the-Art Survey invited a cross-disciplinary team of researchers to a Lorentz workshop in 2019 to improve collaboration in these areas. Some contributions were initiated at the event, others were developed since through further invitations, editing, and cross-reviewing. This contributed book contains 14 invited chapters that address side-channel attacks and fault injection, cryptographic primitives, adversarial machine learning, and intrusion detection. The chapters were evaluated based on their significance, technical quality, and relevance to the topics of security and AI, and each submission was reviewed in single-blind mode and revised.