Download or read book 2011 18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits written by Institute of Electrical and Electronics Engineers (New York, NY) and published by . This book was released on 2011-07-08 with total page 407 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book ISTFA 2014 written by A. S. M. International and published by ASM International. This book was released on 2014-11-01 with total page 561 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume features the latest research and practical data from the premier event for the microelectronics failure analysis community. The papers address the symposium's theme, Exploring the Many Facets of Failure Analysis.
Download or read book Counterfeit Integrated Circuits written by Mark (Mohammad) Tehranipoor and published by Springer. This book was released on 2015-02-12 with total page 269 pages. Available in PDF, EPUB and Kindle. Book excerpt: This timely and exhaustive study offers a much-needed examination of the scope and consequences of the electronic counterfeit trade. The authors describe a variety of shortcomings and vulnerabilities in the electronic component supply chain, which can result in counterfeit integrated circuits (ICs). Not only does this book provide an assessment of the current counterfeiting problems facing both the public and private sectors, it also offers practical, real-world solutions for combatting this substantial threat. · Helps beginners and practitioners in the field by providing a comprehensive background on the counterfeiting problem; · Presents innovative taxonomies for counterfeit types, test methods, and counterfeit defects, which allows for a detailed analysis of counterfeiting and its mitigation; · Provides step-by-step solutions for detecting different types of counterfeit ICs; · Offers pragmatic and practice-oriented, realistic solutions to counterfeit IC detection and avoidance, for industry and government.
Download or read book ISTFA 2019 Proceedings of the 45th International Symposium for Testing and Failure Analysis written by and published by ASM International. This book was released on 2019-12-01 with total page 540 pages. Available in PDF, EPUB and Kindle. Book excerpt: The theme for the 2019 conference is Novel Computing Architectures. Papers will include discussions on the advent of Artificial Intelligence and the promise of quantum computing that are driving disruptive computing architectures; Neuromorphic chip designs on one hand, and Quantum Bits on the other, still in R&D, will introduce new computing circuitry and memory elements, novel materials, and different test methodologies. These novel computing architectures will require further innovation which is best achieved through a collaborative Failure Analysis community composed of chip manufacturers, tool vendors, and universities.
Download or read book ISTFA 2012 written by ASM International and published by ASM International. This book was released on 2012 with total page 643 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book ISTFA 2017 Proceedings from the 43rd International Symposium for Testing and Failure Analysis written by and published by ASM International. This book was released on 2017-12-01 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: The theme for the November 2017 conference was Striving for 100% Success Rate. Papers focus on the tools and techniques needed for maximizing the success rate in every aspect of the electronic device failure analysis process.
Download or read book 50 Years of Materials Science in Singapore written by Freddy Boey and published by World Scientific. This book was released on 2016-06-17 with total page 244 pages. Available in PDF, EPUB and Kindle. Book excerpt: 50 Years of Materials Science in Singapore describes in vivid detail how a newly independent nation like Singapore developed world-class research capabilities in materials science that helped the country make rapid progress in energy, biomedical and electronics sectors. The economy mirrored this rapid trail of progress, utilizing home-grown technology and the contribution of materials science to the various sectors is undeniable in ensuring the economic growth and stability of Singapore. Contents:Historical Narrative Early Beginnings to Present (Freddy Boey)Composites, Nanocomposites and Hybrid Materials (Chaobin He, Xiao Hu, Zhang Yu and John Wang)Materials for Water Remediation (Membranes) (Sui Zhang, Lin Luo, Zhi Wei Thong and Tai-Shung Chung)Nanostructured Catalytic and Adsorbent Materials for Water Remediation (Zhong Chen and Teik Thye Lim) Solar Energy and Energy Storage Materials and Devices Research in Singapore (D Sabba, J Wang, M Srinivasan, A G Aberle and S Mhaisalkar )50 Years of Biomaterials Research in Singapore (Subbu Venkatraman, Swee Hin Teoh and Ali Miserez)2D Materials (Andrew T S Wee, Kian Ping Loh and Antonio H Castro Neto)Electronic Materials Research in Singapore (Chee Ying Khoo, Pooi See Lee, Sze Ter Lim and Chee Lip Gan)"Singaporean" Materials Science: What Does the Future Hold? (Subbu Venkatraman) Readership: General public, people interested in history of Singapore, people interested in materials science.
