Download or read book 2008 9th International Symposium on Quality Electronic Design written by IEEE Staff and published by IEEE. This book was released on 2008-12-10 with total page 851 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Ninth International Symposium on Quality Electronic Design written by International Symposium on Quality Electronic Design and published by . This book was released on 2008 with total page 885 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Proceedings of the 9th International Conference on Advanced Intelligent Systems and Informatics 2023 written by AboulElla Hassanien and published by Springer Nature. This book was released on 2023-09-17 with total page 572 pages. Available in PDF, EPUB and Kindle. Book excerpt: This proceedings book constitutes the refereed proceedings of the 9th International Conference on Advanced Intelligent Systems and Informatics (AISI 2023), which took place in Port Said University, Port Said, Egypt, during September 20–22, 2023, Egypt, and is an international interdisciplinary conference that presents a spectrum of scientific research on all aspects of informatics and intelligent systems, technologies, and applications.

Download or read book Power Electronic Packaging written by Yong Liu and published by Springer Science & Business Media. This book was released on 2012-02-15 with total page 606 pages. Available in PDF, EPUB and Kindle. Book excerpt: Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions.

Download or read book Low Power RF Circuit Design in Standard CMOS Technology written by Unai Alvarado and published by Springer Science & Business Media. This book was released on 2011-10-18 with total page 248 pages. Available in PDF, EPUB and Kindle. Book excerpt: Low Power Consumption is one of the critical issues in the performance of small battery-powered handheld devices. Mobile terminals feature an ever increasing number of wireless communication alternatives including GPS, Bluetooth, GSM, 3G, WiFi or DVB-H. Considering that the total power available for each terminal is limited by the relatively slow increase in battery performance expected in the near future, the need for efficient circuits is now critical. This book presents the basic techniques available to design low power RF CMOS analogue circuits. It gives circuit designers a complete guide of alternatives to optimize power consumption and explains the application of these rules in the most common RF building blocks: LNA, mixers and PLLs. It is set out using practical examples and offers a unique perspective as it targets designers working within the standard CMOS process and all the limitations inherent in these technologies.

Download or read book High Speed and Lower Power Technologies written by Jung Han Choi and published by CRC Press. This book was released on 2018-09-03 with total page 348 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book explores up-to-date research trends and achievements on low-power and high-speed technologies in both electronics and optics. It offers unique insight into low-power and high-speed approaches ranging from devices, ICs, sub-systems and networks that can be exploited for future mobile devices, 5G networks, Internet of Things (IoT), and data centers. It collects heterogeneous topics in place to catch and predict future research directions of devices, circuits, subsystems, and networks for low-power and higher-speed technologies. Even it handles about artificial intelligence (AI) showing examples how AI technology can be combined with concurrent electronics. Written by top international experts in both industry and academia, the book discusses new devices, such as Si-on-chip laser, interconnections using graphenes, machine learning combined with CMOS technology, progresses of SiGe devices for higher-speed electronices for optic, co-design low-power and high-speed circuits for optical interconnect, low-power network-on-chip (NoC) router, X-ray quantum counting, and a design of low-power power amplifiers. Covers modern high-speed and low-power electronics and photonics. Discusses novel nano-devices, electronics & photonic sub-systems for high-speed and low-power systems, and many other emerging technologies like Si photonic technology, Si-on-chip laser, low-power driver for optic device, and network-on-chip router. Includes practical applications and recent results with respect to emerging low-power systems. Addresses the future perspective of silicon photonics as a low-power interconnections and communication applications.

Download or read book Emerging Technologies and Circuits written by Amara Amara and published by Springer Science & Business Media. This book was released on 2010-09-28 with total page 257 pages. Available in PDF, EPUB and Kindle. Book excerpt: Emerging Technologies and Circuits contains a set of outstanding papers, keynote and tutorials presented during 3 days at the International Conference On Integrated Circuit Design and Technology (ICICDT) held in June 2008 in Minatec, Grenoble.

Download or read book VLSI Noise Processing Circuits Theoretical Bases and Implementations written by Hongjiang Song and published by Lulu.com. This book was released on 2015-06-08 with total page 390 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book covers various VLSI circuit noise effects and VLSI noise processing circuit implementations. All materials are organized in am unified framework with VLSI noise modeling and noise processing circuits across various VLSI signal domains.

Download or read book Introduction to VLSI Design Flow written by Sneh Saurabh and published by Cambridge University Press. This book was released on 2023-06-09 with total page 983 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Wafer Level Chip Scale Packaging written by Shichun Qu and published by Springer. This book was released on 2014-09-10 with total page 336 pages. Available in PDF, EPUB and Kindle. Book excerpt: Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling. Recent advances in analog and power electronic WLCSP packaging are presented based on the development of analog technology and power device integration. The book covers in detail how advances in semiconductor content, analog and power advanced WLCSP design, assembly, materials and reliability have co-enabled significant advances in fan-in and fan-out with redistributed layer (RDL) of analog and power device capability during recent years. Since the analog and power electronic wafer level packaging is different from regular digital and memory IC package, this book will systematically introduce the typical analog and power electronic wafer level packaging design, assembly process, materials, reliability and failure analysis, and material selection. Along with new analog and power WLCSP development, the role of modeling is a key to assure successful package design. An overview of the analog and power WLCSP modeling and typical thermal, electrical and stress modeling methodologies is also presented in the book.

