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EBookClubs

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Book 2013 IEEE ACM International Conference on Computer Aided Design  ICCAD

Download or read book 2013 IEEE ACM International Conference on Computer Aided Design ICCAD written by IEEE Staff and published by . This book was released on 2013-11-18 with total page 833 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Book Design for Manufacturability with Advanced Lithography

Download or read book Design for Manufacturability with Advanced Lithography written by Bei Yu and published by Springer. This book was released on 2015-10-28 with total page 173 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book introduces readers to the most advanced research results on Design for Manufacturability (DFM) with multiple patterning lithography (MPL) and electron beam lithography (EBL). The authors describe in detail a set of algorithms/methodologies to resolve issues in modern design for manufacturability problems with advanced lithography. Unlike books that discuss DFM from the product level or physical manufacturing level, this book describes DFM solutions from a circuit design level, such that most of the critical problems can be formulated and solved through combinatorial algorithms.

Book Advanced Logic Synthesis

Download or read book Advanced Logic Synthesis written by André Inácio Reis and published by Springer. This book was released on 2017-11-15 with total page 236 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides a single-source reference to the state-of-the-art in logic synthesis. Readers will benefit from the authors’ expert perspectives on new technologies and logic synthesis, new data structures, big data and logic synthesis, and convergent logic synthesis. The authors describe techniques that will enable readers to take advantage of recent advances in big data techniques and frameworks in order to have better logic synthesis algorithms.

Book Proceedings of the International Conference on Paradigms of Computing  Communication and Data Sciences

Download or read book Proceedings of the International Conference on Paradigms of Computing Communication and Data Sciences written by Rajendra Prasad Yadav and published by Springer Nature. This book was released on 2023-02-23 with total page 765 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book gathers selected high-quality research papers presented at International Conference on Paradigms of Communication, Computing and Data Sciences (PCCDS 2022), held at Malaviya National Institute of Technology Jaipur, India, during 05 – 07 July 2022. It discusses high-quality and cutting-edge research in the areas of advanced computing, communications and data science techniques. The book is a collection of latest research articles in computation algorithm, communication and data sciences, intertwined with each other for efficiency.

Book Introduction to VLSI Design Flow

Download or read book Introduction to VLSI Design Flow written by Sneh Saurabh and published by Cambridge University Press. This book was released on 2023-06-15 with total page 715 pages. Available in PDF, EPUB and Kindle. Book excerpt: A textbook on the fundamentals of VLSI design flow, covering the various stages of design implementation, verification, and testing.

Book Proceedings of Second Doctoral Symposium on Computational Intelligence

Download or read book Proceedings of Second Doctoral Symposium on Computational Intelligence written by Deepak Gupta and published by Springer Nature. This book was released on 2021-09-19 with total page 902 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book features high-quality research papers presented at Second Doctoral Symposium on Computational Intelligence (DoSCI-2021), organized by Institute of Engineering and Technology (IET), AKTU, Lucknow, India, on 6 March 2021. This book discusses the topics such as computational intelligence, artificial intelligence, deep learning, evolutionary algorithms, swarm intelligence, fuzzy sets and vague sets, rough set theoretic approaches, quantum-inspired computational intelligence, hybrid computational intelligence, machine learning, computer vision, soft computing, distributed computing, parallel and grid computing, cloud computing, high-performance computing, biomedical computing, decision support and decision making.

Book Low Power Design with High Level Power Estimation and Power Aware Synthesis

Download or read book Low Power Design with High Level Power Estimation and Power Aware Synthesis written by Sumit Ahuja and published by Springer Science & Business Media. This book was released on 2011-10-22 with total page 186 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents novel research techniques, algorithms, methodologies and experimental results for high level power estimation and power aware high-level synthesis. Readers will learn to apply such techniques to enable design flows resulting in shorter time to market and successful low power ASIC/FPGA design.