Download or read book Nanocrystals in Nonvolatile Memory written by Writam Banerjee and published by CRC Press. This book was released on 2024-08-09 with total page 683 pages. Available in PDF, EPUB and Kindle. Book excerpt: In recent years, the abundant advantages of quantum physics, quantum dots, quantum wires, quantum wells, and nanocrystals in various applications have attracted considerable scientific attention in the field of nonvolatile memory (NVM). Nanocrystals are the driving elements that have helped nonvolatile flash memory technology reach its distinguished height, but new approaches are still needed to strengthen nanocrystal-based nonvolatile technology for future applications. This book presents comprehensive knowledge on nanocrystal fabrication methods and applications of nanocrystals in baseline NVM and emerging NVM technologies and the chapters are written by experts in the field from all over the globe. The book presents a detailed analysis on nanocrystal-based emerging devices by a high-level researcher in the field. It has a unique chapter especially dedicated to graphene-based flash memory devices, considering the importance of carbon allotropes in future applications. This updated edition covers emerging ferroelectric memory device, which is a technology for the future, and the chapter is contributed by the well-known Ferroelectric Memory Company, Germany. It includes information related to the applications of emerging memories in sensors and the chapter is contributed by Ajou University, South Korea. The book introduces a new chapter for emerging NVM technology in artificial intelligence and the chapter is contributed by University College London, UK. It guides the readers throughout with appropriate illustrations, excellent figures, and references in each chapter. It is a valuable tool for researchers and developers from the fields of electronics, semiconductors, nanotechnology, materials science, and solid-state memories.
Download or read book Proceedings of the 2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits IPFA written by and published by . This book was released on 2016 with total page 438 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Springer Handbook of Semiconductor Devices written by Massimo Rudan and published by Springer Nature. This book was released on 2022-11-10 with total page 1680 pages. Available in PDF, EPUB and Kindle. Book excerpt: This Springer Handbook comprehensively covers the topic of semiconductor devices, embracing all aspects from theoretical background to fabrication, modeling, and applications. Nearly 100 leading scientists from industry and academia were selected to write the handbook's chapters, which were conceived for professionals and practitioners, material scientists, physicists and electrical engineers working at universities, industrial R&D, and manufacturers. Starting from the description of the relevant technological aspects and fabrication steps, the handbook proceeds with a section fully devoted to the main conventional semiconductor devices like, e.g., bipolar transistors and MOS capacitors and transistors, used in the production of the standard integrated circuits, and the corresponding physical models. In the subsequent chapters, the scaling issues of the semiconductor-device technology are addressed, followed by the description of novel concept-based semiconductor devices. The last section illustrates the numerical simulation methods ranging from the fabrication processes to the device performances. Each chapter is self-contained, and refers to related topics treated in other chapters when necessary, so that the reader interested in a specific subject can easily identify a personal reading path through the vast contents of the handbook.
Download or read book Microelectronics Fialure Analysis Desk Reference Seventh Edition written by Tejinder Gandhi and published by ASM International. This book was released on 2019-11-01 with total page 750 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Electronic Device Failure Analysis Society proudly announces the Seventh Edition of the Microelectronics Failure Analysis Desk Reference, published by ASM International. The new edition will help engineers improve their ability to verify, isolate, uncover, and identify the root cause of failures. Prepared by a team of experts, this updated reference offers the latest information on advanced failure analysis tools and techniques, illustrated with numerous real-life examples. This book is geared to practicing engineers and for studies in the major area of power plant engineering. For non-metallurgists, a chapter has been devoted to the basics of material science, metallurgy of steels, heat treatment, and structure-property correlation. A chapter on materials for boiler tubes covers composition and application of different grades of steels and high temperature alloys currently in use as boiler tubes and future materials to be used in supercritical, ultra-supercritical and advanced ultra-supercritical thermal power plants. A comprehensive discussion on different mechanisms of boiler tube failure is the heart of the book. Additional chapters detailing the role of advanced material characterization techniques in failure investigation and the role of water chemistry in tube failures are key contributions to the book.