Download or read book Advanced Packaging written by and published by . This book was released on 2008-01 with total page 40 pages. Available in PDF, EPUB and Kindle. Book excerpt: Advanced Packaging serves the semiconductor packaging, assembly and test industry. Strategically focused on emerging and leading-edge methods for manufacturing and use of advanced packages.

Download or read book Mechanical And Electronics Engineering Proceedings Of The International Conference On Icmee 2009 written by Venkatesh Mahadevan and published by World Scientific. This book was released on 2009-07-16 with total page 334 pages. Available in PDF, EPUB and Kindle. Book excerpt: The 2009 International Conference on Mechanical and Electronics Engineering (ICMEE 2009) will be held in Chennai, India from 24-26 July, 2009. The aim of ICMEE 2009 is to provide a platform for researchers, engineers, academicians as well as industrial professionals from all over the world to present their research findings and development activities in mechanical and electronics engineering. This conference provides opportunities for the delegates to exchange new ideas and application experiences face to face, to forge new business or research relations and to find global partners for future collaboration.

Download or read book Design and Test Technology for Dependable Systems on chip written by Raimund Ubar and published by IGI Global. This book was released on 2011-01-01 with total page 550 pages. Available in PDF, EPUB and Kindle. Book excerpt: "This book covers aspects of system design and efficient modelling, and also introduces various fault models and fault mechanisms associated with digital circuits integrated into System on Chip (SoC), Multi-Processor System-on Chip (MPSoC) or Network on Chip (NoC)"--

Download or read book Low Power Semiconductor Devices and Processes for Emerging Applications in Communications Computing and Sensing written by Sumeet Walia and published by CRC Press. This book was released on 2018-08-06 with total page 380 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book addresses the need to investigate new approaches to lower energy requirement in multiple application areas and serves as a guide into emerging circuit technologies. It explores revolutionary device concepts, sensors, and associated circuits and architectures that will greatly extend the practical engineering limits of energy-efficient computation. The book responds to the need to develop disruptive new system architectures and semiconductor processes aimed at achieving the highest level of computational energy efficiency for general purpose computing systems. Discusses unique technologies and material only available in specialized journal and conferences. Covers emerging materials and device structures, such as ultra-low power technologies, nanoelectronics, and microsystem manufacturing. Explores semiconductor processing and manufacturing, device design, and performance. Contains practical applications in the engineering field, as well as graduate studies. Written by international experts from both academia and industry.

Download or read book Frontiers of Quality Electronic Design QED written by Ali Iranmanesh and published by Springer Nature. This book was released on 2023-01-11 with total page 690 pages. Available in PDF, EPUB and Kindle. Book excerpt: Quality Electronic Design (QED)’s landscape spans a vast region where territories of many participating disciplines and technologies overlap. This book explores the latest trends in several key topics related to quality electronic design, with emphasis on Hardware Security, Cybersecurity, Machine Learning, and application of Artificial Intelligence (AI). The book includes topics in nonvolatile memories (NVM), Internet of Things (IoT), FPGA, and Neural Networks.

Download or read book Spacer Engineered FinFET Architectures written by Sudeb Dasgupta and published by CRC Press. This book was released on 2017-06-26 with total page 158 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book focusses on the spacer engineering aspects of novel MOS-based device–circuit co-design in sub-20nm technology node, its process complexity, variability, and reliability issues. It comprehensively explores the FinFET/tri-gate architectures with their circuit/SRAM suitability and tolerance to random statistical variations.

Download or read book Frequency Measurement Technology written by Ignacio Llamas-Garro and published by Artech House. This book was released on 2017-12-31 with total page 222 pages. Available in PDF, EPUB and Kindle. Book excerpt: This unique first-of-its-kind resource provides practical coverage of the design and implementation of frequency measurement receivers, which aid in identifying unknown signals. The technologies used in frequency measurement interferometry-based on-delay lines and filters are explored in this book. Practitioners also find concrete examples of microwave photonics implementations. The designs and concepts that cover conventional photonic instantaneous frequency measurement (IFM) circuits are explained. This book provides details on new designs for microwave photonic circuits and reconfigurable frequency measurement (RFM) circuits using diodes and MicroElectroMechanical Systems (MEMS). This book explains the many diverse applications of frequency measurement that are used in defense, radar, and communications. The instrumentation used to perform frequency measurements is explained, including the use of block analysis for network and spectrum analyzers and calibration techniques. Readers learn the advantages of using frequency measurement based on microwave/RF techniques, including immunity to electromagnetic interference, low loss, compatibility with fiber signal distribution, and parallel processing signals. Moreover, readers gain insight into the future of frequency measurement receivers. The book examines both the underpinnings and the implementation of frequency measurement receivers using many diverse technological platforms.