Download or read book International Conference on Applications and Techniques in Cyber Intelligence ATCI 2019 written by Jemal H. Abawajy and published by Springer. This book was released on 2019-07-31 with total page 2164 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents innovative ideas, cutting-edge findings, and novel techniques, methods, and applications in a broad range of cybersecurity and cyberthreat intelligence areas. As our society becomes smarter, there is a corresponding need to be able to secure our cyberfuture. The approaches and findings described in this book are of interest to businesses and governments seeking to secure our data and underpin infrastructures, as well as to individual users.

Download or read book Printed Electronics Technologies written by Wei Wu and published by Royal Society of Chemistry. This book was released on 2022-07-20 with total page 685 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book describes the key printing technologies for printed electronics.

Download or read book Fiber Reinforced Composites written by Kuruvilla Joseph and published by Woodhead Publishing. This book was released on 2021-03-20 with total page 908 pages. Available in PDF, EPUB and Kindle. Book excerpt: Polymer-based fibre-reinforced composites FRC's have now come out as a major class of structural materials being used or regarded as substituent's for metals in several critical components in space, automotive and other industries (marine, and sports goods) owing to their low density, strength-weight ratio, and fatigue strength. FRC's have several commercial as well as industrial applications ranging from aircraft, space, automotive, sporting goods, marine, and infrastructure. The above-mentioned applications of FRC's clearly reveal that FRC's have the potential to be used in a broad range of different engineering fields with the added advantages of low density, and resistance to corrosion compared to conventional metallic and ceramic composites. However, for scientists/researchers/R&D's to fabricate FRC's with such potential there should be careful and precise design followed by suitable process development based on properties like mechanical, physical, and thermal that are unique to each application. Hence the last few decades have witnessed considerable research on fibre reinforced composites. Fibre Reinforced Composites: Constituents, Compatibility, Perspectives and Applications presents a widespread all-inclusive review on fibre-reinforced composites ranging from the different types of processing techniques to chemical modification of the fibre surface to enhance the interfacial adhesion between the matrix and fibre and the structure-property relationship. It illustrates how high value composites can be produced by efficient and sustainable processing methods by selecting different constituents [fibres and resins]. Researchers in academia working in composites and accompanying areas [materials characterisation] and industrial manufacturers who need information on composite constituents and how they relate to each other for a certain application will find the book extremely useful when they need to make decisions about materials selection for their products. - Focuses on the different types of FRC's that are currently available (e.g. from polymeric matrices to metallic and ceramic matrices, from carbon fibre to different types of natural fibres and from short to long fibre reinforced), their processing techniques, characterization of different properties, and how to improve the interfacial adhesion between an incompatible fibre and matrix and their applications - Looks at crisis areas such as how to incorporate incompatible fibres and matrices together (e.g. Non-polar polypropylene matrix is not compatible with that of polar natural fibres and hence suitable surface modifications are required to make them compatible with each other) along with low cost processing methods, low density and high strength - Uncovers clarifications to both elementary and practical problems related to the fabrication of FRCs - Schematic representations depicting the interaction between different fibre types and matrices will be provided in some chapters

Download or read book Mechatronics 2019 Recent Advances Towards Industry 4 0 written by Roman Szewczyk and published by Springer Nature. This book was released on 2019-08-28 with total page 520 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book gathers papers presented at Mechatronics 2019, an international conference held in Warsaw, Poland, from September 16 to 18, 2019. The contributions discuss the numerous, multidisciplinary technological advances in the field of applied mechatronics that the emerging Industry 4.0 has already yielded. Each chapter presents a particular example of interdisciplinary theoretical knowledge, numerical modelling and simulation, or the application of artificial intelligence techniques. Further, the papers show how both software and physical devices can be incorporated into mechatronic systems to increase production efficiency and resource savings. The results and guidelines presented here will benefit both scientists and engineers looking for solutions to specific industrial and research problems.

