Download or read book 2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits written by IEEE Staff and published by . This book was released on 2009 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book 2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits Ipfa 2009 written by and published by IEEE. This book was released on 2009-09-02 with total page 418 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Reliability and Failure Analysis of High Power LED Packaging written by Cher Ming Tan and published by Woodhead Publishing. This book was released on 2022-09-24 with total page 190 pages. Available in PDF, EPUB and Kindle. Book excerpt: Reliability and Failure Analysis of High-Power LED Packaging provides fundamental understanding of the reliability and failure analysis of materials for high-power LED packaging, with the ultimate goal of enabling new packaging materials. This book describes the limitations of the present reliability standards in determining the lifetime of high-power LEDs due to the lack of deep understanding of the packaging materials and their interaction with each other. Many new failure mechanisms are investigated and presented with consideration of the different stresses imposed by varying environmental conditions. The detailed failure mechanisms are unique to this book and will provide insights for readers regarding the possible failure mechanisms in high-power LEDs. The authors also show the importance of simulation in understanding the hidden failure mechanisms in LEDs. Along with simulation, the use of various destructive and non-destructive tools such as C-SAM, SEM, FTIR, Optical Microscopy, etc. in investigation of the causes of LED failures are reviewed. The advancement of LEDs in the last two decades has opened vast new applications for LEDs which also has led to harsher stress conditions for high-power LEDs. Thus, existing standards and reliability tests need to be revised to meet the new demands for high-power LEDs. Introduces the failure mechanisms of high-power LEDs under varying environmental conditions and methods of how to test, simulate, and predict them Describes the chemistry underlying the material degradation and its impact on LEDs Discusses future directions of new packaging materials for improved performance and reliability of high-power LEDs

Download or read book ISTFA 2019 Proceedings of the 45th International Symposium for Testing and Failure Analysis written by and published by ASM International. This book was released on 2019-12-01 with total page 540 pages. Available in PDF, EPUB and Kindle. Book excerpt: The theme for the 2019 conference is Novel Computing Architectures. Papers will include discussions on the advent of Artificial Intelligence and the promise of quantum computing that are driving disruptive computing architectures; Neuromorphic chip designs on one hand, and Quantum Bits on the other, still in R&D, will introduce new computing circuitry and memory elements, novel materials, and different test methodologies. These novel computing architectures will require further innovation which is best achieved through a collaborative Failure Analysis community composed of chip manufacturers, tool vendors, and universities.

Download or read book 3D Microelectronic Packaging written by Yan Li and published by Springer Nature. This book was released on 2020-11-23 with total page 629 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging. It provides readers an in-depth understanding of the latest research and development findings regarding this key industry trend, including TSV, die processing, micro-bumps for LMI and MMI, direct bonding and advanced materials, as well as quality, reliability, fault isolation, and failure analysis for 3D microelectronic packages. Images, tables, and didactic schematics are used to illustrate and elaborate on the concepts discussed. Readers will gain a general grasp of 3D packaging, quality and reliability concerns, and common causes of failure, and will be introduced to developing areas and remaining gaps in 3D packaging that can help inspire future research and development.

Download or read book Nanoelectronic Devices for Hardware and Software Security written by Arun Kumar Singh and published by CRC Press. This book was released on 2021-10-31 with total page 353 pages. Available in PDF, EPUB and Kindle. Book excerpt: Nanoelectronic Devices for Hardware and Software Security has comprehensive coverage of the principles, basic concepts, structure, modeling, practices, and circuit applications of nanoelectronics in hardware/software security. It also covers the future research directions in this domain. In this evolving era, nanotechnology is converting semiconductor devices dimensions from micron technology to nanotechnology. Nanoelectronics would be the key enabler for innovation in nanoscale devices, circuits, and systems. The motive for this research book is to provide relevant theoretical frameworks that include device physics, modeling, circuit design, and the latest developments in experimental fabrication in the field of nanotechnology for hardware/software security. There are numerous challenges in the development of models for nanoscale devices (e.g., FinFET, gate-all-around devices, TFET, etc.), short channel effects, fringing effects, high leakage current, and power dissipation, among others. This book will help to identify areas where there are challenges and apply nanodevice and circuit techniques to address hardware/software security issues.

