Download or read book 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems iTherm written by and published by . This book was released on 2021 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems iTherm written by IEEE Staff and published by . This book was released on 2021-06 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: The ITherm Conference series is the leading international venue for scientific and engineering exploration of thermal, thermomechanical, and emerging technology issues associated with electronic devices, packages, and systems
Download or read book Energy Systems written by Leon Liebenberg and published by John Wiley & Sons. This book was released on 2024-03-11 with total page 725 pages. Available in PDF, EPUB and Kindle. Book excerpt: ENERGY SYSTEMS Reimagine the future of energy production and use with this innovative and state-of-the-art guide This multidisciplinary and comprehensive text features an up-to-date summary of salient energy technologies for quick reference by students and practitioners of energy engineering. Uniquely, the book employs a guided self-study approach with theory provided in “bite-sized” chunks, several worked examples, quantitative and qualitative practice problems, 10 real-world mini-projects, and interviews with young energy innovators and engineering students. The book poses many big and pressing questions, asking the reader to “reimagine our future,” particularly with a focus on sustainable energy. These questions are aligned with characteristics of an entrepreneurial mindset, which are emphasized throughout the book. The book reviews the fundamentals of thermodynamics, fluid mechanics, and quantum mechanics. Chapters explore the full range of energy conversion technologies, including energy supply and demand, the science of global warming, interpretations of sustainability, chemical fuels, carbon capture and storage, internal and external combustion engines, vapor power and refrigeration plants, nuclear power, solar-electricity, solar-heat, fuel cells, wind energy, water energy, and energy storage. The book ends with a brief investigation into what we can do to decarbonize the transportation, industry, buildings, and electric power sectors. Energy Systems: A Project-Based Approach to Sustainability Thinking for Energy Conversion Systems offers an accessible overview of this important subject with an innovative, easy-to-use organization. Built to facilitate active learning and representing the latest research and industrial practice, Energy Systems provides readers with tools and information to evaluate energy systems and to reimagine potential energy solutions. Readers of Energy Systems will also find: Organization designed to blend seamlessly with a 14-week course schedule A balance of robust theoretical and industry-related knowledge and real-world examples throughout Teaching resources including mini-projects, practice problems, remedial appendices, and online study notes Energy Systems is ideal for students and instructors in courses relating to Energy Conversion Systems, Energy Science, Sustainable/Renewable Energy, and the interrelated Social, Technological, Economic, Environmental, and Political aspects. The book will also appeal to practitioners of energy engineering via the numerous state-of-the-art summaries and real-world problems.
Download or read book Nano Bio Electronic Photonic and MEMS Packaging written by C.P. Wong and published by Springer Science & Business Media. This book was released on 2009-12-23 with total page 761 pages. Available in PDF, EPUB and Kindle. Book excerpt: Nanotechnologies are being applied to the biotechnology area, especially in the area of nano material synthesis. Until recently, there has been little research into how to implement nano/bio materials into the device level. “Nano and Bio Electronics Packaging” discusses how nanofabrication techniques can be used to customize packaging for nano devices with applications to biological and biomedical research and products. Covering such topics as nano bio sensing electronics, bio device packaging, NEMs for Bio Devices and much more.
Download or read book Die Attach Materials for High Temperature Applications in Microelectronics Packaging written by Kim S. Siow and published by Springer. This book was released on 2019-01-29 with total page 292 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents the scientific principles, processing conditions, probable failure mechanisms, and a description of reliability performance and equipment required for implementing high-temperature and lead-free die attach materials. In particular, it addresses the use of solder alloys, silver and copper sintering, and transient liquid-phase sintering. While different solder alloys have been used widely in the microelectronics industry, the implementation of sintering silver and transient liquid-phase sintering remains limited to a handful of companies. Hence, the book devotes many chapters to sintering technologies, while simultaneously providing only a cursory coverage of the more widespread techniques employing solder alloys. Addresses the differences between sintering and soldering (the current die-attach technologies), thereby comprehensively addressing principles, methods, and performance of these high-temperature die-attach materials; Emphasizes the industrial perspective, with chapters written by engineers who have hands-on experience using these technologies; Baker Hughes, Bosch and ON Semiconductor, are represented as well as materials suppliers such as Indium; Simultaneously provides the detailed science underlying these technologies by leading academic researchers in the field.