Download or read book International Scientific Siberian Transport Forum TransSiberia 2021 written by Aleksey Manakov and published by Springer Nature. This book was released on 2022-03-17 with total page 1595 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents innovations in the field of high-speed rail technology, hyperloop transportation technologies and Maglev system, information and communication technology (ICT) for intelligent transportation systems (ITS), multimodal transportation, sustainable freight transportation, and others. The papers presented in the book are proceedings of the annual scientific forum “TransSiberia”, which is the foremost Russian transport event that focuses on innovations in rail transport. The book also presents research in the field of railway engineering, health monitoring, inspection, NDT&E, and signal processing. Developments in the field of decarbonization of railway transport and new types of fuel as an alternative to electrification are proposed. The issues of sustainable operation and maintenance of railway systems and sustainable freight transportation, such as digitalization and AI technologies for sustainable asset management, operation, and maintenance of railway systems, have received a lot of research attention. The book serves as a medium for railroad academia and industry to exchange new ideas and share the latest achievements, as well as to continue supporting the productivity of the transport industry in a sustainable manner.

Download or read book Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium written by Mohd Arif Anuar Mohd Salleh and published by Springer Nature. This book was released on 2023-07-02 with total page 873 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents peer reviewed articles from the Green Materials and Electronic Packaging Interconnect Technology Symposium, (EPITS 2022), held in Langkawi, Malaysia on 14th and 15th of Sept, 2022. It brings together packaging experts to share and exchange ideas in electronics technology. Topics covered in this volume include, but are not limited to; (1) Green materials and technology, (2) Emerging interconnect materials and technologies,(3) Non-solder interconnect materials at chip and package levels, (4) Fundamental materials behavior for electronic packaging materials, (5) Advanced characterization methods as applied to electronic packaging technology, (6) Developments in high temperature Pb-free solders and associated interconnects for automotive and power electronics, (7) Surface coating materials & (8) Advanced materials. ​

Download or read book Direct Copper Interconnection for Advanced Semiconductor Technology written by Dongkai Shangguan and published by CRC Press. This book was released on 2024-06-28 with total page 549 pages. Available in PDF, EPUB and Kindle. Book excerpt: In the “More than Moore” era, performance requirements for leading edge semiconductor devices are demanding extremely fine pitch interconnection in semiconductor packaging. Direct copper interconnection has emerged as the technology of choice in the semiconductor industry for fine pitch interconnection, with significant benefits for interconnect density and device performance. Low-temperature direct copper bonding, in particular, will become widely adopted for a broad range of highperformance semiconductor devices in the years to come. This book offers a comprehensive review and in-depth discussions of the key topics in this critical new technology. Chapter 1 reviews the evolution and the most recent advances in semiconductor packaging, leading to the requirement for extremely fine pitch interconnection, and Chapter 2 reviews different technologies for direct copper interconnection, with advantages and disadvantages for various applications. Chapter 3 offers an in-depth review of the hybrid bonding technology, outlining the critical processes and solutions. The area of materials for hybrid bonding is covered in Chapter 4, followed by several chapters that are focused on critical process steps and equipment for copper electrodeposition (Chapter 5), planarization (Chapter 6), wafer bonding (Chapter 7), and die bonding (Chapter 8). Aspects related to product applications are covered in Chapter 9 for design and Chapter 10 for thermal simulation. Finally, Chapter 11 covers reliability considerations and computer modeling for process and performance characterization, followed by the final chapter (Chapter 12) outlining the current and future applications of the hybrid bonding technology. Metrology and testing are also addressed throughout the chapters. Business, economic, and supply chain considerations are discussed as related to the product applications and manufacturing deployment of the technology, and the current status and future outlook as related to the various aspects of the ecosystem are outlined in the relevant chapters of the book. The book is aimed at academic and industry researchers as well as industry practitioners, and is intended to serve as a comprehensive source of the most up-to-date knowledge, and a review of the state-of-the art of the technology and applications, for direct copper interconnection and advanced semiconductor packaging in general.

Download or read book Physical Assurance written by Navid Asadizanjani and published by Springer Nature. This book was released on 2021-02-15 with total page 193 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides readers with a comprehensive introduction to physical inspection-based approaches for electronics security. The authors explain the principles of physical inspection techniques including invasive, non-invasive and semi-invasive approaches and how they can be used for hardware assurance, from IC to PCB level. Coverage includes a wide variety of topics, from failure analysis and imaging, to testing, machine learning and automation, reverse engineering and attacks, and countermeasures.

