Download or read book Proceedings of the 7th International Corrosion Prevention Symposium for Research Scholars written by Azman Jalar and published by Springer Nature. This book was released on 2022-06-29 with total page 255 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book gathers the latest research, innovations, and applications in the field of corrosion prevention and control, as presented by leading national and international academics, researchers, engineers, and postgraduate students at the AWAM International Conference on Civil Engineering 2022 (AICCE’22), held 7th International Corrosion Prevention Symposium for Research Scholars (CORSYM 2021), held as a virtual conference on November 2021. The CORSYM 2021 theme, Nurturing Future Corrosionist for Better Corrosion Mitigation, covered key topics such as corrosion and inhibitors, corrosion of biomaterials, top of line corrosion, H2S and CO2 corrosion, coatings and composites for biomedical devices, electrochemical testing techniques, advanced materials and coatings, corrosion in concrete structures, welding and hot Corrosion, corrosion in ships and marine structures, corrosion of biomaterials, corrosion Under insulation, digitalization in corrosion. The contributions introduce numerous exciting ideas that spur novel research directions and foster multidisciplinary collaborations between various specialists in the field of corrosion engineering.

Download or read book International Scientific Siberian Transport Forum TransSiberia 2021 written by Aleksey Manakov and published by Springer Nature. This book was released on 2022-03-17 with total page 1595 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents innovations in the field of high-speed rail technology, hyperloop transportation technologies and Maglev system, information and communication technology (ICT) for intelligent transportation systems (ITS), multimodal transportation, sustainable freight transportation, and others. The papers presented in the book are proceedings of the annual scientific forum “TransSiberia”, which is the foremost Russian transport event that focuses on innovations in rail transport. The book also presents research in the field of railway engineering, health monitoring, inspection, NDT&E, and signal processing. Developments in the field of decarbonization of railway transport and new types of fuel as an alternative to electrification are proposed. The issues of sustainable operation and maintenance of railway systems and sustainable freight transportation, such as digitalization and AI technologies for sustainable asset management, operation, and maintenance of railway systems, have received a lot of research attention. The book serves as a medium for railroad academia and industry to exchange new ideas and share the latest achievements, as well as to continue supporting the productivity of the transport industry in a sustainable manner.

Download or read book Materials for Electronics Security and Assurance written by Navid Asadizanjani and published by Elsevier. This book was released on 2024-01-15 with total page 224 pages. Available in PDF, EPUB and Kindle. Book excerpt: Materials for Electronics Security and Assurance reviews the properties of materials that could enable devices that are resistant to tampering and manipulation. The book discusses recent advances in materials synthesis and characterization techniques for security applications. Topics addressed include anti-reverse engineering, detection, prevention, track and trace, fingerprinting, obfuscation, and how materials could enable these security solutions. The book introduces opportunities and challenges and provides a clear direction of the requirements for material-based solutions to address electronics security challenges. It is suitable for materials scientists and engineers who seek to enable future research directions, current computer and hardware security engineers who want to enable materials selection, and as a way to inspire cross-collaboration between both communities. - Discusses materials as enablers to provide electronics assurance, counterfeit detection/protection, and fingerprinting - Provides an overview of benefits and challenges of materials-based security solutions to inspire future materials research directions - Includes an introduction to material perspectives on hardware security to enable cross collaboration between materials, design, and testing

Download or read book Theory and Practice of Thermal Transient Testing of Electronic Components written by Marta Rencz and published by Springer Nature. This book was released on 2023-01-23 with total page 389 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book discusses the significant aspects of thermal transient testing, the most important method of thermal characterization of electronics available today. The book presents the theoretical background of creating structure functions from the measured results with mathematical details. It then shows how the method can be used for thermal qualification, structure integrity testing, determining material parameters, and calibrating simulation models. General practical questions about measurements are discussed to help beginners carry out thermal transient testing. The particular problems and tricks of measuring with various electronic components, such as Si diodes, bipolar transistors, MOS transistors, IGBT devices, resistors, capacitors, wide bandgap materials, and LEDs, are covered in detail with the help of various use cases. This hands-on book will enable readers to accomplish thermal transient testing on any new type of electronics and provides the theoretical details needed to understand the opportunities and limitations offered by the methodology. The book will be an invaluable reference for practicing engineers, students, and researchers.