Book Problems and New Solutions in the Boolean Domain

Download or read book Problems and New Solutions in the Boolean Domain written by Bernd Steinbach and published by Cambridge Scholars Publishing. This book was released on 2016-04-26 with total page 480 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Internet of Things is a great new challenge for the development of digital systems. In addition to the increasing number of classical unconnected digital systems, more people are regularly using new electronic devices and software that are controllable and usable by means of the internet. All such systems utilize the elementariness of Boolean values. A Boolean variable can carry only two different Boolean values: FALSE or TRUE (0 or 1), and has the best interference resistance in technical systems. However, a Boolean function exponentially depends on the number of its variables. This exponential complexity is the cause of major problems in the process of design and realization of circuits. According to Moore’s Law, the complexity of digital systems approximately doubles every 18 months. This requires comprehensive knowledge and techniques to solve complex Boolean problems. This book summarizes both new problems and solutions in the Boolean domain in solving such issues. Part 1 describes powerful new approaches in solving exceptionally complex Boolean problems. Efficient methods contribute to solving problems of extreme complexity. New algorithms and programs utilize the huge number of computing cores of the Graphical Processing Unit and improve the performance of calculations by several orders of magnitude. Part 2 represents several applications of digital systems. Due to the crucial role of the internet, both solutions and open problems regarding the security of these systems are discussed. The exploration of certain properties of such systems leads to a number of efficient solutions, which can be reused in a wide field of applications. Part 3 discusses the scientific basis of future circuit technologies, investigating the need for completely new design methods for the atomic level of quantum computers. This part also concerns itself with reversible circuits as the basis for quantum circuits and specifies important issues regarding future improvements.

Book Encyclopedia Of Thermal Packaging  Set 2  Thermal Packaging Tools  A 4 volume Set

Download or read book Encyclopedia Of Thermal Packaging Set 2 Thermal Packaging Tools A 4 volume Set written by and published by World Scientific. This book was released on 2014-10-23 with total page 1397 pages. Available in PDF, EPUB and Kindle. Book excerpt: remove This Encyclopedia comes in 3 sets. To check out Set 1 and Set 3, please visit Set 1: Thermal Packaging Techniques and Set 3: Thermal Packaging Applications /remove Thermal and mechanical packaging - the enabling technologies for the physical implementation of electronic systems - are responsible for much of the progress in miniaturization, reliability, and functional density achieved by electronic, microelectronic, and nanoelectronic products during the past 50 years. The inherent inefficiency of electronic devices and their sensitivity to heat have placed thermal packaging on the critical path of nearly every product development effort in traditional, as well as emerging, electronic product categories.Successful thermal packaging is the key differentiator in electronic products, as diverse as supercomputers and cell phones, and continues to be of pivotal importance in the refinement of traditional products and in the development of products for new applications. The Encyclopedia of Thermal Packaging, compiled in four multi-volume sets (Set 1: Thermal Packaging Techniques, Set 2: Thermal Packaging Tools, Set 3: Thermal Packaging Applications, and Set 4: Thermal Packaging Configurations) will provide a comprehensive, one-stop treatment of the techniques, tools, applications, and configurations of electronic thermal packaging. Each of the author-written sets presents the accumulated wisdom and shared perspectives of a few luminaries in the thermal management of electronics.Set 2: Thermal Packaging ToolsThe second set in the encyclopedia, Thermal Packaging Tools, includes volumes dedicated to thermal design of data centers, techniques and models for the design and optimization of heat sinks, the development and use of reduced-order “compact” thermal models of electronic components, a database of critical material thermal properties, and a comprehensive exploration of thermally-informed electronic design. The numerical and analytical techniques described in these volumes are among the primary tools used by thermal packaging practitioners and researchers to accelerate product and system development and achieve “correct by design” thermal packaging solutions.The four sets in the Encyclopedia of Thermal Packaging will provide the novice and student with a complete reference for a quick ascent on the thermal packaging ';learning curve,'; the practitioner with a validated set of techniques and tools to face every challenge, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in thermal management of electronic and photonic components and systems, and most beneficial to undergraduate and graduate students studying mechanical, electrical, and electronic engineering.