Download or read book Memoirs of the Institute of Scientific and Industrial Research Osaka University written by Ōsaka Daigaku. Sangyō Kagaku Kenkyūjo and published by . This book was released on 2019 with total page 236 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Reliability of Organic Compounds in Microelectronics and Optoelectronics written by Willem Dirk van Driel and published by Springer Nature. This book was released on 2022-01-31 with total page 552 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book aims to provide a comprehensive reference into the critical subject of failure and degradation in organic materials, used in optoelectronics and microelectronics systems and devices. Readers in different industrial sectors, including microelectronics, automotive, lighting, oil/gas, and petrochemical will benefit from this book. Several case studies and examples are discussed, which readers will find useful to assess and mitigate similar failure cases. More importantly, this book presents methodologies and useful approaches in analyzing a failure and in relating a failure to the reliability of materials and systems.

Download or read book Proceedings of the 7th International Corrosion Prevention Symposium for Research Scholars written by Azman Jalar and published by Springer Nature. This book was released on 2022-06-29 with total page 255 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book gathers the latest research, innovations, and applications in the field of corrosion prevention and control, as presented by leading national and international academics, researchers, engineers, and postgraduate students at the AWAM International Conference on Civil Engineering 2022 (AICCE’22), held 7th International Corrosion Prevention Symposium for Research Scholars (CORSYM 2021), held as a virtual conference on November 2021. The CORSYM 2021 theme, Nurturing Future Corrosionist for Better Corrosion Mitigation, covered key topics such as corrosion and inhibitors, corrosion of biomaterials, top of line corrosion, H2S and CO2 corrosion, coatings and composites for biomedical devices, electrochemical testing techniques, advanced materials and coatings, corrosion in concrete structures, welding and hot Corrosion, corrosion in ships and marine structures, corrosion of biomaterials, corrosion Under insulation, digitalization in corrosion. The contributions introduce numerous exciting ideas that spur novel research directions and foster multidisciplinary collaborations between various specialists in the field of corrosion engineering.

Download or read book Information Technology and Systems written by Álvaro Rocha and published by Springer. This book was released on 2019-01-28 with total page 976 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book features a selection of articles from The 2019 International Conference on Information Technology & Systems (ICITS’19), held at the Universidad de Las Fuerzas Armadas, in Quito, Ecuador, on 6th to 8th February 2019. ICIST is a global forum for researchers and practitioners to present and discuss recent findings and innovations, current trends, professional experiences and challenges of modern information technology and systems research, together with their technological development and applications. The main topics covered are: information and knowledge management; organizational models and information systems; software and systems modeling; software systems, architectures, applications and tools; multimedia systems and applications; computer networks, mobility and pervasive systems; intelligent and decision support systems; big data analytics and applications; human–computer interaction; ethics, computers & security; health informatics; information technologies in education; cybersecurity and cyber-defense; electromagnetics, sensors and antennas for security.

Download or read book Embedded Cooling Of Electronic Devices Conduction Evaporation And Single And Two phase Convection written by Madhusudan Iyengar and published by World Scientific. This book was released on 2024-01-10 with total page 479 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is a comprehensive guide on emerging cooling technologies for processors in microelectronics. It covers various topics such as chip-embedded two-phase cooling, monolithic microfluidic cooling, numerical modeling, and advances in materials engineering for conduction-limited direct contact cooling, with a goal to remedy high heat flux issues.The book also discusses the co-design of thermal and electromagnetic properties for the development of light and ultra-high efficiency electric motors. It provides an in-depth analysis of the scaling limits, challenges, and opportunities in embedded cooling, including high power RF amplifiers and self-emissive and liquid crystal displays. Its analysis of emerging cooling technologies provides a roadmap for the future of cooling technology in microelectronics.This book is a good starting point for the electrical and thermal engineers, as well as MS and PhD students, interested in understanding and collaboratively tackling the complex and multidisciplinary field of microelectronics device (embedded) cooling. A basic knowledge of heat conduction and convection is required.

