Download or read book Proceedings of the International Conference on Information Control Electrical Engineering and Rail Transit written by Sanjay Yadav and published by Springer Nature. This book was released on 2023-12-23 with total page 378 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book includes the peer-reviewed proceedings of the 2nd International Conference on Information Control, Electrical Engineering, and Rail Transit (ICEERT 2022). This book provides the advanced research results of transportation and covers the main research fields of information control, traffic information engineering, and control, intelligent transit, logistics, etc. This book aims to promote a new green and intelligent mode of rail transit between scholars from the top universities, research centers, and high-tech enterprises around the world, which is beneficial to researchers and practitioners in mechanical engineering.
Download or read book Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium written by Mohd Arif Anuar Mohd Salleh and published by Springer Nature. This book was released on 2023-07-02 with total page 873 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents peer reviewed articles from the Green Materials and Electronic Packaging Interconnect Technology Symposium, (EPITS 2022), held in Langkawi, Malaysia on 14th and 15th of Sept, 2022. It brings together packaging experts to share and exchange ideas in electronics technology. Topics covered in this volume include, but are not limited to; (1) Green materials and technology, (2) Emerging interconnect materials and technologies,(3) Non-solder interconnect materials at chip and package levels, (4) Fundamental materials behavior for electronic packaging materials, (5) Advanced characterization methods as applied to electronic packaging technology, (6) Developments in high temperature Pb-free solders and associated interconnects for automotive and power electronics, (7) Surface coating materials & (8) Advanced materials.
Download or read book Organic and Inorganic Light Emitting Diodes written by T.D. Subash and published by CRC Press. This book was released on 2023-06-19 with total page 199 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book covers a comprehensive range of topics on the physical mechanisms of LEDs (light emitting diodes), scattering effects, challenges in fabrication and efficient enhancement techniques in organic and inorganic LEDs. It deals with various reliability issues in organic/inorganic LEDs like trapping and scattering effects, packaging failures, efficiency droops, irradiation effects, thermal degradation mechanisms, and thermal degradation processes. Features: Provides insights into the improvement of performance and reliability of LEDs Highlights the optical power improvement mechanisms in LEDs Covers the challenges in fabrication and packaging of LEDs Discusses pertinent failures and degradation mechanisms Includes droop minimization techniques This book is aimed at researchers and graduate students in LEDs, illumination engineering, optoelectronics, and polymer/organic materials.
Download or read book Electron Statistics In Quantum Confined Superlattices written by Kamakhya Prasad Ghatak and published by World Scientific. This book was released on 2023-03-14 with total page 790 pages. Available in PDF, EPUB and Kindle. Book excerpt: The concepts of the Electron Statistics (ES) and the ES dependent electronic properties are basic pillars in semiconductor electronics and this first-of-its-kind book deals with the said concepts in doping superlattices (SLs), quantum well, quantum wire and quantum dot SLs, effective mass SLs, SLs with graded interfaces and Fibonacci SLs under different physical conditions respectively. The influences of intense radiation and strong electric fields under said concepts have been considered together with the heavily doped SLs in this context on the basis of newly formulated the electron energy spectra in all the cases. We have suggested experimental determinations of the Einstein relation for the Diffusivity-Mobility ratio, the Debye screening length, Elastic Constants and the content of this book finds 25 different applications in the arena of nanoscience and nanotechnology.This book contains hundred open research problems which form the integral part of the text and are useful for both PhD aspirants and researchers. It is written for post graduate students of various departments of different academic organizations, engineers and professionals in the fields of solid state electronics, materials science, solid state sciences, nano-science, nanotechnology and nano materials in general.
Download or read book Resilient and Responsible Smart Cities written by Hugo Rodrigues and published by Springer Nature. This book was released on 2022-07-22 with total page 170 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book gathers current research studies which explore new technologies in architecture and urban practices which ensure the efficient management of cities’ infrastructures and provide new solutions to the complex complications that may result in the tackling of challenges of population density, traffic planning, and city planning at the neighborhood scale or rather the scale of buildings and everyday life. It offers a path towards city resilience and sustainable infrastructure with the aim of meeting the demands of mega-cities. The primary audience of this book will be academics and professionals from the fields of architecture, urban planning, civil engineering, computer sciences, and mathematics. The book will aid them in their contributions to the implementation of sustainable development goals.
Download or read book 2020 21st International Conference on Electronic Packaging Technology ICEPT written by and published by . This book was released on 2020 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Integrated Photonics for Data Communication Applications written by Madeleine Glick and published by Elsevier. This book was released on 2023-07-26 with total page 523 pages. Available in PDF, EPUB and Kindle. Book excerpt: Integrated Photonics for Data Communications Applications reviews the key concepts, design principles, performance metrics and manufacturing processes from advanced photonic devices to integrated photonic circuits. The book presents an overview of the trends and commercial needs of data communication in data centers and high-performance computing, with contributions from end users presenting key performance indicators. In addition, the fundamental building blocks are reviewed, along with the devices (lasers, modulators, photodetectors and passive devices) that are the individual elements that make up the photonic circuits. These chapters include an overview of device structure and design principles and their impact on performance. Following sections focus on putting these devices together to design and fabricate application-specific photonic integrated circuits to meet performance requirements, along with key areas and challenges critical to the commercial manufacturing of photonic integrated circuits and the supply chains being developed to support innovation and market integration are discussed. This series is led by Dr. Lionel Kimerling Executive at AIM Photonics Academy and Thomas Lord Professor of Materials Science and Engineering at MIT and Dr. Sajan Saini Education Director at AIM Photonics Academy at MIT. Each edited volume features thought-leaders from academia and industry in the four application area fronts (data communications, high-speed wireless, smart sensing, and imaging) and addresses the latest advances. - Includes contributions from leading experts and end-users across academia and industry working on the most exciting research directions of integrated photonics for data communications applications - Provides an overview of data communication-specific integrated photonics starting from fundamental building block devices to photonic integrated circuits to manufacturing tools and processes - Presents key performance metrics, design principles, performance impact of manufacturing variations and operating conditions, as well as pivotal performance benchmarks
Download or read book Die Attach Materials for High Temperature Applications in Microelectronics Packaging written by Kim S. Siow and published by Springer. This book was released on 2019-01-29 with total page 292 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents the scientific principles, processing conditions, probable failure mechanisms, and a description of reliability performance and equipment required for implementing high-temperature and lead-free die attach materials. In particular, it addresses the use of solder alloys, silver and copper sintering, and transient liquid-phase sintering. While different solder alloys have been used widely in the microelectronics industry, the implementation of sintering silver and transient liquid-phase sintering remains limited to a handful of companies. Hence, the book devotes many chapters to sintering technologies, while simultaneously providing only a cursory coverage of the more widespread techniques employing solder alloys. Addresses the differences between sintering and soldering (the current die-attach technologies), thereby comprehensively addressing principles, methods, and performance of these high-temperature die-attach materials; Emphasizes the industrial perspective, with chapters written by engineers who have hands-on experience using these technologies; Baker Hughes, Bosch and ON Semiconductor, are represented as well as materials suppliers such as Indium; Simultaneously provides the detailed science underlying these technologies by leading academic researchers in the field.
Download or read book 2021 22nd International Conference on Electronic Packaging Technology ICEPT written by and published by . This book was released on 2021 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book 2018 19th International Conference on Electronic Packaging Technology ICEPT written by IEEE Staff and published by . This book was released on 2018-08-08 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: ICEPT 2018 is a four day event, featuring technical sessions, invited talks, professional development courses, exhibition, and social networking activities It aims to cover the latest technological developments in electronic packaging, manufacturing and packaging equipment, and provide opportunities to explore the trends of research and development, as well as business in China
Download or read book The Technological and Economic Future of Nuclear Power written by Reinhard Haas and published by Springer. This book was released on 2019-04-26 with total page 382 pages. Available in PDF, EPUB and Kindle. Book excerpt: This open access book discusses the eroding economics of nuclear power for electricity generation as well as technical, legal, and political acceptance issues. The use of nuclear power for electricity generation is still a heavily disputed issue. Aside from technical risks, safety issues, and the unsolved problem of nuclear waste disposal, the economic performance is currently a major barrier. In recent years, the costs have skyrocketed especially in the European countries and North America. At the same time, the costs of alternatives such as photovoltaics and wind power have significantly decreased.
Download or read book 2013 14th International Conference on Electronic Packaging Technology ICEPT written by IEEE Staff and published by . This book was released on 2013-08-11 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book The 17th International Conference on Electronic Packaging Technology written by Keyun Bi and published by . This book was released on 2016 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book 2016 17th International Conference on Electronic Packaging Technology ICEPT written by IEEE Staff and published by . This book was released on 2016-08-16 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: ICEPT 2016 is a four day event, featuring technical sessions, invited talks, professional development courses, exhibition, and social networking activities It aims to cover the latest technological developments in electronic packaging, manufacturing and packaging equipment, and provide opportunities to explore the trends of research and development, as well as business in China
Download or read book Advances in Smart Communication Technology and Information Processing written by Soumen Banerjee and published by Springer Nature. This book was released on 2021-02-15 with total page 484 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is a collection of best selected research papers presented at the 6th International Conference on Opto-Electronics and Applied Optics (OPTRONIX 2020) organized by the University of Engineering & Management, Kolkata, India, in June 2020. The primary focus is to address issues and developments in optoelectronics with particular emphasis on communication technology, IoT and intelligent systems, information processing and its different kinds. The theme of the book is in alignment with the theme of the conference “Advances in Smart Communication Technology and Information Processing.” The purpose of this book is to inform the scientists and researchers of this field in India and abroad about the latest developments in the relevant field and to raise awareness among the academic fraternity to get them involved in different activities in the years ahead – an effort to realize knowledge-based society.
Download or read book 2017 18th International Conference on Electronic Packaging Technology ICEPT written by IEEE Staff and published by . This book was released on 2017-08-16 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: The conference will exchange the latest developments in the field of electronic packaging technology through exhibitions, special lectures, special reports, thematic forums, club reports, posters and other forms of experience
Download or read book 3D Microelectronic Packaging written by Yan Li and published by Springer. This book was released on 2016-10-29 with total page 560 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, advanced materials, heat dissipation, thermal management, thermal mechanical modeling, quality, reliability, fault isolation, and failure analysis of 3D microelectronic packages. Numerous images, tables, and didactic schematics are included throughout. This essential volume equips readers with an in-depth understanding of all aspects of 3D packaging, including packaging architecture, processing, thermal mechanical and moisture related reliability concerns, common failures, developing areas, and future challenges, providing insights into key areas for future research and development.
