Download or read book 2002 7th International Symposium on Plasma and Process Induced Damage written by and published by . This book was released on 2002 with total page 194 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book 2001 7th International Symposium on Plasma and Process Induced Damage written by and published by . This book was released on 2002 with total page 177 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book 2002 8th International Symposium on Plasma and Process Induced Damage written by and published by . This book was released on 2003 with total page 189 pages. Available in PDF, EPUB and Kindle. Book excerpt:
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Download or read book International Symposium on Plasma Process Induced Damage written by and published by . This book was released on 1996 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Plasma Process Induced Damage 1996 1st International Symposium on written by and published by . This book was released on 1996 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book 2003 8th International Symposium on Plasma and Process induced Damage written by and published by . This book was released on 2003 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book ISTFA 2006 written by Electronic Device Failure Analysis Society and published by ASM International. This book was released on 2006 with total page 524 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Plasma Process Induced Damage 1998 3rd International Symposium on written by Moritaka Nakamura and published by . This book was released on 1998-06 with total page 250 pages. Available in PDF, EPUB and Kindle. Book excerpt:
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Download or read book 1996 1st International Symposium on Plasma Process Induced Damage written by Kin P. Cheung and published by IEEE. This book was released on 1996 with total page 237 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book 2001 6th International Symposium on Plasma and Process Induced Damage written by Manfred Engelhardt and published by IEEE. This book was released on 2001-01-01 with total page 128 pages. Available in PDF, EPUB and Kindle. Book excerpt: This work covers topics such as: damage measurement; plasma characterization and damage mitigation; non-volatile memories; ultra-thin dielectrics; contamination; and multi-terminal effects.
Download or read book China Semiconductor Technology International Conference 2010 CSTIC 2010 written by Han-Ming Wu and published by The Electrochemical Society. This book was released on 2010-03 with total page 1203 pages. Available in PDF, EPUB and Kindle. Book excerpt: Our mission is to provide a forum for world experts to discuss technologies, address the growing needs associated with silicon technology, and exchange their discoveries and solutions for current issues of high interest. We encourage collaboration, open discussion, and critical reviews at this conference. Furthermore, we hope that this conference will also provide collaborative opportunities for those who are interested in the semiconductor industry in Asia, particularly in China.
Download or read book Index of Conference Proceedings written by British Library. Document Supply Centre and published by . This book was released on 2003 with total page 870 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Handbook for Cleaning for Semiconductor Manufacturing written by Karen A. Reinhardt and published by John Wiley & Sons. This book was released on 2011-04-12 with total page 596 pages. Available in PDF, EPUB and Kindle. Book excerpt: Provides an In-depth discussion of surface conditioning for semiconductor applications The Handbook of Cleaning for Semiconductor Manufacturing: Fundamentals and Applications provides an in-depth discussion of surface conditioning for semiconductor applications. The fundamental physics and chemistry associated with wet processing is reviewed as well as surface and colloidal aspects of cleaning and etching. Topics covered in this new reference include: Front end line (FEOL) and back end of line (BEOL) cleaning applications such as high-k/metal gate post-etch cleaning and pore sealing, high-dose implant stripping and cleaning, and germanium, and silicon passivation Formulation development practices, methodology and a new directions are presented including chemicals used for preventing corrosion of copper lines, cleaning aluminium lines, reclaiming wafers, and water bonding, as well as the filtering and recirculating of chemicals including reuse and recycling Wetting, cleaning, and drying of features, such as high aspect ratio features and hydrophilic surface states, especially how to dry without watermarks, the abilities to wet hydrophobic surfaces and to remove liquid from deep features The chemical reactions and mechanisms of silicon dioxide etching with hydrofluoric acid, particle removal with ammonium hydroxide/hydrogen peroxide mixture, and metal removal with hydrochloric acid The Handbook of Cleaning for Semiconductor Manufacturing: Fundamentals and Applications is a valuable resource for any engineer or manager associated with using or supplying cleaning and contamination free technologies for semiconductor manufacturing. Engineers working for semiconductor manufacturing, capital equipment, chemicals, or other industries that assures cleanliness of chemicals, material, and equipment in the manufacturing area will also find this handbook an indispensible reference.
Download or read book 1998 3rd International Symposium on Plasma Process Induced Damage written by Moritaka Nakamura and published by Northern California Chapter of the. This book was released on 1998-01-01 with total page 234 pages. Available in PDF, EPUB and Kindle. Book excerpt:
