Download or read book 2011 International Conference on Electronic Packaging Technology High Density Packaging ICEPT HDP 2011 written by and published by . This book was released on 2011 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
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Download or read book Proceedings 2011 International Conference on Electronic Packaging Technology High Density Packaging ICEPT HDP 2011 written by Keyun Bi and published by . This book was released on 2011 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging written by IEEE Staff and published by . This book was released on 2011-08-12 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book 2010 11th International Conference on Electronic Packaging Technology High Density Packaging ICEPT HDP 2010 written by Keyun Bi and published by . This book was released on 2010 with total page 723 pages. Available in PDF, EPUB and Kindle. Book excerpt:
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Download or read book Proceedings 2010 International Conference on Electronic Packaging Technology High Density Packaging written by and published by . This book was released on 2010 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book 2012 13th International Conference on Electronic Packaging Technology High Density Packaging ICEPT HDP 2012 written by and published by . This book was released on 2012 with total page 833 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging written by IEEE Staff and published by . This book was released on 2012 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
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Download or read book 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging written by IEEE Staff and published by . This book was released on 2010 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Proceedings 2012 13th International Conference on Electronic Packaging Technology High Density Packaging ICEPT HDP 2012 written by and published by . This book was released on 2012 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium written by Mohd Arif Anuar Mohd Salleh and published by Springer Nature. This book was released on 2023-07-02 with total page 873 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents peer reviewed articles from the Green Materials and Electronic Packaging Interconnect Technology Symposium, (EPITS 2022), held in Langkawi, Malaysia on 14th and 15th of Sept, 2022. It brings together packaging experts to share and exchange ideas in electronics technology. Topics covered in this volume include, but are not limited to; (1) Green materials and technology, (2) Emerging interconnect materials and technologies,(3) Non-solder interconnect materials at chip and package levels, (4) Fundamental materials behavior for electronic packaging materials, (5) Advanced characterization methods as applied to electronic packaging technology, (6) Developments in high temperature Pb-free solders and associated interconnects for automotive and power electronics, (7) Surface coating materials & (8) Advanced materials.
Download or read book Proceedings 2009 International Conference on Electronic Packaging Technology High Density Packaging written by and published by . This book was released on 2009 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book From LED to Solid State Lighting written by S. W. Ricky Lee and published by John Wiley & Sons. This book was released on 2021-09-17 with total page 256 pages. Available in PDF, EPUB and Kindle. Book excerpt: FROM LED TO SOLID STATE LIGHTING A comprehensive and practical reference complete with hands-on exercises and experimental data In From LED to Solid State Lighting: Principles, Materials, Packaging, Characterization, and Applications, accomplished mechanical engineers Shi-Wei Ricky Lee, Jeffery C. C. Lo, Mian Tao, and Huaiyu Ye deliver a practical overview of the design and construction of LED lighting modules, from the fabrication of the LED chip to the LED modules incorporated in complete LED lighting fixtures. The distinguished authors discuss the major advantages of solid-state lighting, including energy savings, environmental friendliness, and lengthy operational life, as well as the contributions offered by the packaging of light-emitting diodes in the pursuit of these features. Readers will discover presentations of the technical issues that arise in packaging LED components, like interconnection, phosphor deposition, and encapsulation. They’ll also find insightful elaborations on optical design, analysis, and characterization. Discussions of LED applications, technology roadmaps, and IP issues round out the included material. This important book also includes: Thorough introductions to lighting, photometry, and colorimetry, the fundamentals of light-emitting diodes, and the fabrication of LED wafers and chips Practical discussions of the packaging of LED chips, wafer-level packaging of LED arrays, and optical and electrical characterization Comprehensive explorations of board-level assembly and LED modules and optical and electrical characterization In-depth examinations of thermal management, reliability engineering for LED packaging, and applications for general lighting Perfect for post-graduate students and practicing engineers studying or working in the field of LED manufacturing for solid state lighting applications, From LED to Solid State Lighting: Principles, Materials, Packaging, Characterization, and Applications is also an indispensable resource for managers and technicians seeking a one-stop guide to the subject.
Download or read book Copper Wire Bonding written by Preeti S Chauhan and published by Springer Science & Business Media. This book was released on 2013-09-20 with total page 254 pages. Available in PDF, EPUB and Kindle. Book excerpt: This critical volume provides an in-depth presentation of copper wire bonding technologies, processes and equipment, along with the economic benefits and risks. Due to the increasing cost of materials used to make electronic components, the electronics industry has been rapidly moving from high cost gold to significantly lower cost copper as a wire bonding material. However, copper wire bonding has several process and reliability concerns due to its material properties. Copper Wire Bonding book lays out the challenges involved in replacing gold with copper as a wire bond material, and includes the bonding process changes—bond force, electric flame off, current and ultrasonic energy optimization, and bonding tools and equipment changes for first and second bond formation. In addition, the bond–pad metallurgies and the use of bare and palladium-coated copper wires on aluminum are presented, and gold, nickel and palladium surface finishes are discussed. The book also discusses best practices and recommendations on the bond process, bond–pad metallurgies, and appropriate reliability tests for copper wire-bonded electronic components. In summary, this book: Introduces copper wire bonding technologies Presents copper wire bonding processes Discusses copper wire bonding metallurgies Covers recent advancements in copper wire bonding including the bonding process, equipment changes, bond–pad materials and surface finishes Covers the reliability tests and concerns Covers the current implementation of copper wire bonding in the electronics industry Features 120 figures and tables Copper Wire Bonding is an essential reference for industry professionals seeking detailed information on all facets of copper wire bonding technology.
Download or read book 2011 IEEE 13th Electronics Packaging Technology Conference written by IEEE Staff and published by . This book was released on 2011 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: