Download or read book Proceedings 2010 19th Asian Test Symposium written by and published by . This book was released on 2010 with total page 463 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book 2010 19th IEEE Asian Test Symposium written by and published by . This book was released on 2010 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book 2010 19th Asian Test Symposium written by Computer Society Test Technology Technical Council and published by . This book was released on 2010 with total page 463 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book 19th Asian Test Symposium written by and published by IEEE Computer Society Press. This book was released on 2010-01-01 with total page 453 pages. Available in PDF, EPUB and Kindle. Book excerpt: "IEEE Computer Society Order Number P4248"--T.p. verso.
Download or read book Test and Diagnosis for Small Delay Defects written by Mohammad Tehranipoor and published by Springer Science & Business Media. This book was released on 2011-09-08 with total page 228 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book will introduce new techniques for detecting and diagnosing small-delay defects in integrated circuits. Although this sort of timing defect is commonly found in integrated circuits manufactured with nanometer technology, this will be the first book to introduce effective and scalable methodologies for screening and diagnosing small-delay defects, including important parameters such as process variations, crosstalk, and power supply noise.
Download or read book Labs on Chip written by Eugenio Iannone and published by CRC Press. This book was released on 2018-09-03 with total page 1178 pages. Available in PDF, EPUB and Kindle. Book excerpt: Labs on Chip: Principles, Design and Technology provides a complete reference for the complex field of labs on chip in biotechnology. Merging three main areas— fluid dynamics, monolithic micro- and nanotechnology, and out-of-equilibrium biochemistry—this text integrates coverage of technology issues with strong theoretical explanations of design techniques. Analyzing each subject from basic principles to relevant applications, this book: Describes the biochemical elements required to work on labs on chip Discusses fabrication, microfluidic, and electronic and optical detection techniques Addresses planar technologies, polymer microfabrication, and process scalability to huge volumes Presents a global view of current lab-on-chip research and development Devotes an entire chapter to labs on chip for genetics Summarizing in one source the different technical competencies required, Labs on Chip: Principles, Design and Technology offers valuable guidance for the lab-on-chip design decision-making process, while exploring essential elements of labs on chip useful both to the professional who wants to approach a new field and to the specialist who wants to gain a broader perspective.
Download or read book Thermal Issues in Testing of Advanced Systems on Chip written by Nima Aghaee Ghaleshahi and published by Linköping University Electronic Press. This book was released on 2015-09-23 with total page 219 pages. Available in PDF, EPUB and Kindle. Book excerpt: Many cutting-edge computer and electronic products are powered by advanced Systems-on-Chip (SoC). Advanced SoCs encompass superb performance together with large number of functions. This is achieved by efficient integration of huge number of transistors. Such very large scale integration is enabled by a core-based design paradigm as well as deep-submicron and 3D-stacked-IC technologies. These technologies are susceptible to reliability and testing complications caused by thermal issues. Three crucial thermal issues related to temperature variations, temperature gradients, and temperature cycling are addressed in this thesis. Existing test scheduling techniques rely on temperature simulations to generate schedules that meet thermal constraints such as overheating prevention. The difference between the simulated temperatures and the actual temperatures is called temperature error. This error, for past technologies, is negligible. However, advanced SoCs experience large errors due to large process variations. Such large errors have costly consequences, such as overheating, and must be taken care of. This thesis presents an adaptive approach to generate test schedules that handle such temperature errors. Advanced SoCs manufactured as 3D stacked ICs experience large temperature gradients. Temperature gradients accelerate certain early-life defect mechanisms. These mechanisms can be artificially accelerated using gradient-based, burn-in like, operations so that the defects are detected before shipping. Moreover, temperature gradients exacerbate some delay-related defects. In order to detect such defects, testing must be performed when appropriate temperature-gradients are enforced. A schedule-based technique that enforces the temperature-gradients for burn-in like operations is proposed in this thesis. This technique is further developed to support testing for delay-related defects while appropriate gradients are enforced. The last thermal issue addressed by this thesis is related to temperature cycling. Temperature cycling test procedures are usually applied to safety-critical applications to detect cycling-related early-life failures. Such failures affect advanced SoCs, particularly through-silicon-via structures in 3D-stacked-ICs. An efficient schedule-based cycling-test technique that combines cycling acceleration with testing is proposed in this thesis. The proposed technique fits into existing 3D testing procedures and does not require temperature chambers. Therefore, the overall cycling acceleration and testing cost can be drastically reduced. All the proposed techniques have been implemented and evaluated with extensive experiments based on ITC’02 benchmarks as well as a number of 3D stacked ICs. Experiments show that the proposed techniques work effectively and reduce the costs, in particular the costs related to addressing thermal issues and early-life failures. We have also developed a fast temperature simulation technique based on a closed-form solution for the temperature equations. Experiments demonstrate that the proposed simulation technique reduces the schedule generation time by more than half.