Download or read book Opto VLSI Devices and Circuits for Biomedical and Healthcare Applications written by Ankur Kumar and published by CRC Press. This book was released on 2023-09-04 with total page 250 pages. Available in PDF, EPUB and Kindle. Book excerpt: The text comprehensively discusses the latest Opto-VLSI devices and circuits useful for healthcare and biomedical applications. It further emphasizes the importance of smart technologies such as artificial intelligence, machine learning, and the internet of things for the biomedical and healthcare industries. Discusses advanced concepts in the field of electro-optics devices for medical applications. Presents optimization techniques including logical effort, particle swarm optimization and genetic algorithm to design Opto-VLSI devices and circuits. Showcases the concepts of artificial intelligence and machine learning for smart medical devices and data auto-collection for distance treatment. Covers advanced Opto-VLSI devices including a field-effect transistor and optical sensors, spintronic and photonic devices. Highlights application of flexible electronics in health monitoring and artificial intelligence integration for better medical devices. The text presents the advances in the fields of optics and VLSI and their applicability in diverse areas including biomedical engineering and the healthcare sector. It covers important topics such as FET biosensors, optical biosensors and advanced optical materials. It further showcases the significance of smart technologies such as artificial intelligence, machine learning and the internet of things for the biomedical and healthcare industries. It will serve as an ideal design book for senior undergraduate, graduate students, and academic researchers in the fields including electrical engineering, electronics and communication engineering, computer engineering and biomedical engineering.

Download or read book Solid State Lighting Reliability Part 2 written by Willem Dirk van Driel and published by Springer. This book was released on 2017-07-11 with total page 606 pages. Available in PDF, EPUB and Kindle. Book excerpt: In the past four years we have witnessed rapid development in technology and significant market penetration in many applications for LED systems. New processes and new materials have been introduced; new standards and new testing methods have been developed; new driver, control and sensing technologies have been integrated; and new and unknown failure modes have also been presented. In this book, Solid State Lighting Reliability Part 2, we invited the experts from industry and academia to present the latest developments and findings in the LED system reliability arena. Topics in this book cover the early failures and critical steps in LED manufacturing; advances in reliability testing and standards; quality of colour and colour stability; degradation of optical materials and the associated chromaticity maintenance; characterization of thermal interfaces; LED solder joint testing and prediction; common failure modes in LED drivers; root causes for lumen depreciation; corrosion sensitivity of LED packages; reliability management for automotive LEDs, and lightning effects on LEDs. This book is a continuation of Solid State Lighting Reliability: Components to Systems (published in 2013), which covers reliability aspects ranging from the LED to the total luminaire or system of luminaires. Together, these two books are a full set of reference books for Solid State Lighting reliability from the performance of the (sub-) components to the total system, regardless its complexity.

Download or read book Microelectronics and Signal Processing written by Sanket Goel and published by CRC Press. This book was released on 2021-06-06 with total page 283 pages. Available in PDF, EPUB and Kindle. Book excerpt: Discusses state-of-the-art and the realization of the integrated device to test the amplification proposal of a synthetic nucleic acid template. It covers the control algorithm for designing the Maximum Power Point Tracker (MPPT) enabled electrical interface system. Discusses designing and generating new metasurface antenna for future applications. Covers integration of optical structures with MEMS devices for implementation in Photonic Integrated Circuits. Presents state-of-art in-exact multiplier architectures and their efficient implementation.

Download or read book Lock in Thermography written by Otwin Breitenstein and published by Springer. This book was released on 2019-01-09 with total page 321 pages. Available in PDF, EPUB and Kindle. Book excerpt: This is the first book on lock-in thermography, an analytical method applied to the diagnosis of microelectronic devices. This useful introduction and guide reviews various experimental approaches to lock-in thermography, with special emphasis on the lock-in IR thermography developed by the authors themselves.