Download or read book Direct Copper Interconnection for Advanced Semiconductor Technology written by Dongkai Shangguan and published by CRC Press. This book was released on 2024-06-28 with total page 549 pages. Available in PDF, EPUB and Kindle. Book excerpt: In the “More than Moore” era, performance requirements for leading edge semiconductor devices are demanding extremely fine pitch interconnection in semiconductor packaging. Direct copper interconnection has emerged as the technology of choice in the semiconductor industry for fine pitch interconnection, with significant benefits for interconnect density and device performance. Low-temperature direct copper bonding, in particular, will become widely adopted for a broad range of highperformance semiconductor devices in the years to come. This book offers a comprehensive review and in-depth discussions of the key topics in this critical new technology. Chapter 1 reviews the evolution and the most recent advances in semiconductor packaging, leading to the requirement for extremely fine pitch interconnection, and Chapter 2 reviews different technologies for direct copper interconnection, with advantages and disadvantages for various applications. Chapter 3 offers an in-depth review of the hybrid bonding technology, outlining the critical processes and solutions. The area of materials for hybrid bonding is covered in Chapter 4, followed by several chapters that are focused on critical process steps and equipment for copper electrodeposition (Chapter 5), planarization (Chapter 6), wafer bonding (Chapter 7), and die bonding (Chapter 8). Aspects related to product applications are covered in Chapter 9 for design and Chapter 10 for thermal simulation. Finally, Chapter 11 covers reliability considerations and computer modeling for process and performance characterization, followed by the final chapter (Chapter 12) outlining the current and future applications of the hybrid bonding technology. Metrology and testing are also addressed throughout the chapters. Business, economic, and supply chain considerations are discussed as related to the product applications and manufacturing deployment of the technology, and the current status and future outlook as related to the various aspects of the ecosystem are outlined in the relevant chapters of the book. The book is aimed at academic and industry researchers as well as industry practitioners, and is intended to serve as a comprehensive source of the most up-to-date knowledge, and a review of the state-of-the art of the technology and applications, for direct copper interconnection and advanced semiconductor packaging in general.

Download or read book The Proceedings of the 17th Annual Conference of China Electrotechnical Society written by Kaigui Xie and published by Springer Nature. This book was released on 2023-03-30 with total page 1314 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book gathers outstanding papers presented at the 17th Annual Conference of China Electrotechnical Society, organized by China Electrotechnical Society (CES), held in Beijing, China, from September 17 to 18, 2022. It covers topics such as electrical technology, power systems, electromagnetic emission technology, and electrical equipment. It introduces the innovative solutions that combine ideas from multiple disciplines. The book is very much helpful and useful for the researchers, engineers, practitioners, research students, and interested readers.

Download or read book Interconnect Reliability in Advanced Memory Device Packaging written by Chong Leong, Gan and published by Springer Nature. This book was released on 2023-05-30 with total page 223 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing. In the past 40 years, memory packaging processes have evolved enormously. This book discusses the reliability and technical challenges of first-level interconnect materials, packaging processes, advanced specialty reliability testing, and characterization of interconnects. It also examines the reliability of wire bonding, lead-free solder joints such as reliability testing and data analyses, design for reliability in hybrid packaging and HBM packaging, and failure analyses. The specialty of this book is that the materials covered are not only for second-level interconnects, but also for packaging assembly on first-level interconnects and for the semiconductor back-end on 2.5D and 3D memory interconnects. This book can be used as a text for college and graduate students who have the potential to become our future leaders, scientists, and engineers in the electronics and semiconductor industry.

Download or read book Recent Progress in Lead Free Solder Technology written by Mohd Arif Anuar Mohd Salleh and published by Springer Nature. This book was released on 2022-03-01 with total page 332 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book highlights recent research progress in lead (Pb)-free solder technology, focusing on materials development, processing, and performances. It discusses various Pb-free solder materials’ development, encompassing composite solders, transient liquid phase sintering, and alloying. The book also details various Pb-free solder technology processing and performances, including flux modification for soldering, laser soldering, wave soldering, and reflow soldering, while also examining multiple technologies pertaining to the rigid and flexible printed circuit board (PCB). Some chapters explain the materials characterization and modeling techniques using computational fluid dynamics (CFD). This book serves as a valuable reference for researchers, industries, and stakeholders in advanced microelectronic packaging, emerging interconnection technology, and those working on Pb-free solder.

Download or read book Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium written by Mohd Arif Anuar Mohd Salleh and published by Springer Nature. This book was released on 2023-07-02 with total page 873 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents peer reviewed articles from the Green Materials and Electronic Packaging Interconnect Technology Symposium, (EPITS 2022), held in Langkawi, Malaysia on 14th and 15th of Sept, 2022. It brings together packaging experts to share and exchange ideas in electronics technology. Topics covered in this volume include, but are not limited to; (1) Green materials and technology, (2) Emerging interconnect materials and technologies,(3) Non-solder interconnect materials at chip and package levels, (4) Fundamental materials behavior for electronic packaging materials, (5) Advanced characterization methods as applied to electronic packaging technology, (6) Developments in high temperature Pb-free solders and associated interconnects for automotive and power electronics, (7) Surface coating materials & (8) Advanced materials. ​