Download or read book Thermal and Electro thermal System Simulation 2020 written by Márta Rencz and published by MDPI. This book was released on 2021-01-12 with total page 310 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book, edited by Prof. Marta Rencz and Prof Andras Poppe, Budapest University of Technology and Economics, and by Prof. Lorenzo Codecasa, Politecnico di Milano, collects fourteen papers carefully selected for the “thermal and electro-thermal system simulation” Special Issue of Energies. These contributions present the latest results in a currently very “hot” topic in electronics: the thermal and electro-thermal simulation of electronic components and systems. Several papers here proposed have turned out to be extended versions of papers presented at THERMINIC 2019, which was one of the 2019 stages of choice for presenting outstanding contributions on thermal and electro-thermal simulation of electronic systems. The papers proposed to the thermal community in this book deal with modeling and simulation of state-of-the-art applications which are highly critical from the thermal point of view, and around which there is great research activity in both industry and academia. In particular, contributions are proposed on the multi-physics simulation of families of electronic packages, multi-physics advanced modeling in power electronics, multiphysics modeling and simulation of LEDs, batteries and other micro and nano-structures.
Download or read book Technical Economic and Societal Effects of Manufacturing 4 0 written by Mikael Collan and published by Palgrave Macmillan. This book was released on 2020-10-01 with total page 266 pages. Available in PDF, EPUB and Kindle. Book excerpt: This open access book is among the first cross-disciplinary works about Manufacturing 4.0. It includes chapters about the technical, the economic, and the social aspects of this important phenomenon. Together the material presented allows the reader to develop a holistic picture of where the manufacturing industry and the parts of the society that depend on it may be going in the future. Manufacturing 4.0 is not only a technical change, nor is it a purely technically driven change, but it is a societal change that has the potential to disrupt the way societies are constructed both in the positive and in the negative. This book will be of interest to scholars researching manufacturing, technological innovation, innovation management and industry 4.0.
Download or read book Fundamentals of Lead Free Solder Interconnect Technology written by Tae-Kyu Lee and published by Springer. This book was released on 2014-11-05 with total page 266 pages. Available in PDF, EPUB and Kindle. Book excerpt: This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys. Additional topics covered include the reliability of lead-free soldering, tin whiskering and electromigration, in addition to emerging technologies and research.
Download or read book Wide Bandgap Power Semiconductor Packaging written by Katsuaki Suganuma and published by Woodhead Publishing. This book was released on 2018-05-28 with total page 242 pages. Available in PDF, EPUB and Kindle. Book excerpt: Wide Bandgap Power Semiconductor Packaging: Materials, Components, and Reliability addresses the key challenges that WBG power semiconductors face during integration, including heat resistance, heat dissipation and thermal stress, noise reduction at high frequency and discrete components, and challenges in interfacing, metallization, plating, bonding and wiring. Experts on the topic present the latest research on materials, components and methods of reliability and evaluation for WBG power semiconductors and suggest solutions to pave the way for integration. As wide bandgap (WBG) power semiconductors, SiC and GaN, are the latest promising electric conversion devices because of their excellent features, such as high breakdown voltage, high frequency capability, and high heat-resistance beyond 200 C, this book is a timely resource on the topic. - Examines the key challenges of wide bandgap power semiconductor packaging at various levels, including materials, components and device performance - Provides the latest research on potential solutions, with an eye towards the end goal of system integration - Discusses key problems, such as thermal management, noise reduction, challenges in interconnects and substrates
Download or read book Discontinuous Galerkin Methods written by Bernardo Cockburn and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 468 pages. Available in PDF, EPUB and Kindle. Book excerpt: A class of finite element methods, the Discontinuous Galerkin Methods (DGM), has been under rapid development recently and has found its use very quickly in such diverse applications as aeroacoustics, semi-conductor device simula tion, turbomachinery, turbulent flows, materials processing, MHD and plasma simulations, and image processing. While there has been a lot of interest from mathematicians, physicists and engineers in DGM, only scattered information is available and there has been no prior effort in organizing and publishing the existing volume of knowledge on this subject. In May 24-26, 1999 we organized in Newport (Rhode Island, USA), the first international symposium on DGM with equal emphasis on the theory, numerical implementation, and applications. Eighteen invited speakers, lead ers in the field, and thirty-two contributors presented various aspects and addressed open issues on DGM. In this volume we include forty-nine papers presented in the Symposium as well as a survey paper written by the organiz ers. All papers were peer-reviewed. A summary of these papers is included in the survey paper, which also provides a historical perspective of the evolution of DGM and its relation to other numerical methods. We hope this volume will become a major reference in this topic. It is intended for students and researchers who work in theory and application of numerical solution of convection dominated partial differential equations. The papers were written with the assumption that the reader has some knowledge of classical finite elements and finite volume methods.