Download or read book Handbook of Silicon Based MEMS Materials and Technologies written by Markku Tilli and published by Elsevier. This book was released on 2020-04-17 with total page 1028 pages. Available in PDF, EPUB and Kindle. Book excerpt: Handbook of Silicon Based MEMS Materials and Technologies, Third Edition is a comprehensive guide to MEMS materials, technologies, and manufacturing with a particular emphasis on silicon as the most important starting material used in MEMS. The book explains the fundamentals, properties (mechanical, electrostatic, optical, etc.), materials selection, preparation, modeling, manufacturing, processing, system integration, measurement, and materials characterization techniques of MEMS structures. The third edition of this book provides an important up-to-date overview of the current and emerging technologies in MEMS making it a key reference for MEMS professionals, engineers, and researchers alike, and at the same time an essential education material for undergraduate and graduate students. Provides comprehensive overview of leading-edge MEMS manufacturing technologies through the supply chain from silicon ingot growth to device fabrication and integration with sensor/actuator controlling circuits Explains the properties, manufacturing, processing, measuring and modeling methods of MEMS structures Reviews the current and future options for hermetic encapsulation and introduces how to utilize wafer level packaging and 3D integration technologies for package cost reduction and performance improvements Geared towards practical applications presenting several modern MEMS devices including inertial sensors, microphones, pressure sensors and micromirrors

Download or read book Photovoltaic Thermal Collectors with Nanofluids and Nano PCM written by Ali H. A. Al-Waeli and published by Springer Nature. This book was released on 2024-01-20 with total page 135 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book gives you theory and design of PV/T systems. Are you interested in solar energy? If you are, you must have read about solar panels, or photovoltaics (PV). If you have installed a photovoltaic system, you must have noticed it not to generate the amount of power mentioned in its datasheet. A major issue that PV suffers from is its temperature, which causes a drop in its power. Among the solutions to this issue is to use active cooling methods, such as the hybrid photovoltaic thermal (PV/T) system. These systems can produce electrical and thermal energy simultaneously and within same area. The thermal collector serves to cool down the PV surface temperature, which negatively affects the PV efficiency, to reclaim the efficiency or bring it back close to standard testing conditions value. Moreover, the thermal collector will convey this heat using a working fluid and extract it as thermal energy. On the other hand, the electrical power generated from the PV can be utilized in standalone or grid-connected configuration. Moreover, the book presents a novel PV/T collector which can utilize nanofluids and nano-Phase Change Material (PCM) to enhance its performance in tropical climate conditions. The methods used to develop the heat transfer and energy balance equations are presented as well. PV/T collector numerical simulation using MATLAB and computational fluid dynamic (CFD) was also presented. Finally, the approach of life cycle cost analysis (LCCA) is presented to evaluate PV/T with nanofluid and nano-PCM, economically.

Download or read book Cryptographic Hardware and Embedded Systems CHES 2014 written by Lejla Batina and published by Springer. This book was released on 2014-09-12 with total page 631 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book constitutes the proceedings of the 16th International Workshop on Cryptographic Hardware and Embedded Systems, CHES 2014, held in Busan, South Korea, in September 2014. The 33 full papers included in this volume were carefully reviewed and selected from 127 submissions. They are organized in topical sections named: side-channel attacks; new attacks and constructions; countermeasures; algorithm specific SCA; ECC implementations; implementations; hardware implementations of symmetric cryptosystems; PUFs; and RNGs and SCA issues in hardware.

Download or read book Electrostatic Discharge Protection written by Juin J. Liou and published by CRC Press. This book was released on 2017-12-19 with total page 304 pages. Available in PDF, EPUB and Kindle. Book excerpt: Electrostatic discharge (ESD) is one of the most prevalent threats to electronic components. In an ESD event, a finite amount of charge is transferred from one object (i.e., human body) to another (i.e., microchip). This process can result in a very high current passing through the microchip within a very short period of time. Thus, more than 35 percent of single-event chip damages can be attributed to ESD events, and designing ESD structures to protect integrated circuits against the ESD stresses is a high priority in the semiconductor industry. Electrostatic Discharge Protection: Advances and Applications delivers timely coverage of component- and system-level ESD protection for semiconductor devices and integrated circuits. Bringing together contributions from internationally respected researchers and engineers with expertise in ESD design, optimization, modeling, simulation, and characterization, this book bridges the gap between theory and practice to offer valuable insight into the state of the art of ESD protection. Amply illustrated with tables, figures, and case studies, the text: Instills a deeper understanding of ESD events and ESD protection design principles Examines vital processes including Si CMOS, Si BCD, Si SOI, and GaN technologies Addresses important aspects pertinent to the modeling and simulation of ESD protection solutions Electrostatic Discharge Protection: Advances and Applications provides a single source for cutting-edge information vital to the research and development of effective, robust ESD protection solutions for semiconductor devices and integrated circuits.

