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Book 19th IEEE VLSI Test Symposium

Download or read book 19th IEEE VLSI Test Symposium written by and published by Institute of Electrical & Electronics Engineers(IEEE). This book was released on 2001 with total page 458 pages. Available in PDF, EPUB and Kindle. Book excerpt: Collects 58 papers from the April/May 2001 symposium that explore new approaches in the testing of electronic circuits and systems. Key areas in testing are discussed, such as BIST, analog measurement, fault tolerance, diagnosis methods, scan chain design, memory test and diagnosis, and test data compression and compaction. Also on the program are sessions on emerging areas that are gaining prominence, including low power testing, testing high speed circuits on low cost testers, processor based self test techniques, and core- based system-on-chip testing. Some of the topics are robust and low cost BIST architectures for sequential fault testing in datapath multipliers, a method for measuring the cycle-to-cycle period jitter of high-frequency clock signals, fault equivalence identification using redundancy information and static and dynamic extraction, and test scheduling for minimal energy consumption under power constraints. No subject index. c. Book News Inc.

Book IEEE VLSI Test Symposium

Download or read book IEEE VLSI Test Symposium written by and published by . This book was released on 2005 with total page 498 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Book Fault Diagnosis of Analog Integrated Circuits

Download or read book Fault Diagnosis of Analog Integrated Circuits written by Prithviraj Kabisatpathy and published by Springer Science & Business Media. This book was released on 2006-01-13 with total page 183 pages. Available in PDF, EPUB and Kindle. Book excerpt: Enables the reader to test an analog circuit that is implemented either in bipolar or MOS technology. Examines the testing and fault diagnosis of analog and analog part of mixed signal circuits. Covers the testing and fault diagnosis of both bipolar and Metal Oxide Semiconductor (MOS) circuits and introduces . Also contains problems that can be used as quiz or homework.

Book Design and Test Technology for Dependable Systems on chip

Download or read book Design and Test Technology for Dependable Systems on chip written by Raimund Ubar and published by IGI Global. This book was released on 2011-01-01 with total page 550 pages. Available in PDF, EPUB and Kindle. Book excerpt: "This book covers aspects of system design and efficient modelling, and also introduces various fault models and fault mechanisms associated with digital circuits integrated into System on Chip (SoC), Multi-Processor System-on Chip (MPSoC) or Network on Chip (NoC)"--

Book Algorithms and Architectures for Parallel Processing

Download or read book Algorithms and Architectures for Parallel Processing written by Sang-Soo Yeo and published by Springer. This book was released on 2010-05-29 with total page 490 pages. Available in PDF, EPUB and Kindle. Book excerpt: It is our great pleasure to present the proceedings of the symposia and workshops on parallel and distributed computing and applications associated with the ICA3PP 2010 conference. These symposia and workshops provide vibrant opportunities for researchers and industry practitioners to share their research experience, original research results and practical development experiences in the new challenging research areas of parallel and distributed computing technologies and applications. It was the first time that the ICA3PP conference series added symposia and wo- shops to its program in order to provide a wide range of topics that extend beyond the main conferences. The goal was to provide a better coverage of emerging research areas and also forums for focused and stimulating discussions. With this objective in mind, we selected three workshops to accompany the ICA3PP 2010 conference: • FPDC 2010, the 2010 International Symposium on Frontiers of Parallel and Distributed Computing • HPCTA 2010, the 2010 International Workshop on High-Performance Computing, Technologies and Applications • M2A 2010, the 2010 International Workshop on Multicore and Mul- threaded Architectures and Algorithms Each of the symposia / workshops focused on a particular theme and complemented the spectrum of the main conference. All papers published in the workshops proce- ings were selected by the Program Committee on the basis of referee reports. Each paper was reviewed by independent referees who judged the papers for originality, quality, contribution, presentation and consistency with the theme of the workshops.

Book Industrial Engineering and Applications

Download or read book Industrial Engineering and Applications written by L.-C. Tang and published by IOS Press. This book was released on 2023-08-09 with total page 880 pages. Available in PDF, EPUB and Kindle. Book excerpt: The field of industrial engineering (IE) has a very wide scope, from production processes and automation to supply chain management, but the scope of IE techniques has expanded beyond the traditional domains of application, and is now relevant to areas that matter most to society at large. This book presents the proceedings of ICIEA 2023, the 10th International Conference on Industrial Engineering and Applications, held in Phuket, Thailand, from 4 to 6 April 2023. The conference was conducted in hybrid mode, with close to 100 delegates attending in person and about 50 participants attending online. A total of 272 submissions were received for the conference, of which 120 were accepted for presentation with 83 of those published here as full papers. These papers cover a wide range of topics within the scope of industrial and systems engineering, including but not limited to: supply chain and logistics; quality and reliability; advanced manufacturing; and production scheduling to ergonomics and man-machine systems interfaces. In particular, a significant number of papers are devoted to machine learning techniques and applications beyond the traditional manufacturing sector, to include healthcare, sustainability assessment, and other social issues. Offering an overview of recent research and novel applications, the book will be of interest to all those whose work involves the application of industrial engineering techniques.

Book Power Aware Testing and Test Strategies for Low Power Devices

Download or read book Power Aware Testing and Test Strategies for Low Power Devices written by Patrick Girard and published by Springer Science & Business Media. This book was released on 2010-03-11 with total page 376 pages. Available in PDF, EPUB and Kindle. Book excerpt: Managing the power consumption of circuits and systems is now considered one of the most important challenges for the semiconductor industry. Elaborate power management strategies, such as dynamic voltage scaling, clock gating or power gating techniques, are used today to control the power dissipation during functional operation. The usage of these strategies has various implications on manufacturing test, and power-aware test is therefore increasingly becoming a major consideration during design-for-test and test preparation for low power devices. This book explores existing solutions for power-aware test and design-for-test of conventional circuits and systems, and surveys test strategies and EDA solutions for testing low power devices.

Book Defect and Fault Tolerance in VLSI Systems

Download or read book Defect and Fault Tolerance in VLSI Systems written by Robert Aitken and published by . This book was released on 2004 with total page 524 pages. Available in PDF, EPUB and Kindle. Book excerpt: DFT 2004 showcases the latest research results in the in the field of defect and fault tolerance in VLSI systems. Its papers cover yield, defect and fault tolerance, error correction, and circuit/system reliability and dependability.

Book System on Chip for Real Time Applications

Download or read book System on Chip for Real Time Applications written by Wael Badawy and published by Springer Science & Business Media. This book was released on 2002-10-31 with total page 476 pages. Available in PDF, EPUB and Kindle. Book excerpt: System-on-Chip for Real-Time Applications will be of interest to engineers, both in industry and academia, working in the area of SoC VLSI design and application. It will also be useful to graduate and undergraduate students in electrical and computer engineering and computer science. A selected set of papers from the 2nd International Workshop on Real-Time Applications were used to form the basis of this book. It is organized into the following chapters: -Introduction; -Design Reuse; -Modeling; -Architecture; -Design Techniques; -Memory; -Circuits; -Low Power; -Interconnect and Technology; -MEMS. System-on-Chip for Real-Time Applications contains many signal processing applications and will be of particular interest to those working in that community.

Book Index of Conference Proceedings

Download or read book Index of Conference Proceedings written by British Library. Document Supply Centre and published by . This book was released on 2001 with total page 870 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Book Timing Jitter in Time of Flight Range Imaging Cameras

Download or read book Timing Jitter in Time of Flight Range Imaging Cameras written by Gehan Anthonys and published by Springer Nature. This book was released on 2022-03-11 with total page 299 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book explains how depth measurements from the Time-of-Flight (ToF) range imaging cameras are influenced by the electronic timing-jitter. The author presents jitter extraction and measurement techniques for any type of ToF range imaging cameras. The author mainly focuses on ToF cameras that are based on the amplitude modulated continuous wave (AMCW) lidar techniques that measure the phase difference between the emitted and reflected light signals. The book discusses timing-jitter in the emitted light signal, which is sensible since the light signal of the camera is relatively straightforward to access. The specific types of jitter that present on the light source signal are investigated throughout the book. The book is structured across three main sections: a brief literature review, jitter measurement, and jitter influence in AMCW ToF range imaging.

Book Integrated High Vin Multi MHz Converters

Download or read book Integrated High Vin Multi MHz Converters written by Jürgen Wittmann and published by Springer Nature. This book was released on 2019-09-03 with total page 184 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides readers with guidelines for designing integrated multi-MHz-switching converters for input voltages/system supplies up to 50V or higher. Coverage includes converter theory, converter architectures, circuit design, efficiency, sizing of passives, technology aspects, etc. The author discusses new circuit designs, new architectures and new switching concepts, including dead-time control and soft-switching techniques that overcome current limitations of these converters. The discussion includes technology related issues and helps readers to choose the right technology for fast-switching converters. This book discusses benefits and drawbacks in terms of integration, size and cost, efficiency and complexity, and enables readers to make trade-offs in design, given different converter parameters. Describes a study for increasing switching frequencies up to 30 MHz at input voltages up to 50V or higher in the scaling of the size of switching converter passives; Analyzes various buck converter implementations and shows that a preference due to higher efficiency depends on the operating point, on the available switch technologies, and on the implementation of the high-side supply generation; Describes an efficiency model based on a four-phase model, which enables separation of loss causes and loss locations.

Book Proceedings

    Book Details:
  • Author : Asim Smailagic
  • Publisher : Institute of Electrical & Electronics Engineers(IEEE)
  • Release : 2003
  • ISBN : 9780769519043
  • Pages : 304 pages

Download or read book Proceedings written by Asim Smailagic and published by Institute of Electrical & Electronics Engineers(IEEE). This book was released on 2003 with total page 304 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Symposium covers a range of topics: from VLSI circuits, systems, and design methods to system level design and system-on-chip issues, to bringing VLSI experience to new areas and technologies like nano- and molecular devices. Future design methodologies are also one of the key topics at the symposium, as well as new CAD tools to support them. Over almost two decades this has been an unique forum promoting multidisciplinary research and new visionary research approaches in the area of VLSI.

Book Asian Test Symposium

Download or read book Asian Test Symposium written by and published by . This book was released on 2005 with total page 526 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Book Modeling and Testing for Signal Integrity in Nanometer System on chips

Download or read book Modeling and Testing for Signal Integrity in Nanometer System on chips written by Xiaoliang Bai and published by . This book was released on 2003 with total page 372 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Book Handbook of 3D Integration  Volume 4

Download or read book Handbook of 3D Integration Volume 4 written by Paul D. Franzon and published by John Wiley & Sons. This book was released on 2019-01-25 with total page 655 pages. Available in PDF, EPUB and Kindle. Book excerpt: This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective. Edited and authored by key contributors from top research institutions and high-tech companies, the first part of the book provides an overview of the latest developments in 3D chip design, including challenges and opportunities. The second part focuses on the test methods used to assess the quality and reliability of the 3D-integrated circuits, while the third and final part deals with thermal management and advanced cooling technologies and their integration.