Download or read book Structured Object Oriented Formal Language and Method written by Shaoying Liu and published by Springer. This book was released on 2014-02-20 with total page 193 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book constitutes revised selected papers from the Third International Workshop on Structured Object-Oriented Formal Language and Method, SOFL+MSVL 2013, held in Queenstown, New Zealand, in October 2013. The 13 papers presented in this volume were carefully reviewed and selected from 22 submissions. They are organized in topical sections on testing and verification, simulation and model checking, SOFL tools, and formal specification and application.
Download or read book Information Computing and Applications written by Baoxiang Liu and published by Springer Science & Business Media. This book was released on 2011-12-02 with total page 793 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book constitutes the refereed proceedings of the Second International Conference on Information Computing and Applications, ICICA 2010, held in Qinhuangdao, China, in October 2011. The 97 papers presented were carefully reviewed and selected from numerous submissions. They are organized in topical sections on computational economics and finance, computational statistics, mobile computing and applications, social networking and computing, intelligent computing and applications, internet and Web computing, paralelle and distributed computing, and system simulation and computing.
Download or read book VLSI Design and Test written by Ambika Prasad Shah and published by Springer Nature. This book was released on 2022-12-16 with total page 607 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book constitutes the proceedings of the 26th International Symposium on VLSI Design and Test, VDAT 2022, which took place in Jammu, India, in July 2022. The 32 regular papers and 16 short papers presented in this volume were carefully reviewed and selected from 220 submissions. They were organized in topical sections as follows: Devices and Technology; Sensors; Analog/Mixed Signal; Digital Design; Emerging Technologies and Memory; System Design.
Download or read book Progress in VLSI Design and Test written by Hafizur Rahaman and published by Springer. This book was released on 2012-06-26 with total page 427 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book constitutes the refereed proceedings of the 16th International Symposium on VSLI Design and Test, VDAT 2012, held in Shibpur, India, in July 2012. The 30 revised regular papers presented together with 10 short papers and 13 poster sessions were carefully selected from 135 submissions. The papers are organized in topical sections on VLSI design, design and modeling of digital circuits and systems, testing and verification, design for testability, testing memories and regular logic arrays, embedded systems: hardware/software co-design and verification, emerging technology: nanoscale computing and nanotechnology.
Download or read book Three Dimensional Integration of Semiconductors written by Kazuo Kondo and published by Springer. This book was released on 2015-12-09 with total page 423 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book starts with background concerning three-dimensional integration - including their low energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations. The book covers numerous applications, including next generation smart phones, driving assistance systems, capsule endoscopes, homing missiles, and many others. The book concludes with recent progress and developments in three dimensional packaging, as well as future prospects.
Download or read book PROCEEDINGS OF THE 23RD CONFERENCE ON FORMAL METHODS IN COMPUTER AIDED DESIGN FMCAD 2023 written by Alexander Nadel and published by TU Wien Academic Press. This book was released on 2023-10-13 with total page 332 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Conference on Formal Methods in Computer-Aided Design (FMCAD) is an annual conference on the theory and applications of formal methods in hardware and system in academia and industry for presenting and discussing groundbreaking methods, technologies, theoretical results, and tools for reasoning formally about computing systems. FMCAD covers formal aspects of computer-aided system testing.