Download or read book Proceedings of the 3rd International Conference on Intelligent Technologies and Engineering Systems ICITES2014 written by Jengnan Juang and published by Springer. This book was released on 2015-11-12 with total page 620 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book includes the original, peer reviewed research from the 3rd International Conference on Intelligent Technologies and Engineering Systems (ICITES2014), held in December, 2014 at Cheng Shiu University in Kaohsiung, Taiwan. Topics covered include: Automation and robotics, fiber optics and laser technologies, network and communication systems, micro and nano technologies and solar and power systems. This book also Explores emerging technologies and their application in a broad range of engineering disciplines Examines fiber optics and laser technologies Covers biomedical, electrical, industrial and mechanical systems Discusses multimedia systems and applications, computer vision and image & video signal processing

Download or read book Surface Passivation and Junction Engineering in Silicon written by Gaurav Thareja and published by Stanford University. This book was released on 2011 with total page 99 pages. Available in PDF, EPUB and Kindle. Book excerpt: The planar silicon MOSFET is facing diminishing performance returns in improvement from device geometry scaling. Two alternative devices are being explored as possible solutions to this problem. The first contender is a multi-gate device (FINFET or surround gate) and the other is a MOSFET with high mobility channel material such as germanium, III-V or carbon. Ge has emerged as an important materials platform during recent years. With its high carrier mobility and the ability to detect and emit photons at telecommunications wavelengths, Ge is an attractive candidate for applications in both high performance electronics and optoelectronics. Moreover due to its compatibility with conventional CMOS fabrication, it can be processed using the standard manufacturing techniques that are currently used for silicon. However Ge does present a number of unique challenges that must be overcome, including issues of surface passivation, low n-type dopant solubility, and high dopant diffusivity. In this work, the unique properties of surface passivation enabled by radical oxidation are discussed. Some of the highlights are low temperature processing, substrate orientation independent growth rate of dielectric and low interface density. Subsequently, this radical oxidation is applied to 3D vertical gate all around (GAA) silicon MOSFET devices. Higher drive current, lower gate leakage and higher gate dielectric breakdown voltage are demonstrated for GAA devices using radical oxidation in comparison to thermal oxidation In the second part, radical oxidation is investigated for GeO2 growth as an interfacial layer in high-k / Ge gate stack. Using MOSCAP and n-MOSFET devices on Ge, low interface state density combined with drive current and electron mobility enhancement is demonstrated for Ge devices. In the third part, the source/drain junctions for Ge are studied. Ultra-shallow junctions using plasma immersion ion implantation are demonstrated. High n-type dopant activation in Ge using laser annealing is realized along with high performance diodes, significant reduction of contact resistance and integration in a MOSFET process flow.

Download or read book Nano Bio Electronic Photonic and MEMS Packaging written by C. P.(Ching-Ping) Wong and published by Springer Nature. This book was released on 2021-03-17 with total page 582 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book shows how nanofabrication techniques and nanomaterials can be used to customize packaging for nano devices with applications to electronics, photonics, biological and biomedical research and products. It covers topics such as bio sensing electronics, bio device packaging, MEMS for bio devices and much more, including: Offers a comprehensive overview of nano and bio packaging and their materials based on their chemical and physical sciences and mechanical, electrical and material engineering perspectives; Discusses nano materials as power energy sources, computational analyses of nano materials including molecular dynamic (MD) simulations and DFT calculations; Analyzes nanotubes, superhydrophobic self-clean Lotus surfaces; Covers nano chemistry for bio sensor/bio material device packaging. This second edition includes new chapters on soft materials-enabled packaging for stretchable and wearable electronics, state of the art miniaturization for active implantable medical devices, recent LED packaging and progress, nanomaterials for recent energy storage devices such as lithium ion batteries and supercapacitors and their packaging. Nano- Bio- Electronic, Photonic and MEMS Packaging is the ideal book for all biomedical engineers, industrial electronics packaging engineers, and those engaged in bio nanotechnology applications research.