Download or read book 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits IPFA written by IEEE Staff and published by . This book was released on 2023-07-24 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: IPFA will continue to focus on the fundamental understanding of the electrical and physical characterization techniques and associated technologies that assist in probing the nature of wear out and failure in conventional and new CMOS devices, in turn resulting in improved know how of the physics of device circuit module failure that serves as critical input for future design for reliability We are also soliciting submissions in new and upcoming research areas including failure analysis for hardware security, reliability and failure analysis of power electronics, photovoltaic technologies, 2D Nano devices and applications of machine learning and artificial intelligence to the field of failure analysis and reliability assessments
Download or read book 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits IPFA written by and published by . This book was released on 2023 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book 2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits IPFA written by IEEE Staff and published by . This book was released on 2022-07-18 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: The 29th edition of the IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2022) be held in person as a physical conference at the iconic Marina Bay Sands, Singapore from 18 21 July 2022 IPFA will continue to focus on the fundamental understanding of the electrical and physical characterization techniques and associated technologies that assist in probing the nature of wear out and failure in conventional and new CMOS devices, in turn resulting in improved knowhow of the physics of device circuit module failure that serves as critical input for future design for reliability We are also soliciting submissions in new and upcoming research areas including failure analysis for hardware security, reliability and failure analysis of power electronics, photovoltaic technologies, 2D Nanodevices and applications of machine learning and artificial intelligence to the field of failure analysis and reliability assessments
Download or read book 2021 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits IPFA written by IEEE Staff and published by . This book was released on 2021-09-15 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: The 28th edition of the IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2021) will be held virtually for a month (with a half day live keynote session) from mid September to mid October IPFA will continue to focus on the fundamental understanding of the electrical and physical characterization techniques and associated technologies that assist in probing the nature of wear out and failure in conventional and new CMOS devices, in turn resulting in improved knowhow of the physics of device circuit module failure that serves as critical input for future design for reliability We are also soliciting submissions in new and upcoming areas of research that include failure analysis for hardware security, reliability and failure analysis of power electronics, photovoltaic technologies as well as 2D Nanodevices and applications of machine learning and artificial intelligence to the field of failure analysis and reliability assessment
Download or read book 2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits IPFA written by IEEE Staff and published by . This book was released on 2018-07-16 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: IPFA 2018 is devoted to the fundamental understanding of the electrical and physical characterization techniques and associated technologies that assist in probing the nature of wear out and failure in conventional and new CMOS devices, in turn resulting in improved knowhow of the physics of device circuit module failure that serves as critical input for future design for reliability
Download or read book 2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits IPFA written by IEEE Staff and published by . This book was released on 2016-07-18 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: IPFA is devoted to the fundamental understanding of the physical mechanisms of semiconductor device failures and issues related to semiconductor device reliability, yield and performance, especially those related to advanced process technologies
Download or read book 2020 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits IPFA written by IEEE Staff and published by . This book was released on 2020-07-20 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: The 27th edition of the IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2020) will be held at the Marina Bay Sands Convention Center in Singapore from July 20 23 IPFA will continue to focus on the fundamental understanding of the electrical and physical characterization techniques and associated technologies that assist in probing the nature of wear out and failure in conventional and new CMOS devices, in turn resulting in improved knowhow of the physics of device circuit module failure that serves as critical input for future design for reliability We are also soliciting submissions in new and upcoming areas of research that include failure analysis for hardware security, reliability and failure analysis of power electronics, photovoltaic technologies as well as 2D Nanodevices and applications of machine learning and artificial intelligence to the field of failure analysis and reliability assessment
Download or read book 2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits IPFA written by IEEE Staff and published by . This book was released on 2017-07-04 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: The IPFA will be devoted to the fundamental understanding of the physical mechanisms of semiconductor device failures and issues related to semiconductor device reliability and yield, especially those related to advanced process technologies
Download or read book Hardware Security written by Mark Tehranipoor and published by Springer Nature. This book was released on with total page 538 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book 2015 IEEE 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits IPFA written by IEEE Staff and published by . This book was released on 2015-06-29 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: IPFA 2015 will be devoted to the fundamental understanding of the physical mechanisms of semiconductor device failures and issues related to semiconductor device reliability and yield, especially those related to advanced process technologies, which include Sample Preparation, Metrology and Material Characterization Advanced Failure Analysis Techniques Die Level Package Level Failure Analysis Case Study & Failure Mechanisms Novel CMOS Gate Stack Dielectrics and FEOL Reliability and Failure Mechanisms Product Reliability Evaluation and Approaches Device (Ge, III V, TFT, Memory, MEMS, LED etc ) Reliability and Failure Mechanisms Advanced Interconnects and BEOL Reliability and Failure Mechanism
Download or read book ICAE 2023 written by Nur Cahyono Kushardianto and published by European Alliance for Innovation. This book was released on 2024-01-19 with total page 305 pages. Available in PDF, EPUB and Kindle. Book excerpt: We are delighted to provide the proceedings of the sixth International Conference on Applied Engineering (ICAE), 2023, which was conducted in Batam on November 7th, 2023. This conference, which has as its theme "Synergizing Green Economy, Sustainable Development, and Digitalization for a Prosperous Future," is a significant international assembly that seeks to integrate technological innovation, economic expansion, and environmental sustainability. An ensemble of stakeholders, comprising policymakers, entrepreneurs, and experts, assembles to examine the mutually beneficial correlation that exists between digital advancements and a green economy. The acceptance rate for ICAE 2023 stands at 25%, leading to the selection of 28 substantial papers. The conference featured three distinct tracks: Informatics, Electronics, and Mechanicals. Two keynote addresses were delivered in conjunction with the outstanding technical paper presentations at the technical program. The keynote addresses were delivered by Dr. Ir. Basuki Rahmatul Alam, Chair of the IEEE EDS Indonesia Chapter and Senior Member of IEEE, and Dr. MK Radhakrishnan, Technical Consultant at NanoRel LLP in Singapore and Vice President of IEEE EDS. Coordination effectiveness with the steering committee was crucial to guaranteeing the conference's success. We wish to convey our profound gratitude for their consistent guidance and support that accompanied the entire undertaking. The ICAE Chair Committee deserves special recognition for their conscientiousness in finalizing the peer-review procedure of technical papers, which ultimately led to the creation of a technical program of exceptional quality. Furthermore, we would like to express our sincere appreciation to the Conference Managers and all the authors who submitted their papers for the ICAE 2023 conference for their invaluable assistance. Additionally, we appreciate the assistance of the EAI staff in facilitating the production of this publication.
Download or read book 2015 IEEE 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits IPFA 2015 written by and published by . This book was released on 2015 with total page 580 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Applied Mathematics Modeling and Computer Simulation written by C.-H. Chen and published by IOS Press. This book was released on 2024-01-19 with total page 1266 pages. Available in PDF, EPUB and Kindle. Book excerpt: Applied mathematics, modelling, and computer simulation are central to many aspects of engineering and computer science, and continue to be of intrinsic importance to the development of modern technologies. This book presents the proceedings of AMMCS 2023, the 3rd International Conference on Applied Mathematics, Modeling and Computer Simulation, held on 12 and 13 August 2023 in Wuhan, China. The conference provided an ideal opportunity for scholars and researchers to communicate important recent developments in their areas of specialization to their colleagues, and to scientists in related disciplines. More than 250 submissions were received for the conference, of which 133 were selected for presentation at the conference and inclusion here after a thorough peer-review process. These range from the theoretical and conceptual to strongly pragmatic papers addressing industrial best practice, and cover topics such as mathematical modeling and application; engineering applications and scientific computations; and the simulation of intelligent systems. The book explores practical experiences and enlightening ideas, and will be of interest to researchers, practitioners, and to all those working in the fields of applied mathematics, modeling and computer simulation.
Download or read book Proceedings of the International Symposium on the Physical Failure Analysis of Integrated Circuits written by and published by . This book was released on 2003 with total page 266 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Handbook of Artificial Intelligence written by Dumpala Shanthi and published by Bentham Science Publishers. This book was released on 2023-11-13 with total page 297 pages. Available in PDF, EPUB and Kindle. Book excerpt: Artificial Intelligence (AI) is an interdisciplinary science with multiple approaches to solve a problem. Advancements in machine learning (ML) and deep learning are creating a paradigm shift in virtually every tech industry sector. This handbook provides a quick introduction to concepts in AI and ML. The sequence of the book contents has been set in a way to make it easy for students and teachers to understand relevant concepts with a practical orientation. This book starts with an introduction to AI/ML and its applications. Subsequent chapters cover predictions using ML, and focused information about AI/ML algorithms for different industries (health care, agriculture, autonomous driving, image classification and segmentation, SEO, smart gadgets and security). Each industry use-case demonstrates a specific aspect of AI/ML techniques that can be used to create pipelines for technical solutions such as data processing, object detection, classification and more. Additional features of the book include a summary and references in every chapter, and several full-color images to visualize concepts for easy understanding. It is an ideal handbook for both students and instructors in undergraduate level courses in artificial intelligence, data science, engineering and computer science who are required to understand AI/ML in a practical context.
Download or read book Built in Fault Tolerant Computing Paradigm for Resilient Large Scale Chip Design written by Xiaowei Li and published by Springer Nature. This book was released on 2023-03-01 with total page 318 pages. Available in PDF, EPUB and Kindle. Book excerpt: With the end of Dennard scaling and Moore’s law, IC chips, especially large-scale ones, now face more reliability challenges, and reliability has become one of the mainstay merits of VLSI designs. In this context, this book presents a built-in on-chip fault-tolerant computing paradigm that seeks to combine fault detection, fault diagnosis, and error recovery in large-scale VLSI design in a unified manner so as to minimize resource overhead and performance penalties. Following this computing paradigm, we propose a holistic solution based on three key components: self-test, self-diagnosis and self-repair, or “3S” for short. We then explore the use of 3S for general IC designs, general-purpose processors, network-on-chip (NoC) and deep learning accelerators, and present prototypes to demonstrate how 3S responds to in-field silicon degradation and recovery under various runtime faults caused by aging, process variations, or radical particles. Moreover, we demonstrate that 3S not only offers a powerful backbone for various on-chip fault-tolerant designs and implementations, but also has farther-reaching implications such as maintaining graceful performance degradation, mitigating the impact of verification blind spots, and improving chip yield. This book is the outcome of extensive fault-tolerant computing research pursued at the State Key Lab of Processors, Institute of Computing Technology, Chinese Academy of Sciences over the past decade. The proposed built-in on-chip fault-tolerant computing paradigm has been verified in a broad range of scenarios, from small processors in satellite computers to large processors in HPCs. Hopefully, it will provide an alternative yet effective solution to the growing reliability challenges for large-scale VLSI designs.
Download or read book Computer Safety Reliability and Security written by Jérémie Guiochet and published by Springer Nature. This book was released on 2023-09-10 with total page 291 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book constitutes the refereed proceedings of the 42nd International Conference on Computer Safety, Reliability and Security, SAFECOMP 2023, which took place in Toulouse, France, in September 2023. The 20 full papers included in this volume were carefully reviewed and selected from 100 submissions. They were organized in topical sections as follows: Safety assurance; software testing and reliability; neural networks robustness and monitoring; model-based security and threat analysis; safety of autonomous driving; security engineering; AI safety; and neural networks and testing.
