Download or read book 2015 16th International Conference on Electronic Packaging Technology ICEPT written by IEEE Staff and published by . This book was released on 2015-08-11 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: ICEPT 2015 is a four day event, featuring technical sessions, invited talks, professional development courses, exhibition, and social networking activities It aims to cover the latest technological developments in electronic packaging, manufacturing and packaging equipment, and provide opportunities to explore the trends of research and development, as well as business in China

Download or read book Interconnect Technologies for Integrated Circuits and Flexible Electronics written by Yash Agrawal and published by Springer Nature. This book was released on 2023-10-17 with total page 286 pages. Available in PDF, EPUB and Kindle. Book excerpt: This contributed book provides a thorough understanding of the basics along with detailed state-of-the-art emerging interconnect technologies for integrated circuit design and flexible electronics. It focuses on the investigation of advanced on-chip interconnects which match the current as well as future technology requirements. The contents focus on different aspects of interconnects such as material, physical characteristics, parasitic extraction, design, structure, modeling, machine learning, and neural network-based models for interconnects, signaling schemes, varying signal integrity performance analysis, variability, reliability aspects, associated electronic design automation tools. The book also explores interconnect technologies for flexible electronic systems. It also highlights the integration of sensors with stretchable interconnects to demonstrate the concept of a stretchable sensing network for wearable and flexible applications. This book is a useful guide for those working in academia and industry to understand the fundamentals and application of interconnect technologies.

Download or read book Electronic Enclosures Housings and Packages written by Frank Suli and published by Woodhead Publishing. This book was released on 2018-11-01 with total page 490 pages. Available in PDF, EPUB and Kindle. Book excerpt: Electronic Enclosures, Housings and Packages considers the problem of heat management for electronics from an encasement perspective. It addresses enclosures and their applications for industrial electronics, as well as LED lighting solutions for stationary and mobile markets. The book introduces fundamental concepts and defines dimensions of success in electrical enclosures. Other chapters discuss environmental considerations, shielding, standardization, materials selection, thermal management, product design principles, manufacturing techniques and sustainability. Final chapters focus on business fundamentals by outlining successful technical propositions and potential future directions.

Download or read book The Proceedings of 2023 International Conference on Wireless Power Transfer ICWPT2023 written by Chunwei Cai and published by Springer Nature. This book was released on with total page 701 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Transparent Conductive Materials written by David Levy and published by John Wiley & Sons. This book was released on 2019-04-29 with total page 390 pages. Available in PDF, EPUB and Kindle. Book excerpt: Edited by well-known pioneers in the field, this handbook and ready reference provides a comprehensive overview of transparent conductive materials with a strong application focus. Following an introduction to the materials and recent developments, subsequent chapters discuss the synthesis and characterization as well as the deposition techniques that are commonly used for energy harvesting and light emitting applications. Finally, the book concludes with a look at future technological advances. All-encompassing and up-to-date, this interdisciplinary text runs the gamut from chemistry and materials science to engineering, from academia to industry, and from fundamental challenges to readily available applications.

Download or read book Power Electronics in Renewable Energy Systems and Smart Grid written by Bimal K. Bose and published by John Wiley & Sons. This book was released on 2019-06-27 with total page 745 pages. Available in PDF, EPUB and Kindle. Book excerpt: The comprehensive and authoritative guide to power electronics in renewable energy systems Power electronics plays a significant role in modern industrial automation and high- efficiency energy systems. With contributions from an international group of noted experts, Power Electronics in Renewable Energy Systems and Smart Grid: Technology and Applications offers a comprehensive review of the technology and applications of power electronics in renewable energy systems and smart grids. The authors cover information on a variety of energy systems including wind, solar, ocean, and geothermal energy systems as well as fuel cell systems and bulk energy storage systems. They also examine smart grid elements, modeling, simulation, control, and AI applications. The book's twelve chapters offer an application-oriented and tutorial viewpoint and also contain technology status review. In addition, the book contains illustrative examples of applications and discussions of future perspectives. This important resource: Includes descriptions of power semiconductor devices, two level and multilevel converters, HVDC systems, FACTS, and more Offers discussions on various energy systems such as wind, solar, ocean, and geothermal energy systems, and also fuel cell systems and bulk energy storage systems Explores smart grid elements, modeling, simulation, control, and AI applications Contains state-of-the-art technologies and future perspectives Provides the expertise of international authorities in the field Written for graduate students, professors in power electronics, and industry engineers, Power Electronics in Renewable Energy Systems and Smart Grid: Technology and Applications offers an up-to-date guide to technology and applications of a wide-range of power electronics in energy systems and smart grids.

Download or read book Materials for Advanced Packaging written by Daniel Lu and published by Springer. This book was released on 2016-11-18 with total page 974 pages. Available in PDF, EPUB and Kindle. Book excerpt: Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.

