EBookClubs

Read Books & Download eBooks Full Online

EBookClubs

Read Books & Download eBooks Full Online

Book Packaging of High Power Semiconductor Lasers

Download or read book Packaging of High Power Semiconductor Lasers written by Xingsheng Liu and published by Springer. This book was released on 2014-07-14 with total page 415 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book introduces high power semiconductor laser packaging design. The challenges of the design and various packaging and testing techniques are detailed by the authors. New technologies and current applications are described in detail.

Book Nanopackaging

Download or read book Nanopackaging written by James E. Morris and published by Springer. This book was released on 2018-09-22 with total page 1007 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, nanowire applications in packaging, and offers a roadmap for future trends. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive "inks," underfill fillers, and solder enhancement. The book is intended for industrial and academic researchers, industrial electronics packaging engineers who need to keep abreast of progress in their field, and others with interests in nanotechnology. It surveys the application of nanotechnologies to electronics packaging, as represented by current research across the field.

Book 3D Microelectronic Packaging

Download or read book 3D Microelectronic Packaging written by Yan Li and published by Springer Nature. This book was released on 2020-11-23 with total page 629 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging. It provides readers an in-depth understanding of the latest research and development findings regarding this key industry trend, including TSV, die processing, micro-bumps for LMI and MMI, direct bonding and advanced materials, as well as quality, reliability, fault isolation, and failure analysis for 3D microelectronic packages. Images, tables, and didactic schematics are used to illustrate and elaborate on the concepts discussed. Readers will gain a general grasp of 3D packaging, quality and reliability concerns, and common causes of failure, and will be introduced to developing areas and remaining gaps in 3D packaging that can help inspire future research and development.

Book Energy Science and Applied Technology ESAT 2016

Download or read book Energy Science and Applied Technology ESAT 2016 written by Zhigang Fang and published by CRC Press. This book was released on 2016-10-14 with total page 794 pages. Available in PDF, EPUB and Kindle. Book excerpt: The 2016 International Conference on Energy Science and Applied Technology (ESAT 2016) held on June 25-26 in Wuhan, China aimed to provide a platform for researchers, engineers, and academicians, as well as industrial professionals, to present their research results and development activities in energy science and engineering and its applied technology. The themes presented in Energy Science and Applied Technology ESAT 2016 are: Technologies in Geology, Mining, Oil and Gas; Renewable Energy, Bio-Energy and Cell Technologies; Energy Transfer and Conversion, Materials and Chemical Technologies; Environmental Engineering and Sustainable Development; Electrical and Electronic Technology, Power System Engineering; Mechanical, Manufacturing, Process Engineering; Control and Automation; Communications and Applied Information Technologies; Applied and Computational Mathematics; Methods and Algorithms Optimization; Network Technology and Application; System Test, Diagnosis, Detection and Monitoring; Recognition, Video and Image Processing.

Book Research and Development in Intelligent Systems XXXIII

Download or read book Research and Development in Intelligent Systems XXXIII written by Max Bramer and published by Springer. This book was released on 2016-11-14 with total page 381 pages. Available in PDF, EPUB and Kindle. Book excerpt: The papers in this volume are the refereed papers presented at AI-2016, the Thirty-sixth SGAI International Conference on Innovative Techniques and Applications of Artificial Intelligence, held in Cambridge in December 2016 in both the technical and the application streams. They present new and innovative developments and applications, divided into technical stream sections on Knowledge Discovery and Data Mining, Sentiment Analysis and Recommendation, Machine Learning, AI Techniques, and Natural Language Processing, followed by application stream sections on AI for Medicine and Disability, Legal Liability and Finance, Telecoms and eLearning, and Genetic Algorithms in Action. The volume also includes the text of short papers presented as posters at the conference. This is the thirty-third volume in the Research and Development in Intelligent Systems series, which also incorporates the twenty-fourth volume in the Applications and Innovations in Intelligent Systems series. These series are essential reading for those who wish to keep up to date with developments in this important field.

Book High Performance Silicon Imaging

Download or read book High Performance Silicon Imaging written by Daniel Durini and published by Woodhead Publishing. This book was released on 2019-10-19 with total page 542 pages. Available in PDF, EPUB and Kindle. Book excerpt: High Performance Silicon Imaging: Fundamentals and Applications of CMOS and CCD Sensors, Second Edition, covers the fundamentals of silicon image sensors, addressing existing performance issues and current and emerging solutions. Silicon imaging is a fast growing area of the semiconductor industry. Its use in cell phone cameras is already well established, with emerging applications including web, security, automotive and digital cinema cameras. The book has been revised to reflect the latest state-of-the art developments in the field, including 3D imaging, advances in achieving lower signal noise, and new applications for consumer markets. The fundamentals section has also been expanded to include a chapter on the characterization and testing of CMOS and CCD sensors that is crucial to the success of new applications. This book is an excellent resource for both academics and engineers working in the optics, photonics, semiconductor and electronics industries. - Covers the fundamentals of silicon-based image sensors and technical advances, focusing on performance issues - Looks at image sensors in applications, such as mobile phones, scientific imaging, and TV broadcasting, and in automotive, consumer and biomedical applications - Addresses the theory behind 3D imaging and 3D sensor development, including challenges and opportunities