Download or read book The Proceedings of the 17th Annual Conference of China Electrotechnical Society written by Kaigui Xie and published by Springer Nature. This book was released on 2023-03-30 with total page 1314 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book gathers outstanding papers presented at the 17th Annual Conference of China Electrotechnical Society, organized by China Electrotechnical Society (CES), held in Beijing, China, from September 17 to 18, 2022. It covers topics such as electrical technology, power systems, electromagnetic emission technology, and electrical equipment. It introduces the innovative solutions that combine ideas from multiple disciplines. The book is very much helpful and useful for the researchers, engineers, practitioners, research students, and interested readers.

Download or read book Handbook of Emerging Materials for Semiconductor Industry written by Young Suh Song and published by Springer Nature. This book was released on with total page 930 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book IMDC IST 2021 written by Abd-Alhameed Raed and published by European Alliance for Innovation. This book was released on 2022-01-26 with total page 1790 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book contains the proceedings of the Second International Conference on Integrated Sciences and Technologies (IMDC-IST-2021). Where held on 7th–9th Sep 2021 in Sakarya, Turkey. This conference was organized by University of Bradford, UK and Southern Technical University, Iraq. The papers in this conference were collected in a proceedings book entitled: Proceedings of the second edition of the International Multi-Disciplinary Conference Theme: “Integrated Sciences and Technologies” (IMDC-IST-2021). The presentation of such a multi-discipline conference provides a lot of exciting insights and new understanding on recent issues in terms of Green Energy, Digital Health, Blended Learning, Big Data, Meta-material, Artificial-Intelligence powered applications, Cognitive Communications, Image Processing, Health Technologies, 5G Communications. Referring to the argument, this conference would serve as a valuable reference for future relevant research activities. The committee acknowledges that the success of this conference are closely intertwined by the contributions from various stakeholders. As being such, we would like to express our heartfelt appreciation to the keynote speakers, invited speakers, paper presenters, and participants for their enthusiastic support in joining the second edition of the International Multi-Disciplinary Conference Theme: “Integrated Sciences and Technologies” (IMDC-IST-2021). We are convinced that the contents of the study from various papers are not only encouraged productive discussion among presenters and participants but also motivate further research in the relevant subject. We appreciate for your enthusiasm to attend our conference and share your knowledge and experience. Your input was important in ensuring the success of our conference. Finally, we hope that this conference serves as a forum for learning in building togetherness and academic networks. Therefore, we expect to see you all at the next IMDC-IST.

Download or read book Carbon Nanotubes for Next Generation Electrical and Electronic Components written by Dr. R. Femi and published by Ashok Yakkaldevi. This book was released on 2023-04-08 with total page 100 pages. Available in PDF, EPUB and Kindle. Book excerpt: Electrical and Electronics Components using Copper (Cu) and Aluminium (Al) as a conducting material for many decades. This work presents the use of Carbon Nano Tubes (CNT) material to replace the traditional electrical and electronics conductive material. Also this work extensively reviewed the use of CNTs for the applications such as transformers, inductors, cables, connectors and motors which can considerably reduce the size and weight of the electrical components. Also, CNTs can be used as a electrical interconnect and bond wire material in electronics semiconductor devices. CNTs are promising conductive material for next generation electrical and electronics devices

Download or read book Interconnect Reliability in Advanced Memory Device Packaging written by Chong Leong, Gan and published by Springer Nature. This book was released on 2023-05-30 with total page 223 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing. In the past 40 years, memory packaging processes have evolved enormously. This book discusses the reliability and technical challenges of first-level interconnect materials, packaging processes, advanced specialty reliability testing, and characterization of interconnects. It also examines the reliability of wire bonding, lead-free solder joints such as reliability testing and data analyses, design for reliability in hybrid packaging and HBM packaging, and failure analyses. The specialty of this book is that the materials covered are not only for second-level interconnects, but also for packaging assembly on first-level interconnects and for the semiconductor back-end on 2.5D and 3D memory interconnects. This book can be used as a text for college and graduate students who have the potential to become our future leaders, scientists, and engineers in the electronics and semiconductor industry.

Download or read book Bio Inspired Algorithms and Devices for Treatment of Cognitive Diseases Using Future Technologies written by Gupta, Shweta and published by IGI Global. This book was released on 2022-02-11 with total page 309 pages. Available in PDF, EPUB and Kindle. Book excerpt: As there are no proper medical tests available to predict certain diseases such as Alzheimer’s and Parkinson’s at an early stage, there is a need to further study and consider the potential uses of bio- and nature-inspired algorithms and future technologies such as machine learning in correlation to disease detection and treatment. Bio-Inspired Algorithms and Devices for Treatment of Cognitive Diseases Using Future Technologies considers new tools for early detection of cognitive brain diseases using devices and algorithms whose basic concept is taken from nature and discusses design, analysis, and application of various bionics or bio-inspired algorithms. Covering topics such as depression and cognitive science, this publication is an ideal resource for researchers, academicians, industry professionals, psychologists, psychiatrists, nurses, engineers, instructors, and students.

Download or read book Silicon Sensors and Actuators written by Benedetto Vigna and published by Springer Nature. This book was released on 2022-04-12 with total page 988 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book thoroughly reviews the present knowledge on silicon micromechanical transducers and addresses emerging and future technology challenges. Readers will acquire a solid theoretical and practical background that will allow them to analyze the key performance aspects of devices, critically judge a fabrication process, and then conceive and design new ones for future applications. Envisioning a future complex versatile microsystem, the authors take inspiration from Richard Feynman’s visionary talk “There is Plenty of Room at the Bottom” to propose that the time has come to see silicon sensors as part of a “Feynman Roadmap” instead of the “More-than-Moore” technology roadmap. The sharing of the author’s industrially proven track record of development, design, and manufacturing, along with their visionary approach to the technology, will allow readers to jump ahead in their understanding of the core of the topic in a very effective way. Students, researchers, engineers, and technologists involved in silicon-based sensor and actuator research and development will find a wealth of useful and groundbreaking information in this book.

Download or read book TSV 3D RF Integration written by Shenglin Ma and published by Elsevier. This book was released on 2022-04-27 with total page 294 pages. Available in PDF, EPUB and Kindle. Book excerpt: TSV 3D RF Integration: High Resistivity Si Interposer Technology systematically introduces the design, process development and application verification of high-resistivity silicon interpose technology, addressing issues of high frequency loss and high integration level. The book includes a detailed demonstration of the design and process development of Hr-Si interposer technology, gives case studies, and presents a systematic literature review. Users will find this to be a resource with detailed demonstrations of the design and process development of HR-Si interposer technologies, including quality monitoring and methods to extract S parameters. A series of cases are presented, including an example of an integrated inductor, a microstrip inter-digital filter, and a stacked patch antenna. Each chapter includes a systematic and comparative review of the research literature, offering researchers and engineers in microelectronics a uniquely useful handbook to help solve problems in 3D heterogenous RF integration oriented Hr-Si interposer technology. - Provides a detailed demonstration of the design and process development of HR-Si (High-Resistivity Silicon) interposer technology - Presents a series of implementation case studies that detail modeling and simulation, integration, qualification and testing methods - Offers a systematic and comparative literature review of HR-Si interposer technology by topic - Offers solutions to problems with TSV (through silicon via) interposer technology, including high frequency loss and cooling problems - Gives a systematic and accessible accounting on this leading technology

Download or read book Direct Copper Interconnection for Advanced Semiconductor Technology written by Dongkai Shangguan and published by CRC Press. This book was released on 2024-06-28 with total page 463 pages. Available in PDF, EPUB and Kindle. Book excerpt: In the “More than Moore” era, performance requirements for leading edge semiconductor devices are demanding extremely fine pitch interconnection in semiconductor packaging. Direct copper interconnection has emerged as the technology of choice in the semiconductor industry for fine pitch interconnection, with significant benefits for interconnect density and device performance. Low-temperature direct copper bonding, in particular, will become widely adopted for a broad range of highperformance semiconductor devices in the years to come. This book offers a comprehensive review and in-depth discussions of the key topics in this critical new technology. Chapter 1 reviews the evolution and the most recent advances in semiconductor packaging, leading to the requirement for extremely fine pitch interconnection, and Chapter 2 reviews different technologies for direct copper interconnection, with advantages and disadvantages for various applications. Chapter 3 offers an in-depth review of the hybrid bonding technology, outlining the critical processes and solutions. The area of materials for hybrid bonding is covered in Chapter 4, followed by several chapters that are focused on critical process steps and equipment for copper electrodeposition (Chapter 5), planarization (Chapter 6), wafer bonding (Chapter 7), and die bonding (Chapter 8). Aspects related to product applications are covered in Chapter 9 for design and Chapter 10 for thermal simulation. Finally, Chapter 11 covers reliability considerations and computer modeling for process and performance characterization, followed by the final chapter (Chapter 12) outlining the current and future applications of the hybrid bonding technology. Metrology and testing are also addressed throughout the chapters. Business, economic, and supply chain considerations are discussed as related to the product applications and manufacturing deployment of the technology, and the current status and future outlook as related to the various aspects of the ecosystem are outlined in the relevant chapters of the book. The book is aimed at academic and industry researchers as well as industry practitioners, and is intended to serve as a comprehensive source of the most up-to-date knowledge, and a review of the state-of-the art of the technology and applications, for direct copper interconnection and advanced semiconductor packaging in general.

Download or read book Theory and Practice of Thermal Transient Testing of Electronic Components written by Marta Rencz and published by Springer Nature. This book was released on 2023-01-23 with total page 389 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book discusses the significant aspects of thermal transient testing, the most important method of thermal characterization of electronics available today. The book presents the theoretical background of creating structure functions from the measured results with mathematical details. It then shows how the method can be used for thermal qualification, structure integrity testing, determining material parameters, and calibrating simulation models. General practical questions about measurements are discussed to help beginners carry out thermal transient testing. The particular problems and tricks of measuring with various electronic components, such as Si diodes, bipolar transistors, MOS transistors, IGBT devices, resistors, capacitors, wide bandgap materials, and LEDs, are covered in detail with the help of various use cases. This hands-on book will enable readers to accomplish thermal transient testing on any new type of electronics and provides the theoretical details needed to understand the opportunities and limitations offered by the methodology. The book will be an invaluable reference for practicing engineers, students, and researchers.

Download or read book International Conference on Innovative Computing and Communications written by Ashish Khanna and published by Springer Nature. This book was released on 2021-08-28 with total page 893 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book includes high-quality research papers presented at the Fourth International Conference on Innovative Computing and Communication (ICICC 2021), which is held at the Shaheed Sukhdev College of Business Studies, University of Delhi, Delhi, India, on February 20–21, 2021. Introducing the innovative works of scientists, professors, research scholars, students and industrial experts in the field of computing and communication, the book promotes the transformation of fundamental research into institutional and industrialized research and the conversion of applied exploration into real-time applications.

Download or read book Advanced Machining Science written by Vijay Kumar Jain and published by CRC Press. This book was released on 2022-09-30 with total page 600 pages. Available in PDF, EPUB and Kindle. Book excerpt: As machining processes become more advanced, so does the science behind them. This book emphasizes these scientific developments in addition to the more widely covered technological aspects, providing a full understanding of how machining has adapted to material constraints and moved beyond conventional methods in recent years. Numerous processes have been developed to allow the use of increasingly tough, corrosion-resistant, and temperature-resistant materials in machining. The advanced machining processes covered in this book range from mechanical, thermoelectric, and electrochemical, including abrasive water jet machining, electric discharge machining and micromachining, ion beam machining, and hybrid processes. It also addresses the sustainability issues raised by these processes. The underlying science of machining is centered throughout, as none of these processes can reach their full potential without both technical expertise and scientific understanding. Advanced Machining Science and its scientific approach will be of particular interest to students, researchers, and shop floor engineers.

Download or read book Micro and Nanotechnology Enabled Applications for Portable Miniaturized Analytical Systems written by Sabu Thomas and published by Elsevier. This book was released on 2021-10-12 with total page 440 pages. Available in PDF, EPUB and Kindle. Book excerpt: Micro- and Nanotechnology Enabled Applications for Portable Miniaturized Analytical Systems outlines the basic principles of miniaturized analytical devices, such as spectrometric, separation, imaging and electrochemical miniaturized instruments. Concepts such as smartphone-enabled miniaturized detection systems and micro/nanomachines are also reviewed. Subsequent chapters explore the emerging application of these mobile devices for miniaturized analysis in various fields, including medicine and biomedicine, environmental chemistry, food chemistry, and forensic chemistry. This is an important reference source for materials scientists and engineers wanting to understand how miniaturization techniques are being used to create a range of efficient, sustainable electronic and optical devices. Miniaturization describes the concept of manufacturing increasingly smaller mechanical, optical, and electronic products and devices. These smaller instruments can be used to produce micro- and nanoscale components required for analytical procedures. A variety of micro/nanoscale materials have been synthesized and used in analytical procedures, such as sensing materials, sorbents, adsorbents, catalysts, and reactors. The miniaturization of analytical instruments can be applied to the different steps of analytical procedures, such as sample preparation, analytical separation, and detection, reducing the total cost of manufacturing the instruments and the needed reagents and organic solvents. - Outlines how miniaturization techniques can be used to create new optical and electronic micro- and nanodevices - Explores major application areas, including biomedicine, environmental science and security - Assesses the major challenges of using miniaturization techniques

Download or read book Advanced Materials and Components for 5G and Beyond written by Colin Tong and published by Springer Nature. This book was released on 2022-11-16 with total page 276 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides a comprehensive introduction to the current status and future trends of materials and component design for fifth-generation (5G) wireless communications and beyond. Necessitated by rapidly increasing numbers of mobile devices and data volumes, and acting as a driving force for innovation in information technology, 5G networks are broadly characterized by ubiquitous connectivity, extremely low latency, and very high-speed data transfer. Such capabilities are facilitated by nanoscale and massive multi-input multi-output (MIMO) with extreme base station and device densities, as well as unprecedented numbers of antennas. This book covers semiconductor solutions for 5G electronics, design and performance enhancement for 5G antennas, high frequency PCB materials and design requirements, materials for high frequency filters, EMI shielding materials and absorbers for 5G systems, thermal management materials and components, and protective packaging and sealing materials for 5G devices. It explores fundamental physics, design, and engineering aspects, as well as the full array of state-of-the-art applications of 5G-and-beyond wireless communications. Future challenges and potential trends of 5G-and-beyond applications and related materials technologies are also addressed. Throughout this book, illustrations clarify core concepts, techniques, and processes. At the end of each chapter, references serve as a gateway to the primary literature in the field. This book is essential reading for today’s students, scientists, engineers and professionals who want to understand the current status and future trends in materials advancement and component design in 5G and beyond, and acquire skills for selecting and using materials and 5G component design that takes economic and regulatory aspects into account.

Download or read book Flexible Sensors for Energy Harvesting Applications written by Anindya Nag and published by Springer Nature. This book was released on 2022-04-21 with total page 244 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book investigates the fabrication of different types of flexible sensors and their subsequent implementation for energy-harvesting applications. A range of techniques, including 3D printing, soft lithography, laser ablation, micro-contract printing, screen-printing, inkjet printing and others have been used to form the flexible sensors with varied characteristics. These sensors have been used for biomedical, environmental and healthcare applications on the basis of their performances. The quality of these flexible sensors has depended on certain types of nanomaterials that have been used to synthesize the conductive parts of the prototypes. These nanomaterials have been based on different sizes and shapes, whose quality varied on the basis of certain factors like crystallinity, shapes and sizes. One of the primary utilization of these nanotechnology-based flexible sensors has been the harvesting of energy where nano-generators and nano-harvesters have been formed to generate and store energy, respectively, on small and moderate magnitudes. Mechanical and thermal energies have been harvested on the basis of the piezoelectric, pyroelectric and triboelectric effects created by the formed prototypes. The work highlights the amalgamation of these sectors to spotlight the essence of these types of sensors and their intended application.

Download or read book More than Moore Devices and Integration for Semiconductors written by Francesca Iacopi and published by Springer Nature. This book was released on 2023-02-17 with total page 271 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides readers with a comprehensive, state-of-the-art reference for miniaturized More-than-Moore systems with a broad range of functionalities that can be added to 3D microsystems, including flexible electronics, metasurfaces and power sources. The book also includes examples of applications for brain-computer interfaces and event-driven imaging systems. Provides a comprehensive, state-of-the-art reference for miniaturized More-than-Moore systems; Covers functionalities to add to 3D microsystems, including flexible electronics, metasurfaces and power sources; Includes current applications, such as brain-computer interfaces, event - driven imaging and edge computing.

Download or read book Thermal and Electro Thermal System Simulation written by Márta Rencz and published by MDPI. This book was released on 2019-11-18 with total page 222 pages. Available in PDF, EPUB and Kindle. Book excerpt: With increasing power levels and power densities in electronics systems, thermal issues are becoming more and more critical. The elevated temperatures result in changing electrical system parameters, changing the operation of devices, and sometimes even the destruction of devices. To prevent this, the thermal behavior has to be considered in the design phase. This can be done with thermal end electro-thermal design and simulation tools. This Special Issue of Energies, edited by two well-known experts of the field, Prof. Marta Rencz, Budapest University of Technology and Economics, and by Prof. Lorenzo Codecasa, Politecnico di Milano, collects twelve papers carefully selected for the representation of the latest results in thermal and electro-thermal system simulation. These contributions present a good survey of the latest results in one of the most topical areas in the field of electronics: The thermal and electro-thermal simulation of electronic components and systems. Several papers of this issue are extended versions of papers presented at the THERMINIC 2018 Workshop, held in Stockholm in the fall of 2018. The papers presented here deal with modeling and simulation of state-of-the-art applications that are highly critical from the thermal point of view, and around which there is great research activity in both industry and academia. Contributions covered the thermal simulation of electronic packages, electro-thermal advanced modeling in power electronics, multi-physics modeling and simulation of LEDs, and the characterization of interface materials, among other subjects.