Download or read book Resilient Hybrid Electronics for Extreme Harsh Environments written by Amanda Schrand and published by CRC Press. This book was released on 2024-06-06 with total page 187 pages. Available in PDF, EPUB and Kindle. Book excerpt: The success of future innovative technology relies upon a community with a shared vision. Here, we present an overview of the latest technological progress in the field of printed electronics for use in harsh or extreme environments. Each chapter unlocksscientific and engineering discoveries that will undoubtedly lead to progression from proof of concept to device creation. The main topics covered in this book include some of the most promising materials, methods, and the ability to integrate printed materials with commercial components to provide the basis for the next generation of electronics that are dubbed “survivable” in environments with high g‐orces, corrosion, vibration, and large temperature fluctuations. A wide variety of materials are discussed that contribute to robust hybrid electronics, including printable conductive composite inks, ceramics and ceramic matrix composites, polymer‐erived ceramics, thin metal films, elastomers, solders and epoxies, to name a few. Collectively, these materials and associated components are used to construct conductive traces, interconnects, antennas, pressure sensors, temperature sensors, power inducting devices, strain sensors and gauges, soft actuators, supercapacitors, piezo ionic elements, resistors, waveguides, filters, electrodes, batteries, various detectors, monitoring devices, transducers, and RF systems and graded dielectric, or graded index (GRIN) structures. New designs that incorporate the electronics as embedded materials into channels, slots and other methods to protect the electronics from the extreme elements of the operational environment are also envisioned to increase their survivability while remaining cognizant of the required frequency of replacement, reapplication and integration of power sources. Lastly, the ability of printer manufacturers, software providers and users to work together to build multi‐axis, multi‐material and commercial‐off‐the‐shelf (COTS) integration into user‐friendly systems will be a great advancement for the field of printed electronics. Therefore, the blueprint for manufacturing resilient hybrid electronics consists of novel designs that exploit the benefits of advances in additive manufacturing that are then efficiently paired with commercially available components to produce devices that exceed known constraints. As a primary example, metals can be deposited onto polymers in a variety of ways, including aerosol jetting, microdispensing, electroplating, sintering, vacuum deposition, supersonic beam cluster deposition, and plasma‐based techniques, to name a few. Taking these scientific discoveries and creatively combining them into robotic, multi‐material factories of the future could be one shared aim of the printed electronics community toward survivable device creation.

Download or read book Recent Progress in Lead Free Solder Technology written by Mohd Arif Anuar Mohd Salleh and published by Springer Nature. This book was released on 2022-03-01 with total page 332 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book highlights recent research progress in lead (Pb)-free solder technology, focusing on materials development, processing, and performances. It discusses various Pb-free solder materials’ development, encompassing composite solders, transient liquid phase sintering, and alloying. The book also details various Pb-free solder technology processing and performances, including flux modification for soldering, laser soldering, wave soldering, and reflow soldering, while also examining multiple technologies pertaining to the rigid and flexible printed circuit board (PCB). Some chapters explain the materials characterization and modeling techniques using computational fluid dynamics (CFD). This book serves as a valuable reference for researchers, industries, and stakeholders in advanced microelectronic packaging, emerging interconnection technology, and those working on Pb-free solder.

Download or read book Innovations in Electronics and Communication Engineering written by H. S. Saini and published by Springer Nature. This book was released on 2020-04-22 with total page 781 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is a collection of the best research papers presented at the 8th International Conference on Innovations in Electronics and Communication Engineering at Guru Nanak Institutions Hyderabad, India. Featuring contributions by researchers, technocrats and experts, the book covers various areas of communication engineering, like signal processing, VLSI design, embedded systems, wireless communications, and electronics and communications in general, as well as cutting-edge technologies. As such, it is a valuable reference resource for young researchers.

Download or read book The Old and New written by Cesar A. Sciammarella and published by Morgan & Claypool Publishers. This book was released on 2018-04-16 with total page 110 pages. Available in PDF, EPUB and Kindle. Book excerpt: The field of Experimental Mechanics has evolved substantially over the past 100 years. In the early years, the field was primarily comprised of applied physicists, civil engineers, railroad engineers, and mechanical engineers. The field defined itself by those who invented, developed, and refined experimental tools and techniques, based on the latest technologies available, to better understand the fundamental mechanics of materials and structures used to design many aspects of our everyday life. What the early experimental mechanician measured, observed, and evaluated were things like stress, strain, fracture, and fatigue, to name a few, which remain fundamental to the field today. This book guides you through a chronology of the formation of the Society for Experimental Mechanics, and its ensuing evolution. The Society was founded in 1935 by a very small group of individuals that understood the value of creating a common forum for people working in the field of Applied Mechanics of Solids, where extensive theoretical developments needed the input of experimental validation. A community of individuals who—through research, applications, sharp discussion of ideas—could fulfill the needs of a nation rapidly evolving in the technological field. The founders defined, influenced, and grew the field of what we now call Experimental Mechanics. Written as a narrative, the author describes, based on input from numerous individuals and personal experiences, the evolution of the New England Photoelasticity Conference to what we know today as the Society for Experimental Mechanics (SEM). The narrative is the author's perspective that invites members of the Society to contribute to the story by adding names of individuals, institutions, and technologies that have defined the Society over the past 75 years. Many of the key individuals who greatly influenced the advancement of the field of Experimental Mechanics are mentioned. These individuals are, in many ways, the founders of the field who have written textbooks, brought their teaching leadership and experiences to the classroom, worked on the Apollo project, and invented testing, evaluation, and measurement equipment that have shaped the fields of engineering. SEM's international membership is highly represented by those in academia, as you will read, although there has always been a powerful balance and contribution from industry and research organizations across the globe. The role of the experimental mechanician is defined, in many ways, through the individual legacies shared in the following pages....legacies that define the past and create the foundation for what is now and what is to come.