Download or read book Energy Efficiency written by James L. Sweeney and published by Hoover Press. This book was released on 2016-08-01 with total page 180 pages. Available in PDF, EPUB and Kindle. Book excerpt: The entire world, especially the United States, is in the midst of an energy revolution. Since the oil embargo of 1973, individuals, corporations, and other organizations have found ways to economically reduce energy use. In this book, Jim Sweeney examines the energy policies and practices of the past forty years and their impact on three crucial systems: the economy, the environment, and national security. He shows how energy-efficiency contributions to the country's overall energy situation have been more powerful than all the increases in the domestic production of oil, gas, coal, geothermal energy, nuclear power, solar power, wind power, and biofuels. The author details the impact of new and improved energy-efficient technologies, the environmental and national security benefits of energy efficiency, ways to amplify energy efficiency, and more. Energy Efficiency: Building a Clean, Secure Economy reveals how the careful nurturing of private- and public-sector energy efficiency--along with public awareness, appropriate pricing, appropriate policies--and increased research and development, the trends of decreasing energy intensity and increasing energy efficiency can be beneficially accelerated.
Download or read book Nanoelectronic Mixed Signal System Design written by Saraju Mohanty and published by McGraw Hill Professional. This book was released on 2015-02-20 with total page 829 pages. Available in PDF, EPUB and Kindle. Book excerpt: Covering both the classical and emerging nanoelectronic technologies being used in mixed-signal design, this book addresses digital, analog, and memory components. Winner of the Association of American Publishers' 2016 PROSE Award in the Textbook/Physical Sciences & Mathematics category. Nanoelectronic Mixed-Signal System Design offers professionals and students a unified perspective on the science, engineering, and technology behind nanoelectronics system design. Written by the director of the NanoSystem Design Laboratory at the University of North Texas, this comprehensive guide provides a large-scale picture of the design and manufacturing aspects of nanoelectronic-based systems. It features dual coverage of mixed-signal circuit and system design, rather than just digital or analog-only. Key topics such as process variations, power dissipation, and security aspects of electronic system design are discussed. Top-down analysis of all stages--from design to manufacturing Coverage of current and developing nanoelectronic technologies--not just nano-CMOS Describes the basics of nanoelectronic technology and the structure of popular electronic systems Reveals the techniques required for design excellence and manufacturability
Download or read book LED Packaging for Lighting Applications written by Shen Liu and published by John Wiley & Sons. This book was released on 2011-07-05 with total page 375 pages. Available in PDF, EPUB and Kindle. Book excerpt: Since the first light-emitting diode (LED) was invented by Holonyak and Bevacqua in 1962, LEDs have made remarkable progress in the past few decades with the rapid development of epitaxy growth, chip design and manufacture, packaging structure, processes, and packaging materials. LEDs have superior characteristics such as high efficiency, small size, long life, low power consumption, and high reliability. The market for white LED is growing rapidly in various applications. It has been widely accepted that white LEDs will be the fourth illumination source to substitute the incandescent, fluorescent, and high-pressure sodium lamps. With the development of LED chip and packaging technologies, the efficiency of high power white LED will broaden the application markets of LEDs while changing the lighting concepts of our lives. In LED Packaging for Lighting Applications, Professors Liu and Luo cover the full spectrum of design, manufacturing, and testing. Many concepts are proposed for the first time, and readers will benefit from the concurrent engineering and co-design approaches to advanced engineering design of LED products. One of the only books to cover LEDs from package design to manufacturing to testing Focuses on the design of LED packaging and its applications such as road lights Includes design methods and experiences necessary for LED engineers, especially optical and thermal design Introduces novel LED packaging structures and manufacturing processes, such as ASLP Covers reliability considerations, the most challenging problem for the LED industry Provides measurement and testing standards, which are critical for LED development, for both LED and LED fixtures Codes and demonstrations available from the book’s Companion Website This book is ideal for practicing engineers working in design or packaging at LED companies and graduate students preparing for work in industry. This book also provides a helpful introduction for advanced undergraduates, graduates, researchers, lighting designers, and product managers interested in the fundamentals of LED design and production. Color version of selected figures can be found at www.wiley.com/go/liu/led