Book Fundamentals of IP and SoC Security

Download or read book Fundamentals of IP and SoC Security written by Swarup Bhunia and published by Springer. This book was released on 2017-01-24 with total page 316 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is about security in embedded systems and it provides an authoritative reference to all aspects of security in system-on-chip (SoC) designs. The authors discuss issues ranging from security requirements in SoC designs, definition of architectures and design choices to enforce and validate security policies, and trade-offs and conflicts involving security, functionality, and debug requirements. Coverage also includes case studies from the “trenches” of current industrial practice in design, implementation, and validation of security-critical embedded systems. Provides an authoritative reference and summary of the current state-of-the-art in security for embedded systems, hardware IPs and SoC designs; Takes a "cross-cutting" view of security that interacts with different design and validation components such as architecture, implementation, verification, and debug, each enforcing unique trade-offs; Includes high-level overview, detailed analysis on implementation, and relevant case studies on design/verification/debug issues related to IP/SoC security.

Book Handbook of Nanoscience  Engineering  and Technology  Third Edition

Download or read book Handbook of Nanoscience Engineering and Technology Third Edition written by William A. Goddard III and published by CRC Press. This book was released on 2012-06-12 with total page 1097 pages. Available in PDF, EPUB and Kindle. Book excerpt: In his 1959 address, "There is Plenty of Room at the Bottom," Richard P. Feynman speculated about manipulating materials atom by atom and challenged the technical community "to find ways of manipulating and controlling things on a small scale." This visionary challenge has now become a reality, with recent advances enabling atomistic-level tailoring and control of materials. Exemplifying Feynman’s vision, Handbook of Nanoscience, Engineering, and Technology, Third Edition continues to explore innovative nanoscience, engineering, and technology areas. Along with updating all chapters, this third edition extends the coverage of emerging nano areas even further. Two entirely new sections on energy and biology cover nanomaterials for energy storage devices, photovoltaics, DNA devices and assembly, digital microfluidic lab-on-a-chip, and much more. This edition also includes new chapters on nanomagnet logic, quantum transport at the nanoscale, terahertz emission from Bloch oscillator systems, molecular logic, electronic optics in graphene, and electromagnetic metamaterials. With contributions from top scientists and researchers from around the globe, this color handbook presents a unified, up-to-date account of the most promising technologies and developments in the nano field. It sets the stage for the next revolution of nanoscale manufacturing—where scalable technologies are used to manufacture large numbers of devices with complex functionalities.

Book Electronic Design Automation for IC Implementation  Circuit Design  and Process Technology

Download or read book Electronic Design Automation for IC Implementation Circuit Design and Process Technology written by Luciano Lavagno and published by CRC Press. This book was released on 2017-02-03 with total page 798 pages. Available in PDF, EPUB and Kindle. Book excerpt: The second of two volumes in the Electronic Design Automation for Integrated Circuits Handbook, Second Edition, Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology thoroughly examines real-time logic (RTL) to GDSII (a file format used to transfer data of semiconductor physical layout) design flow, analog/mixed signal design, physical verification, and technology computer-aided design (TCAD). Chapters contributed by leading experts authoritatively discuss design for manufacturability (DFM) at the nanoscale, power supply network design and analysis, design modeling, and much more. New to This Edition: Major updates appearing in the initial phases of the design flow, where the level of abstraction keeps rising to support more functionality with lower non-recurring engineering (NRE) costs Significant revisions reflected in the final phases of the design flow, where the complexity due to smaller and smaller geometries is compounded by the slow progress of shorter wavelength lithography New coverage of cutting-edge applications and approaches realized in the decade since publication of the previous edition—these are illustrated by new chapters on 3D circuit integration and clock design Offering improved depth and modernity, Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology provides a valuable, state-of-the-art reference for electronic design automation (EDA) students, researchers, and professionals.

Book Mobile Applications Development with Android

Download or read book Mobile Applications Development with Android written by Meikang Qiu and published by CRC Press. This book was released on 2016-10-14 with total page 201 pages. Available in PDF, EPUB and Kindle. Book excerpt: Mobile Applications Development with Android: Technologies and Algorithms presents advanced techniques for mobile app development, and addresses recent developments in mobile technologies and wireless networks. The book covers advanced algorithms, embedded systems, novel mobile app architecture, and mobile cloud computing paradigms. Divided into three sections, the book explores three major dimensions in the current mobile app development domain. The first section describes mobile app design and development skills, including a quick start on using Java to run an Android application on a real phone. It also introduces 2D graphics and UI design, as well as multimedia in Android mobile apps. The second part of the book delves into advanced mobile app optimization, including an overview of mobile embedded systems and architecture. Data storage in Android, mobile optimization by dynamic programming, and mobile optimization by loop scheduling are also covered. The last section of the book looks at emerging technologies, including mobile cloud computing, advanced techniques using Big Data, and mobile Big Data storage. About the Authors Meikang Qiu is an Associate Professor of Computer Science at Pace University, and an adjunct professor at Columbia University. He is an IEEE/ACM Senior Member, as well as Chair of the IEEE STC (Special Technical Community) on Smart Computing. He is an Associate Editor of a dozen of journals including IEEE Transactions on Computers and IEEE Transactions on Cloud Computing. He has published 320+ peer-reviewed journal/conference papers and won 10+ Best Paper Awards. Wenyun Dai is pursuing his PhD at Pace University. His research interests include high performance computing, mobile data privacy, resource management optimization, cloud computing, and mobile networking. His paper about mobile app privacy has been published in IEEE Transactions on Computers. Keke Gai is pursuing his PhD at Pace University. He has published over 60 peer-reviewed journal or conference papers, and has received three IEEE Best Paper Awards. His research interests include cloud computing, cyber security, combinatorial optimization, business process modeling, enterprise architecture, and Internet computing. .

Book Temperature  and Supply Voltage Independent Time References for Wireless Sensor Networks

Download or read book Temperature and Supply Voltage Independent Time References for Wireless Sensor Networks written by Valentijn De Smedt and published by Springer. This book was released on 2014-11-07 with total page 422 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book investigates the possible circuit solutions to overcome the temperature and supply voltage-sensitivity of fully-integrated time references for ultra-low-power communication in wireless sensor networks. The authors provide an elaborate theoretical introduction and literature study to enable full understanding of the design challenges and shortcomings of current oscillator implementations. Furthermore, a closer look to the short-term as well as the long-term frequency stability of integrated oscillators is taken. Next, a design strategy is developed and applied to 5 different oscillator topologies and 1 sensor interface. All 6 implementations are subject to an elaborate study of frequency stability, phase noise and power consumption. In the final chapter all blocks are compared to the state of the art.

Book Network on Chip

Download or read book Network on Chip written by Santanu Kundu and published by CRC Press. This book was released on 2014-12-15 with total page 392 pages. Available in PDF, EPUB and Kindle. Book excerpt: Addresses the Challenges Associated with System-on-Chip Integration Network-on-Chip: The Next Generation of System-on-Chip Integration examines the current issues restricting chip-on-chip communication efficiency, and explores Network-on-chip (NoC), a promising alternative that equips designers with the capability to produce a scalable, reusable, and high-performance communication backbone by allowing for the integration of a large number of cores on a single system-on-chip (SoC). This book provides a basic overview of topics associated with NoC-based design: communication infrastructure design, communication methodology, evaluation framework, and mapping of applications onto NoC. It details the design and evaluation of different proposed NoC structures, low-power techniques, signal integrity and reliability issues, application mapping, testing, and future trends. Utilizing examples of chips that have been implemented in industry and academia, this text presents the full architectural design of components verified through implementation in industrial CAD tools. It describes NoC research and developments, incorporates theoretical proofs strengthening the analysis procedures, and includes algorithms used in NoC design and synthesis. In addition, it considers other upcoming NoC issues, such as low-power NoC design, signal integrity issues, NoC testing, reconfiguration, synthesis, and 3-D NoC design. This text comprises 12 chapters and covers: The evolution of NoC from SoC—its research and developmental challenges NoC protocols, elaborating flow control, available network topologies, routing mechanisms, fault tolerance, quality-of-service support, and the design of network interfaces The router design strategies followed in NoCs The evaluation mechanism of NoC architectures The application mapping strategies followed in NoCs Low-power design techniques specifically followed in NoCs The signal integrity and reliability issues of NoC The details of NoC testing strategies reported so far The problem of synthesizing application-specific NoCs Reconfigurable NoC design issues Direction of future research and development in the field of NoC Network-on-Chip: The Next Generation of System-on-Chip Integration covers the basic topics, technology, and future trends relevant to NoC-based design, and can be used by engineers, students, and researchers and other industry professionals interested in computer architecture, embedded systems, and parallel/distributed systems.