Download or read book Artificial Intelligence Trends in Systems written by Radek Silhavy and published by Springer Nature. This book was released on 2022-07-07 with total page 627 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book covers themes related to artificial intelligence in systems and networks application. Selected papers explore modern neural networks application, optimization and hybrid and bio-inspired algorithms are covered too. The refereed proceedings of the Artificial Intelligence Trends in Systems part of the 11th Computer Science On-line Conference 2022 (CSOC 2022), conducted online in April 2022, are included in this volume.

Download or read book Automotive Embedded Systems written by M. Kathiresh and published by Springer Nature. This book was released on 2021-04-24 with total page 239 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is a compilation of the recent technologies and innovations in the field of automotive embedded systems with a special mention to the role of Internet of Things in automotive systems. The book provides easy interpretable explanations for the key technologies involved in automotive embedded systems. The authors illustrate various diagnostics over internet protocol and over-the-air update process, present advanced driver assistance systems, discuss various cyber security issues involved in connected cars, and provide necessary information about Autosar and Misra coding standards. The book is relevant to academics, professionals, and researchers.

Download or read book Multilevel Converters Analysis Modulation Topologies and Applications written by Gabriele Grandi and published by MDPI. This book was released on 2019-10-14 with total page 548 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is a collection of scientific papers concerning multilevel inverters examined from different points of view. Many applications are considered, such as renewable energy interface, power conditioning systems, electric drives, and chargers for electric vehicles. Different topologies have been examined in both new configurations and well-established structures, introducing novel and particular modulation strategies, and examining the effect of modulation techniques on voltage and current harmonics and the total harmonic distortion.

Download or read book Artificial Intelligence in China written by Qilian Liang and published by Springer Nature. This book was released on 2020-01-31 with total page 679 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book brings together papers presented at the International Conference on Artificial Intelligence in China (ChinaAI) 2019, which provided a venue for disseminating the latest advances and discussing the interactions and links between the various subfields of AI. Addressing topics that cover virtually all aspects of AI and the latest developments in China, the book is chiefly intended for undergraduate and graduate students in Electrical Engineering, Computer Science, and Mathematics, for researchers and engineers from academia and industry, and for government employees (e.g. at the NSF, DOD, and DOE).

Download or read book Modeling Analysis Design and Tests for Electronics Packaging beyond Moore written by Hengyun Zhang and published by Woodhead Publishing. This book was released on 2019-11-14 with total page 436 pages. Available in PDF, EPUB and Kindle. Book excerpt: Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore provides an overview of electrical, thermal and thermomechanical modeling, analysis, design and testing for 2.5D/3D. The book addresses important topics, including electrically and thermally induced issues, such as EMI and thermal issues, which are crucial to package signal and thermal integrity. It also covers modeling methods to address thermomechanical stress related to the package structural integrity. In addition, practical design and test techniques for packages and systems are included. - Includes advanced modeling and analysis methods and techniques for state-of-the art electronics packaging - Features experimental characterization and qualifications for the analysis and verification of electronic packaging design - Provides multiphysics modeling and analysis techniques of electronic packaging

Download or read book Graphene Rubber Nanocomposites written by Titash Mondal and published by CRC Press. This book was released on 2022-10-24 with total page 559 pages. Available in PDF, EPUB and Kindle. Book excerpt: Since the Nobel Prize for the discovery of graphene was presented in 2010, graphene has been frequently leveraged for different applications. Owing to the strategic importance of elastomer-based products in different segments, graphene and its derivatives are often added to different elastomers to improve their properties. Graphene-Rubber Nanocomposites: Fundamentals to Applications provides a comprehensive and innovative account of graphene-rubber composites. Features: Provides up-to-date information and research on graphene-rubber nanocomposites Presents a detailed account of the different niche applications ranging from sensors, flexible electronics to thermal, and EMI shielding materials Offers a comprehensive know-how on the structure-property relationship of graphene-rubber nanocomposites Covers the characterization of graphene-based elastomeric composition Delivers a comprehensive understanding of the structure of the graphene, including its chemical modification for usage in elastomer composites This book will be a valuable resource for graduate-level students, researchers, and professionals working in the fields of materials science, polymer science, nanoscience and technology, rubber technology, chemical engineering, and composite materials.