Download or read book Integrated Photonics for Data Communication Applications written by Madeleine Glick and published by Elsevier. This book was released on 2023-07-26 with total page 523 pages. Available in PDF, EPUB and Kindle. Book excerpt: Integrated Photonics for Data Communications Applications reviews the key concepts, design principles, performance metrics and manufacturing processes from advanced photonic devices to integrated photonic circuits. The book presents an overview of the trends and commercial needs of data communication in data centers and high-performance computing, with contributions from end users presenting key performance indicators. In addition, the fundamental building blocks are reviewed, along with the devices (lasers, modulators, photodetectors and passive devices) that are the individual elements that make up the photonic circuits. These chapters include an overview of device structure and design principles and their impact on performance. Following sections focus on putting these devices together to design and fabricate application-specific photonic integrated circuits to meet performance requirements, along with key areas and challenges critical to the commercial manufacturing of photonic integrated circuits and the supply chains being developed to support innovation and market integration are discussed. This series is led by Dr. Lionel Kimerling Executive at AIM Photonics Academy and Thomas Lord Professor of Materials Science and Engineering at MIT and Dr. Sajan Saini Education Director at AIM Photonics Academy at MIT. Each edited volume features thought-leaders from academia and industry in the four application area fronts (data communications, high-speed wireless, smart sensing, and imaging) and addresses the latest advances. - Includes contributions from leading experts and end-users across academia and industry working on the most exciting research directions of integrated photonics for data communications applications - Provides an overview of data communication-specific integrated photonics starting from fundamental building block devices to photonic integrated circuits to manufacturing tools and processes - Presents key performance metrics, design principles, performance impact of manufacturing variations and operating conditions, as well as pivotal performance benchmarks

Download or read book Handbook of Biodegradable Materials written by Gomaa A. M. Ali and published by Springer Nature. This book was released on 2023-02-20 with total page 1704 pages. Available in PDF, EPUB and Kindle. Book excerpt: This Handbook discusses the recent advances in biodegradation technologies and highlights emerging sustainable materials, including environmentally friendly nano-based materials for replacing plastics. It is useful to scientists, engineers, biologists, medical doctors and provides alternative eco-friendly materials to replace the currently used ones with harmful impact on the environment and life. The chapters present different types of alternative materials in diverse areas, such as food packaging materials, materials for construction and agricultural materials. The principles and types of biodegration technologies are described in depth.

Download or read book Graphene Rubber Nanocomposites written by Titash Mondal and published by CRC Press. This book was released on 2022-10-24 with total page 559 pages. Available in PDF, EPUB and Kindle. Book excerpt: Since the Nobel Prize for the discovery of graphene was presented in 2010, graphene has been frequently leveraged for different applications. Owing to the strategic importance of elastomer-based products in different segments, graphene and its derivatives are often added to different elastomers to improve their properties. Graphene-Rubber Nanocomposites: Fundamentals to Applications provides a comprehensive and innovative account of graphene-rubber composites. Features: Provides up-to-date information and research on graphene-rubber nanocomposites Presents a detailed account of the different niche applications ranging from sensors, flexible electronics to thermal, and EMI shielding materials Offers a comprehensive know-how on the structure-property relationship of graphene-rubber nanocomposites Covers the characterization of graphene-based elastomeric composition Delivers a comprehensive understanding of the structure of the graphene, including its chemical modification for usage in elastomer composites This book will be a valuable resource for graduate-level students, researchers, and professionals working in the fields of materials science, polymer science, nanoscience and technology, rubber technology, chemical engineering, and composite materials.

Download or read book Printed Circuit Fabrication written by and published by . This book was released on 2002 with total page 922 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book From LED to Solid State Lighting written by S. W. Ricky Lee and published by John Wiley & Sons. This book was released on 2021-09-17 with total page 256 pages. Available in PDF, EPUB and Kindle. Book excerpt: FROM LED TO SOLID STATE LIGHTING A comprehensive and practical reference complete with hands-on exercises and experimental data In From LED to Solid State Lighting: Principles, Materials, Packaging, Characterization, and Applications, accomplished mechanical engineers Shi-Wei Ricky Lee, Jeffery C. C. Lo, Mian Tao, and Huaiyu Ye deliver a practical overview of the design and construction of LED lighting modules, from the fabrication of the LED chip to the LED modules incorporated in complete LED lighting fixtures. The distinguished authors discuss the major advantages of solid-state lighting, including energy savings, environmental friendliness, and lengthy operational life, as well as the contributions offered by the packaging of light-emitting diodes in the pursuit of these features. Readers will discover presentations of the technical issues that arise in packaging LED components, like interconnection, phosphor deposition, and encapsulation. They’ll also find insightful elaborations on optical design, analysis, and characterization. Discussions of LED applications, technology roadmaps, and IP issues round out the included material. This important book also includes: Thorough introductions to lighting, photometry, and colorimetry, the fundamentals of light-emitting diodes, and the fabrication of LED wafers and chips Practical discussions of the packaging of LED chips, wafer-level packaging of LED arrays, and optical and electrical characterization Comprehensive explorations of board-level assembly and LED modules and optical and electrical characterization In-depth examinations of thermal management, reliability engineering for LED packaging, and applications for general lighting Perfect for post-graduate students and practicing engineers studying or working in the field of LED manufacturing for solid state lighting applications, From LED to Solid State Lighting: Principles, Materials, Packaging, Characterization, and Applications is also an indispensable resource for managers and technicians seeking a one-stop guide to the subject.