Download or read book Handbook of 3D Integration Volume 4 written by Paul D. Franzon and published by John Wiley & Sons. This book was released on 2019-01-25 with total page 582 pages. Available in PDF, EPUB and Kindle. Book excerpt: This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective. Edited and authored by key contributors from top research institutions and high-tech companies, the first part of the book provides an overview of the latest developments in 3D chip design, including challenges and opportunities. The second part focuses on the test methods used to assess the quality and reliability of the 3D-integrated circuits, while the third and final part deals with thermal management and advanced cooling technologies and their integration.
Download or read book Intelligent Information and Database Systems written by Ngoc Thanh Nguyen and published by Springer. This book was released on 2018-03-03 with total page 749 pages. Available in PDF, EPUB and Kindle. Book excerpt: The two-volume set LNAI 10751 and 10752 constitutes the refereed proceedings of the 10th Asian Conference on Intelligent Information and Database Systems, ACIIDS 2018, held in Dong Hoi City, Vietnam, in March 2018. The total of 133 full papers accepted for publication in these proceedings was carefully reviewed and selected from 423 submissions. They were organized in topical sections named: Knowledge Engineering and Semantic Web; Social Networks and Recommender Systems; Text Processing and Information Retrieval; Machine Learning and Data Mining; Decision Support and Control Systems; Computer Vision Techniques; Advanced Data Mining Techniques and Applications; Multiple Model Approach to Machine Learning; Sensor Networks and Internet of Things; Intelligent Information Systems; Data Structures Modeling for Knowledge Representation; Modeling, Storing, and Querying of Graph Data; Data Science and Computational Intelligence; Design Thinking Based R&D, Development Technique, and Project Based Learning; Intelligent and Contextual Systems; Intelligent Systems and Algorithms in Information Sciences; Intelligent Applications of Internet of Thing and Data Analysis Technologies; Intelligent Systems and Methods in Biomedicine; Intelligent Biomarkers of Neurodegenerative Processes in Brain; Analysis of Image, Video and Motion Data in Life Sciences; Computational Imaging and Vision; Computer Vision and Robotics; Intelligent Computer Vision Systems and Applications; Intelligent Systems for Optimization of Logistics and Industrial Applications.
Download or read book Computer Safety Reliability and Security written by Amund Skavhaug and published by Springer. This book was released on 2016-09-01 with total page 408 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book constitutes the refereed proceedings of four workshops co-located with SAFECOMP 2016, the 35th International Conference on Computer Safety, Reliability, and Security, held in Trondheim, Norway, in September 2016. The 30 revised full papers presented together with 4 short and 5 invited papers were carefully reviewed and selected from numerous submissions. This year’s workshop are: ASSURE 2016 - Assurance Cases for Software-intensive Systems; DECSoS 2016 - EWICS/ERCIM/ARTEMIS Dependable Cyber-physical Systems and Systems-of-Systems Workshop; SASSUR 2016 - Next Generation of System Assurance Approaches for Safety-Critical Systems; and TIPS 2016 – Timing Performance in Safety Engineering.
Download or read book Machine Learning Applications in Electronic Design Automation written by Haoxing Ren and published by Springer Nature. This book was released on 2023-01-01 with total page 585 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book serves as a single-source reference to key machine learning (ML) applications and methods in digital and analog design and verification. Experts from academia and industry cover a wide range of the latest research on ML applications in electronic design automation (EDA), including analysis and optimization of digital design, analysis and optimization of analog design, as well as functional verification, FPGA and system level designs, design for manufacturing (DFM), and design space exploration. The authors also cover key ML methods such as classical ML, deep learning models such as convolutional neural networks (CNNs), graph neural networks (GNNs), generative adversarial networks (GANs) and optimization methods such as reinforcement learning (RL) and Bayesian optimization (BO). All of these topics are valuable to chip designers and EDA developers and researchers working in digital and analog designs and verification.
