Download or read book 1997 IEEE International Symposium on Semiconductor Manufacturing written by and published by . This book was released on 1997 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book 1997 IEEE International Symposium on Semiconductor Manufacturing written by IEEE Electron Devices Society and published by Institute of Electrical & Electronics Engineers(IEEE). This book was released on 1997 with total page 300 pages. Available in PDF, EPUB and Kindle. Book excerpt: ISSM is a forum of semiconductor manufacturing professionals dedicated to sharing technical solutions and opinions on the advancement of manufacturing science. This text covers ISSM 1997, the theme of which is Manufacturing The Bridge to the Next Millennium.
Download or read book Data Intelligence and Cognitive Informatics written by I. Jeena Jacob and published by Springer Nature. This book was released on 2021-01-08 with total page 916 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book discusses new cognitive informatics tools, algorithms and methods that mimic the mechanisms of the human brain which lead to an impending revolution in understating a large amount of data generated by various smart applications. The book is a collection of peer-reviewed best selected research papers presented at the International Conference on Data Intelligence and Cognitive Informatics (ICDICI 2020), organized by SCAD College of Engineering and Technology, Tirunelveli, India, during 8–9 July 2020. The book includes novel work in data intelligence domain which combines with the increasing efforts of artificial intelligence, machine learning, deep learning and cognitive science to study and develop a deeper understanding of the information processing systems.
Download or read book ISPSD 97 written by and published by . This book was released on 1997 with total page 375 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Handbook of Integrated Circuit Industry written by Yangyuan Wang and published by Springer Nature. This book was released on 2023-12-29 with total page 2006 pages. Available in PDF, EPUB and Kindle. Book excerpt: Written by hundreds experts who have made contributions to both enterprise and academics research, these excellent reference books provide all necessary knowledge of the whole industrial chain of integrated circuits, and cover topics related to the technology evolution trends, fabrication, applications, new materials, equipment, economy, investment, and industrial developments of integrated circuits. Especially, the coverage is broad in scope and deep enough for all kind of readers being interested in integrated circuit industry. Remarkable data collection, update marketing evaluation, enough working knowledge of integrated circuit fabrication, clear and accessible category of integrated circuit products, and good equipment insight explanation, etc. can make general readers build up a clear overview about the whole integrated circuit industry. This encyclopedia is designed as a reference book for scientists and engineers actively involved in integrated circuit research and development field. In addition, this book provides enough guide lines and knowledges to benefit enterprisers being interested in integrated circuit industry.
Download or read book Advances in Production Management Systems New Challenges New Approaches written by Bruno Vallespir and published by Springer Science & Business Media. This book was released on 2010-10-15 with total page 681 pages. Available in PDF, EPUB and Kindle. Book excerpt: The present economic and social environment has given rise to new situations within which companies must operate. As a first example, the globalization of the economy and the need for performance has led companies to outsource and then to operate inside networks of enterprises such as supply chains or virtual enterprises. A second instance is related to environmental issues. The statement about the impact of ind- trial activities on the environment has led companies to revise processes, to save - ergy, to optimize transportation.... A last example relates to knowledge. Knowledge is considered today to be one of the main assets of a company. How to capitalize, to manage, to reuse it for the benefit of the company is an important current issue. The three examples above have no direct links. However, each of them constitutes a challenge that companies have to face today. This book brings together the opinions of several leading researchers from all around the world. Together they try to develop new approaches and find answers to those challenges. Through the individual ch- ters of this book, the authors present their understanding of the different challenges, the concepts on which they are working, the approaches they are developing and the tools they propose. The book is composed of six parts; each one focuses on a specific theme and is subdivided into subtopics.
Download or read book Silicon Nitride and Silicon Dioxide Thin Insulating Films written by Electrochemical Society. Dielectric Science and Technology Division and published by The Electrochemical Society. This book was released on 2001 with total page 304 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Silicon Nitride and Silicon Dioxide Thin Insulating Films written by and published by . This book was released on 2001 with total page 306 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Advances in Manufacturing Technology XXXII written by P. Thorvald and published by IOS Press. This book was released on 2018-08-29 with total page 558 pages. Available in PDF, EPUB and Kindle. Book excerpt: The urgent need to keep pace with the accelerating globalization of manufacturing in the 21st century has produced rapid advancements in technology, research and innovation. This book presents the proceedings of the 16th International Conference on Manufacturing Research incorporating the 33nd National Conference on Manufacturing Research (ICMR 2018), held in Skövde, Sweden, in September 2018. The aim of the conference is to create a friendly and inclusive environment, bringing together researchers, academics and industrialists with practical and theoretical knowledge to share and discuss emerging trends and new challenges. The book is divided into 12 parts, covering areas such as the manufacturing process; robots; product design and development; smart manufacturing; and lean, among others. Covering both cutting-edge research and recent industrial applications, the book will appeal to all those with an interest in recent advances in manufacturing technology.