Download or read book Convective Boiling and Condensation written by John G. Collier and published by Clarendon Press. This book was released on 1994-05-19 with total page 646 pages. Available in PDF, EPUB and Kindle. Book excerpt: * Third edition of a well-known and well established text both in industry and for teaching * Fully up-to-date and includes extra problems This book is an aid to heat exchanger design written primarily for design and development engineers in the chemical process, power generation, and refrigeration industries. It provides a comprehensive reference on two-phase flows, boiling, and condensation. The text covers all the latest advances like flows over tube bundles and two-phase heat transfer regarding refrigerants and petrochemicals. Another feature of this third edition is many new problems at chapter ends to enhance its use as a teaching text for graduate and post-graduate courses on two-phase flow and heat transfer. - ;This book is written for practising engineers as a comprehensive reference on two-phase flows, boiling, and condensation. It deals with methods for estimating two-phase flow pressure drops and heat transfer rates. It is a well-known reference book in its third edition and is also used as a text for advanced university courses. Both authors write from practical experience as both are professional engineers. -
Download or read book 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems ITherm written by and published by . This book was released on 2020 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Empirical Inference written by Bernhard Schölkopf and published by Springer Science & Business Media. This book was released on 2013-12-11 with total page 295 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book honours the outstanding contributions of Vladimir Vapnik, a rare example of a scientist for whom the following statements hold true simultaneously: his work led to the inception of a new field of research, the theory of statistical learning and empirical inference; he has lived to see the field blossom; and he is still as active as ever. He started analyzing learning algorithms in the 1960s and he invented the first version of the generalized portrait algorithm. He later developed one of the most successful methods in machine learning, the support vector machine (SVM) – more than just an algorithm, this was a new approach to learning problems, pioneering the use of functional analysis and convex optimization in machine learning. Part I of this book contains three chapters describing and witnessing some of Vladimir Vapnik's contributions to science. In the first chapter, Léon Bottou discusses the seminal paper published in 1968 by Vapnik and Chervonenkis that lay the foundations of statistical learning theory, and the second chapter is an English-language translation of that original paper. In the third chapter, Alexey Chervonenkis presents a first-hand account of the early history of SVMs and valuable insights into the first steps in the development of the SVM in the framework of the generalised portrait method. The remaining chapters, by leading scientists in domains such as statistics, theoretical computer science, and mathematics, address substantial topics in the theory and practice of statistical learning theory, including SVMs and other kernel-based methods, boosting, PAC-Bayesian theory, online and transductive learning, loss functions, learnable function classes, notions of complexity for function classes, multitask learning, and hypothesis selection. These contributions include historical and context notes, short surveys, and comments on future research directions. This book will be of interest to researchers, engineers, and graduate students engaged with all aspects of statistical learning.
Download or read book Encyclopedia of Thermal Packaging Set 1 Thermal Packaging Techniques a 6 Volume Set written by Avram Bar-Cohen and published by World Scientific. This book was released on 2012-02-01 with total page 1582 pages. Available in PDF, EPUB and Kindle. Book excerpt: Packaging, the physical design and implementation of electronic systems is responsible for much of the progress in miniaturization, reliability and functional density achieved by the full range of electronic, microelectronic and nanoelectronic products during the past several decades. The inherent inefficiency of electronic devices and their sensitivity to heat have placed thermal management on the critical path of nearly every organization dealing with traditional electronic product development, as well as emerging, product categories. Successful thermal packaging is the key differentiator in electronic products, as diverse as supercomputers and cell phones, and continues to be of critical importance in the refinement of traditional products and in the development of products for new applications.The Encyclopedia of Thermal Packaging, compiled into four 5-volume sets (Thermal Packaging Techniques, Thermal Packaging Configurations, Thermal Packaging Tools and Thermal Packaging Applications), will provide comprehensive, one-stop treatment of the techniques, configurations, tools and applications of electronic thermal packaging. Each volume in a set comprises 250–350 pages and is written by world experts in thermal management of electronics.