Download or read book Theory and Practice of Thermal Transient Testing of Electronic Components written by Marta Rencz and published by Springer Nature. This book was released on 2023-01-23 with total page 389 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book discusses the significant aspects of thermal transient testing, the most important method of thermal characterization of electronics available today. The book presents the theoretical background of creating structure functions from the measured results with mathematical details. It then shows how the method can be used for thermal qualification, structure integrity testing, determining material parameters, and calibrating simulation models. General practical questions about measurements are discussed to help beginners carry out thermal transient testing. The particular problems and tricks of measuring with various electronic components, such as Si diodes, bipolar transistors, MOS transistors, IGBT devices, resistors, capacitors, wide bandgap materials, and LEDs, are covered in detail with the help of various use cases. This hands-on book will enable readers to accomplish thermal transient testing on any new type of electronics and provides the theoretical details needed to understand the opportunities and limitations offered by the methodology. The book will be an invaluable reference for practicing engineers, students, and researchers.

Download or read book Integrated Photonics for Data Communication Applications written by Madeleine Glick and published by Elsevier. This book was released on 2023-07-26 with total page 523 pages. Available in PDF, EPUB and Kindle. Book excerpt: Integrated Photonics for Data Communications Applications reviews the key concepts, design principles, performance metrics and manufacturing processes from advanced photonic devices to integrated photonic circuits. The book presents an overview of the trends and commercial needs of data communication in data centers and high-performance computing, with contributions from end users presenting key performance indicators. In addition, the fundamental building blocks are reviewed, along with the devices (lasers, modulators, photodetectors and passive devices) that are the individual elements that make up the photonic circuits. These chapters include an overview of device structure and design principles and their impact on performance. Following sections focus on putting these devices together to design and fabricate application-specific photonic integrated circuits to meet performance requirements, along with key areas and challenges critical to the commercial manufacturing of photonic integrated circuits and the supply chains being developed to support innovation and market integration are discussed. This series is led by Dr. Lionel Kimerling Executive at AIM Photonics Academy and Thomas Lord Professor of Materials Science and Engineering at MIT and Dr. Sajan Saini Education Director at AIM Photonics Academy at MIT. Each edited volume features thought-leaders from academia and industry in the four application area fronts (data communications, high-speed wireless, smart sensing, and imaging) and addresses the latest advances. - Includes contributions from leading experts and end-users across academia and industry working on the most exciting research directions of integrated photonics for data communications applications - Provides an overview of data communication-specific integrated photonics starting from fundamental building block devices to photonic integrated circuits to manufacturing tools and processes - Presents key performance metrics, design principles, performance impact of manufacturing variations and operating conditions, as well as pivotal performance benchmarks

Download or read book Lead free Soldering Process Development and Reliability written by Jasbir Bath and published by John Wiley & Sons. This book was released on 2020-07-28 with total page 512 pages. Available in PDF, EPUB and Kindle. Book excerpt: Covering the major topics in lead-free soldering Lead-free Soldering Process Development and Reliability provides a comprehensive discussion of all modern topics in lead-free soldering. Perfect for process, quality, failure analysis and reliability engineers in production industries, this reference will help practitioners address issues in research, development and production. Among other topics, the book addresses: · Developments in process engineering (SMT, Wave, Rework, Paste Technology) · Low temperature, high temperature and high reliability alloys · Intermetallic compounds · PCB surface finishes and laminates · Underfills, encapsulants and conformal coatings · Reliability assessments In a regulatory environment that includes the adoption of mandatory lead-free requirements in a variety of countries, the book’s explanations of high-temperature, low-temperature, and high-reliability lead-free alloys in terms of process and reliability implications are invaluable to working engineers. Lead-free Soldering takes a forward-looking approach, with an eye towards developments likely to impact the industry in the coming years. These will include the introduction of lead-free requirements in high-reliability electronics products in the medical, automotive, and defense industries. The book provides practitioners in these and other segments of the industry with guidelines and information to help comply with these requirements.

Download or read book Interdisciplinary Research for Printing and Packaging written by Pengfei Zhao and published by Springer Nature. This book was released on 2022-04-16 with total page 556 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book includes original, peer-reviewed research papers from the 12th China Academic Conference on Printing and Packaging (CACPP 2021), held in Beijing, China on November 12-14, 2021. The proceedings cover the recent findings in color science and technology, image processing technology, digital media technology, mechanical and electronic engineering and numerical control, materials and detection, digital process management technology in printing and packaging, and other technologies. As such, the book is of interest to university researchers, R&D engineers and graduate students in the field of graphic arts, packaging, color science, image science, material science, computer science, digital media, network technology, and smart manufacturing technology.