Download or read book Flexible pressure and temperature sensors towards e skin material mechanism structure and fabrication written by Shengrui Tian and published by OAE Publishing Inc.. This book was released on 2023-08-07 with total page 27 pages. Available in PDF, EPUB and Kindle. Book excerpt: Electronic skin (E-skin) has gained significant attention due to its potential applications in the Internet of Things (IoT), artificial intelligence (AI), and flexible multi-sensing systems. Mimicking human skin, e-skin sensing devices can be employed in various scenarios. Among the most important sensing elements for tactile e-skin sensors are pressure and temperature sensors, which have increasingly garnered research interest over the past few decades. However, the design and fabrication of advanced pressure and temperature sensors can be challenging owing to complications such as signal interference, complex mechanism integration, and structural design issues. This review provides an overview of flexible pressure and temperature sensors used in e-skin, covering four main perspectives: material selection, mechanism integration, structural design, and manufacturing methods. The materials of different elements in the entire sensing system are comprehensively discussed, along with single and compound mechanisms of pressure and temperature sensing. Pressure and temperature sensors are divided into two types based on their electric output signals, which are exemplified in detail. The manufacturing methods used to fabricate these sensors, including printing methods, are outlined. Lastly, a summary of the future challenges faced by flexible pressure and temperature sensors used in e-skin is presented.

Download or read book Fiber Reinforced Composites written by Kuruvilla Joseph and published by Woodhead Publishing. This book was released on 2021-03-20 with total page 908 pages. Available in PDF, EPUB and Kindle. Book excerpt: Polymer-based fibre-reinforced composites FRC's have now come out as a major class of structural materials being used or regarded as substituent's for metals in several critical components in space, automotive and other industries (marine, and sports goods) owing to their low density, strength-weight ratio, and fatigue strength. FRC's have several commercial as well as industrial applications ranging from aircraft, space, automotive, sporting goods, marine, and infrastructure. The above-mentioned applications of FRC's clearly reveal that FRC's have the potential to be used in a broad range of different engineering fields with the added advantages of low density, and resistance to corrosion compared to conventional metallic and ceramic composites. However, for scientists/researchers/R&D's to fabricate FRC's with such potential there should be careful and precise design followed by suitable process development based on properties like mechanical, physical, and thermal that are unique to each application. Hence the last few decades have witnessed considerable research on fibre reinforced composites. Fibre Reinforced Composites: Constituents, Compatibility, Perspectives and Applications presents a widespread all-inclusive review on fibre-reinforced composites ranging from the different types of processing techniques to chemical modification of the fibre surface to enhance the interfacial adhesion between the matrix and fibre and the structure-property relationship. It illustrates how high value composites can be produced by efficient and sustainable processing methods by selecting different constituents [fibres and resins]. Researchers in academia working in composites and accompanying areas [materials characterisation] and industrial manufacturers who need information on composite constituents and how they relate to each other for a certain application will find the book extremely useful when they need to make decisions about materials selection for their products. - Focuses on the different types of FRC's that are currently available (e.g. from polymeric matrices to metallic and ceramic matrices, from carbon fibre to different types of natural fibres and from short to long fibre reinforced), their processing techniques, characterization of different properties, and how to improve the interfacial adhesion between an incompatible fibre and matrix and their applications - Looks at crisis areas such as how to incorporate incompatible fibres and matrices together (e.g. Non-polar polypropylene matrix is not compatible with that of polar natural fibres and hence suitable surface modifications are required to make them compatible with each other) along with low cost processing methods, low density and high strength - Uncovers clarifications to both elementary and practical problems related to the fabrication of FRCs - Schematic representations depicting the interaction between different fibre types and matrices will be provided in some chapters

Download or read book Physical Assurance written by Navid Asadizanjani and published by Springer Nature. This book was released on 2021-02-15 with total page 193 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides readers with a comprehensive introduction to physical inspection-based approaches for electronics security. The authors explain the principles of physical inspection techniques including invasive, non-invasive and semi-invasive approaches and how they can be used for hardware assurance, from IC to PCB level. Coverage includes a wide variety of topics, from failure analysis and imaging, to testing, machine learning and automation, reverse engineering and attacks, and countermeasures.