Download or read book 2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits IPFA written by IEEE Staff and published by . This book was released on 2018-07-16 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: IPFA 2018 is devoted to the fundamental understanding of the electrical and physical characterization techniques and associated technologies that assist in probing the nature of wear out and failure in conventional and new CMOS devices, in turn resulting in improved knowhow of the physics of device circuit module failure that serves as critical input for future design for reliability
Download or read book Nanoelectronic Devices for Hardware and Software Security written by Arun Kumar Singh and published by CRC Press. This book was released on 2021-10-31 with total page 353 pages. Available in PDF, EPUB and Kindle. Book excerpt: Nanoelectronic Devices for Hardware and Software Security has comprehensive coverage of the principles, basic concepts, structure, modeling, practices, and circuit applications of nanoelectronics in hardware/software security. It also covers the future research directions in this domain. In this evolving era, nanotechnology is converting semiconductor devices dimensions from micron technology to nanotechnology. Nanoelectronics would be the key enabler for innovation in nanoscale devices, circuits, and systems. The motive for this research book is to provide relevant theoretical frameworks that include device physics, modeling, circuit design, and the latest developments in experimental fabrication in the field of nanotechnology for hardware/software security. There are numerous challenges in the development of models for nanoscale devices (e.g., FinFET, gate-all-around devices, TFET, etc.), short channel effects, fringing effects, high leakage current, and power dissipation, among others. This book will help to identify areas where there are challenges and apply nanodevice and circuit techniques to address hardware/software security issues.
Download or read book Advanced Materials for Future Terahertz Devices Circuits and Systems written by Aritra Acharyya and published by Springer Nature. This book was released on 2021-02-12 with total page 330 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book highlights the properties of advanced materials suitable for realizing THz devices, circuits and systems, and processing and fabrication technologies associated with those. It also discusses some measurement techniques exclusively effective for THz regime, newly explored materials and recently developed solid-state devices for efficient generation and detection of THz waves, potentiality of metamaterials for implementing THz passive circuits and bio-sensors, and finally the future of silicon as the base material of THz devices. The book especially focuses on the recent advancements and several research issues related to THz materials and devices; it also discusses theoretical, experimental, established, and validated empirical works on these topics.
Download or read book Fundamentals of Electromigration Aware Integrated Circuit Design written by Jens Lienig and published by Springer. This book was released on 2018-02-23 with total page 159 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book provides a comprehensive overview of electromigration and its effects on the reliability of electronic circuits. It introduces the physical process of electromigration, which gives the reader the requisite understanding and knowledge for adopting appropriate counter measures. A comprehensive set of options is presented for modifying the present IC design methodology to prevent electromigration. Finally, the authors show how specific effects can be exploited in present and future technologies to reduce electromigration’s negative impact on circuit reliability.
Download or read book Materials for Electronics Security and Assurance written by Navid Asadizanjani and published by Elsevier. This book was released on 2024-01-15 with total page 224 pages. Available in PDF, EPUB and Kindle. Book excerpt: Materials for Electronics Security and Assurance reviews the properties of materials that could enable devices that are resistant to tampering and manipulation. It discusses recent advances in materials synthesis and characterization techniques for security applications. Topics addressed include anti-reverse engineering, detection, prevention, track and trace, fingerprinting, obfuscation and how materials could enable these security solutions. The book introduces the opportunities and challenges and provides a clear direction of the requirements for material-based solutions to address electronics security challenges. Materials for Electronics Security and Assurance is suitable for materials scientists and engineers to enable future research directions, current computer and hardware security engineers to enable materials selection, and to inspire cross-collaboration between both communities. Discusses materials as enablers to provide electronics assurance, counterfeit detection/protection, and fingerprinting Provides an overview of benefits and challenges of materials-based security solutions to inspire future materials research directions Includes an introduction to material perspectives on hardware security to enable cross collaboration between materials, design, and testing
Download or read book Phase Change Memory written by Andrea Redaelli and published by Springer. This book was released on 2017-11-18 with total page 330 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book describes the physics of phase change memory devices, starting from basic operation to reliability issues. The book gives a comprehensive overlook of PCM with particular attention to the electrical transport and the phase transition physics between the two states. The book also contains design engineering details on PCM cell architecture, PCM cell arrays (including electrical circuit management), as well as the full spectrum of possible future applications.
