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Book Proceedings of the 1958 Electronic Components Conference Reliable Application of Component Parts Los Angeles April 22 23 24 1958 Etc

Download or read book Proceedings of the 1958 Electronic Components Conference Reliable Application of Component Parts Los Angeles April 22 23 24 1958 Etc written by Electronic Components Conference (LOS ANGELES) and published by . This book was released on 1958 with total page 222 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Book Proceedings of the Electronic Components Conference

Download or read book Proceedings of the Electronic Components Conference written by Electronic Components Conference and published by . This book was released on 1985 with total page 516 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Book Microcircuit Reliability Bibliography

Download or read book Microcircuit Reliability Bibliography written by and published by . This book was released on 1978 with total page 412 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Book Proceedings of the 1958 Electronic Components Conference

Download or read book Proceedings of the 1958 Electronic Components Conference written by American Institute of Electrical Engineers and published by . This book was released on 1958 with total page 248 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Book Reliable Application of Component Parts

Download or read book Reliable Application of Component Parts written by Electronic Components Conference. 1958, Los Angeles, Calif.. and published by . This book was released on 1958 with total page 222 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Book 39th Electronic Components Conference

Download or read book 39th Electronic Components Conference written by and published by . This book was released on 1989 with total page 928 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Book Direct Copper Interconnection for Advanced Semiconductor Technology

Download or read book Direct Copper Interconnection for Advanced Semiconductor Technology written by Dongkai Shangguan and published by CRC Press. This book was released on 2024-06-28 with total page 463 pages. Available in PDF, EPUB and Kindle. Book excerpt: In the “More than Moore” era, performance requirements for leading edge semiconductor devices are demanding extremely fine pitch interconnection in semiconductor packaging. Direct copper interconnection has emerged as the technology of choice in the semiconductor industry for fine pitch interconnection, with significant benefits for interconnect density and device performance. Low-temperature direct copper bonding, in particular, will become widely adopted for a broad range of highperformance semiconductor devices in the years to come. This book offers a comprehensive review and in-depth discussions of the key topics in this critical new technology. Chapter 1 reviews the evolution and the most recent advances in semiconductor packaging, leading to the requirement for extremely fine pitch interconnection, and Chapter 2 reviews different technologies for direct copper interconnection, with advantages and disadvantages for various applications. Chapter 3 offers an in-depth review of the hybrid bonding technology, outlining the critical processes and solutions. The area of materials for hybrid bonding is covered in Chapter 4, followed by several chapters that are focused on critical process steps and equipment for copper electrodeposition (Chapter 5), planarization (Chapter 6), wafer bonding (Chapter 7), and die bonding (Chapter 8). Aspects related to product applications are covered in Chapter 9 for design and Chapter 10 for thermal simulation. Finally, Chapter 11 covers reliability considerations and computer modeling for process and performance characterization, followed by the final chapter (Chapter 12) outlining the current and future applications of the hybrid bonding technology. Metrology and testing are also addressed throughout the chapters. Business, economic, and supply chain considerations are discussed as related to the product applications and manufacturing deployment of the technology, and the current status and future outlook as related to the various aspects of the ecosystem are outlined in the relevant chapters of the book. The book is aimed at academic and industry researchers as well as industry practitioners, and is intended to serve as a comprehensive source of the most up-to-date knowledge, and a review of the state-of-the art of the technology and applications, for direct copper interconnection and advanced semiconductor packaging in general.

Book NBS Special Publication

Download or read book NBS Special Publication written by and published by . This book was released on 1976 with total page 704 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Book 50th Electronic Components and Technology Conference

Download or read book 50th Electronic Components and Technology Conference written by Michael F. Caggiano and published by . This book was released on 2001 with total page 24 pages. Available in PDF, EPUB and Kindle. Book excerpt: