Download or read book 2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits IPFA written by IEEE Staff and published by . This book was released on 2017-07-04 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: The IPFA will be devoted to the fundamental understanding of the physical mechanisms of semiconductor device failures and issues related to semiconductor device reliability and yield, especially those related to advanced process technologies

Download or read book 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits IPFA 2017 written by and published by . This book was released on 2017 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book 2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits IPFA written by IEEE Staff and published by . This book was released on 2018-07-16 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: IPFA 2018 is devoted to the fundamental understanding of the electrical and physical characterization techniques and associated technologies that assist in probing the nature of wear out and failure in conventional and new CMOS devices, in turn resulting in improved knowhow of the physics of device circuit module failure that serves as critical input for future design for reliability

Download or read book ISTFA 2019 Proceedings of the 45th International Symposium for Testing and Failure Analysis written by and published by ASM International. This book was released on 2019-12-01 with total page 540 pages. Available in PDF, EPUB and Kindle. Book excerpt: The theme for the 2019 conference is Novel Computing Architectures. Papers will include discussions on the advent of Artificial Intelligence and the promise of quantum computing that are driving disruptive computing architectures; Neuromorphic chip designs on one hand, and Quantum Bits on the other, still in R&D, will introduce new computing circuitry and memory elements, novel materials, and different test methodologies. These novel computing architectures will require further innovation which is best achieved through a collaborative Failure Analysis community composed of chip manufacturers, tool vendors, and universities.

Download or read book ISTFA 2018 Proceedings from the 44th International Symposium for Testing and Failure Analysis written by and published by ASM International. This book was released on 2018-12-01 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: The International Symposium for Testing and Failure Analysis (ISTFA) 2018 is co-located with the International Test Conference (ITC) 2018, October 28 to November 1, in Phoenix, Arizona, USA at the Phoenix Convention Center. The theme for the November 2018 conference is "Failures Worth Analyzing." While technology advances fast and the market demands the latest and the greatest, successful companies strive to stay competitive and remain profitable.

Download or read book 2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits IPFA written by IEEE Staff and published by . This book was released on 2016-07-18 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: IPFA is devoted to the fundamental understanding of the physical mechanisms of semiconductor device failures and issues related to semiconductor device reliability, yield and performance, especially those related to advanced process technologies

Download or read book Advances in Non volatile Memory and Storage Technology written by Yoshio Nishi and published by Woodhead Publishing. This book was released on 2019-06-15 with total page 662 pages. Available in PDF, EPUB and Kindle. Book excerpt: Advances in Nonvolatile Memory and Storage Technology, Second Edition, addresses recent developments in the non-volatile memory spectrum, from fundamental understanding, to technological aspects. The book provides up-to-date information on the current memory technologies as related by leading experts in both academia and industry. To reflect the rapidly changing field, many new chapters have been included to feature the latest in RRAM technology, STT-RAM, memristors and more. The new edition describes the emerging technologies including oxide-based ferroelectric memories, MRAM technologies, and 3D memory. Finally, to further widen the discussion on the applications space, neuromorphic computing aspects have been included. This book is a key resource for postgraduate students and academic researchers in physics, materials science and electrical engineering. In addition, it will be a valuable tool for research and development managers concerned with electronics, semiconductors, nanotechnology, solid-state memories, magnetic materials, organic materials and portable electronic devices. Discusses emerging devices and research trends, such as neuromorphic computing and oxide-based ferroelectric memories Provides an overview on developing nonvolatile memory and storage technologies and explores their strengths and weaknesses Examines improvements to flash technology, charge trapping and resistive random access memory

Download or read book Flexible Electronic Packaging and Encapsulation Technology written by Hong Meng and published by John Wiley & Sons. This book was released on 2024-03-25 with total page 389 pages. Available in PDF, EPUB and Kindle. Book excerpt: Flexible Electronic Packaging and Encapsulation Technology A systematic introduction to the future of electronic packaging Electronic packaging materials are among the most important components of the broader electronics industry, capable of facilitating heat dissipation, redistributing stress on electronic components, and providing environmental protections for electronic systems. Recent advances in integrated circuits, especially the development of flexible electronic technology, have placed increasingly stringent demands on the capabilities of electronic packaging. These technologies have the potential to reshape our world, and they demand a generation of engineers capable of harnessing that potential. Flexible Electronic Packaging and Encapsulation Technology meets this demand with an introduction to the cutting-edge technologies available to package electronic components, as well as the testing methods and applications that bring these technologies to bear on the industry. These packaging technologies promise to bring lightness, flexibility, and environmental friendliness to the next generation of electronic systems. Flexible Electronic Packaging and Encapsulation Technology readers will also find: Survey of commercial electronic packaging materials and patents for reference purposes Guidelines for designing high-performance packaging materials with novel structures An authorial team of leading researchers in the field Flexible Electronic Packaging and Encapsulation Technology is ideal for materials scientists, electronics engineers, solid state physicists, professionals in the semiconductor industry, and any other researchers or professionals working with electronic systems.

Download or read book ISTFA 2017 Proceedings from the 43rd International Symposium for Testing and Failure Analysis written by and published by ASM International. This book was released on 2017-12-01 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: The theme for the November 2017 conference was Striving for 100% Success Rate. Papers focus on the tools and techniques needed for maximizing the success rate in every aspect of the electronic device failure analysis process.

Download or read book Memristors for Neuromorphic Circuits and Artificial Intelligence Applications written by Jordi Suñé and published by MDPI. This book was released on 2020-04-09 with total page 244 pages. Available in PDF, EPUB and Kindle. Book excerpt: Artificial Intelligence (AI) has found many applications in the past decade due to the ever increasing computing power. Artificial Neural Networks are inspired in the brain structure and consist in the interconnection of artificial neurons through artificial synapses. Training these systems requires huge amounts of data and, after the network is trained, it can recognize unforeseen data and provide useful information. The so-called Spiking Neural Networks behave similarly to how the brain functions and are very energy efficient. Up to this moment, both spiking and conventional neural networks have been implemented in software programs running on conventional computing units. However, this approach requires high computing power, a large physical space and is energy inefficient. Thus, there is an increasing interest in developing AI tools directly implemented in hardware. The first hardware demonstrations have been based on CMOS circuits for neurons and specific communication protocols for synapses. However, to further increase training speed and energy efficiency while decreasing system size, the combination of CMOS neurons with memristor synapses is being explored. The memristor is a resistor with memory which behaves similarly to biological synapses. This book explores the state-of-the-art of neuromorphic circuits implementing neural networks with memristors for AI applications.

Download or read book 2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits IPFA written by IEEE Staff and published by . This book was released on 2019-07-02 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: The IPFA will be devoted to the fundamental understanding of the physical mechanisms of semiconductor device failures and issues related to semiconductor device reliability and yield, especially those related to advanced process technologies

Download or read book Intelligent Manufacturing and Mechatronics written by Mohd Najib Ali Mokhtar and published by Springer Nature. This book was released on 2022-01-24 with total page 579 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents the proceedings of SympoSIMM 2021, the 4th edition of the Symposium on Intelligent Manufacturing and Mechatronics. Focusing on “Strengthening Innovations Towards Industry 4.0”, the book is divided into five parts covering various areas of manufacturing engineering and mechatronics stream, namely, intelligent manufacturing and artificial intelligence, Instrumentation and control, design modelling and simulation, process and machining technology, and smart material. The book will be a valuable resource for readers wishing to embrace the new era of Industry 4.0.

Download or read book Electrical Atomic Force Microscopy for Nanoelectronics written by Umberto Celano and published by Springer. This book was released on 2019-08-01 with total page 408 pages. Available in PDF, EPUB and Kindle. Book excerpt: The tremendous impact of electronic devices on our lives is the result of continuous improvements of the billions of nanoelectronic components inside integrated circuits (ICs). However, ultra-scaled semiconductor devices require nanometer control of the many parameters essential for their fabrication. Through the years, this created a strong alliance between microscopy techniques and IC manufacturing. This book reviews the latest progress in IC devices, with emphasis on the impact of electrical atomic force microscopy (AFM) techniques for their development. The operation principles of many techniques are introduced, and the associated metrology challenges described. Blending the expertise of industrial specialists and academic researchers, the chapters are dedicated to various AFM methods and their impact on the development of emerging nanoelectronic devices. The goal is to introduce the major electrical AFM methods, following the journey that has seen our lives changed by the advent of ubiquitous nanoelectronics devices, and has extended our capability to sense matter on a scale previously inaccessible.

Download or read book Handbook of Silicon Based MEMS Materials and Technologies written by Markku Tilli and published by Elsevier. This book was released on 2020-04-17 with total page 1028 pages. Available in PDF, EPUB and Kindle. Book excerpt: Handbook of Silicon Based MEMS Materials and Technologies, Third Edition is a comprehensive guide to MEMS materials, technologies, and manufacturing with a particular emphasis on silicon as the most important starting material used in MEMS. The book explains the fundamentals, properties (mechanical, electrostatic, optical, etc.), materials selection, preparation, modeling, manufacturing, processing, system integration, measurement, and materials characterization techniques of MEMS structures. The third edition of this book provides an important up-to-date overview of the current and emerging technologies in MEMS making it a key reference for MEMS professionals, engineers, and researchers alike, and at the same time an essential education material for undergraduate and graduate students. Provides comprehensive overview of leading-edge MEMS manufacturing technologies through the supply chain from silicon ingot growth to device fabrication and integration with sensor/actuator controlling circuits Explains the properties, manufacturing, processing, measuring and modeling methods of MEMS structures Reviews the current and future options for hermetic encapsulation and introduces how to utilize wafer level packaging and 3D integration technologies for package cost reduction and performance improvements Geared towards practical applications presenting several modern MEMS devices including inertial sensors, microphones, pressure sensors and micromirrors

Download or read book Advances in Microelectronics Reviews Vol 2 written by Sergey Yurish and published by Lulu.com. This book was released on 2019-08-06 with total page 516 pages. Available in PDF, EPUB and Kindle. Book excerpt: The 2nd volume of 'Advances in Microelectronics: Reviews' Book Series is written by 57 contributors from academy and industry from 11 countries (Bulgaria, Hungary, Iran, Japan, Malaysia, Romania, Russia, Slovak Republic, Spain, Ukraine and USA). The book contains 13 chapters from different areas of microelectronics: MEMS, materials characterization, and various microelectronic devices. With unique combination of information in each volume, the Book Series will be of value for scientists and engineers in industry and at universities. Each of chapter is ending by well selected list of references with books, journals, conference proceedings and web sites. This book ensures that readers will stay at the cutting edge of the field and get the right and effective start point and road map for the further researches and developments.

Download or read book 2013 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits IPFA written by Institute of Electrical and Electronics Engineers (New York, NY). Nanjing Section and published by . This book was released on 2013-07-15 with total page 773 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book 2015 IEEE 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits IPFA written by IEEE Staff and published by . This book was released on 2015-06-29 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: IPFA 2015 will be devoted to the fundamental understanding of the physical mechanisms of semiconductor device failures and issues related to semiconductor device reliability and yield, especially those related to advanced process technologies, which include Sample Preparation, Metrology and Material Characterization Advanced Failure Analysis Techniques Die Level Package Level Failure Analysis Case Study & Failure Mechanisms Novel CMOS Gate Stack Dielectrics and FEOL Reliability and Failure Mechanisms Product Reliability Evaluation and Approaches Device (Ge, III V, TFT, Memory, MEMS, LED etc ) Reliability and Failure Mechanisms Advanced Interconnects and BEOL Reliability and Failure Mechanism