Download or read book 60th Conference on Glass Problems written by John Kieffer and published by John Wiley & Sons. This book was released on 2009-09-28 with total page 290 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume is part of the Ceramic Engineering and Science Proceeding (CESP) series. This series contains a collection of papers dealing with issues in both traditional ceramics (i.e., glass, whitewares, refractories, and porcelain enamel) and advanced ceramics. Topics covered in the area of advanced ceramic include bioceramics, nanomaterials, composites, solid oxide fuel cells, mechanical properties and structural design, advanced ceramic coatings, ceramic armor, porous ceramics, and more.
Download or read book Index of Conference Proceedings written by British Library. Document Supply Centre and published by . This book was released on 2003 with total page 870 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Semiconductor Technology ISTC 2001 written by Ming Yang and published by . This book was released on 2001 with total page 688 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Crystalline Defects and Contamination written by Bernd O. Kolbesen and published by The Electrochemical Society. This book was released on 2001 with total page 380 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Advanced Interconnects for ULSI Technology written by Mikhail Baklanov and published by John Wiley & Sons. This book was released on 2012-02-17 with total page 616 pages. Available in PDF, EPUB and Kindle. Book excerpt: Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects, and discusses: Interconnect functions, characterisations, electrical properties and wiring requirements Low-k materials: fundamentals, advances and mechanical properties Conductive layers and barriers Integration and reliability including mechanical reliability, electromigration and electrical breakdown New approaches including 3D, optical, wireless interchip, and carbon-based interconnects Intended for postgraduate students and researchers, in academia and industry, this book provides a critical overview of the enabling technology at the heart of the future development of computer chips.
Download or read book Handbook of Silicon Wafer Cleaning Technology written by Karen Reinhardt and published by William Andrew. This book was released on 2018-03-16 with total page 760 pages. Available in PDF, EPUB and Kindle. Book excerpt: Handbook of Silicon Wafer Cleaning Technology, Third Edition, provides an in-depth discussion of cleaning, etching and surface conditioning for semiconductor applications. The fundamental physics and chemistry associated with wet and plasma processing are reviewed, including surface and colloidal aspects. This revised edition includes the developments of the last ten years to accommodate a continually involving industry, addressing new technologies and materials, such as germanium and III-V compound semiconductors, and reviewing the various techniques and methods for cleaning and surface conditioning. Chapters include numerous examples of cleaning technique and their results. The book helps the reader understand the process they are using for their cleaning application and why the selected process works. For example, discussion of the mechanism and physics of contamination, metal, particle and organic includes information on particle removal, metal passivation, hydrogen-terminated silicon and other processes that engineers experience in their working environment. In addition, the handbook assists the reader in understanding analytical methods for evaluating contamination. The book is arranged in an order that segments the various cleaning techniques, aqueous and dry processing. Sections include theory, chemistry and physics first, then go into detail for the various methods of cleaning, specifically particle removal and metal removal, amongst others. Focuses on cleaning techniques including wet, plasma and other surface conditioning techniques used to manufacture integrated circuits Reliable reference for anyone that manufactures integrated circuits or supplies the semiconductor and microelectronics industries Covers processes and equipment, as well as new materials and changes required for the surface conditioning process
Download or read book ISTFA 1997 International Symposium for Testing and Failure Analysis written by Grace M. Davidson and published by ASM International. This book was released on 1997-01-01 with total page 310 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Handbook of Semiconductor Manufacturing Technology written by Yoshio Nishi and published by CRC Press. This book was released on 2017-12-19 with total page 1720 pages. Available in PDF, EPUB and Kindle. Book excerpt: Retaining the comprehensive and in-depth approach that cemented the bestselling first edition's place as a standard reference in the field, the Handbook of Semiconductor Manufacturing Technology, Second Edition features new and updated material that keeps it at the vanguard of today's most dynamic and rapidly growing field. Iconic experts Robert Doering and Yoshio Nishi have again assembled a team of the world's leading specialists in every area of semiconductor manufacturing to provide the most reliable, authoritative, and industry-leading information available. Stay Current with the Latest Technologies In addition to updates to nearly every existing chapter, this edition features five entirely new contributions on... Silicon-on-insulator (SOI) materials and devices Supercritical CO2 in semiconductor cleaning Low-κ dielectrics Atomic-layer deposition Damascene copper electroplating Effects of terrestrial radiation on integrated circuits (ICs) Reflecting rapid progress in many areas, several chapters were heavily revised and updated, and in some cases, rewritten to reflect rapid advances in such areas as interconnect technologies, gate dielectrics, photomask fabrication, IC packaging, and 300 mm wafer fabrication. While no book can be up-to-the-minute with the advances in the semiconductor field, the Handbook of Semiconductor Manufacturing Technology keeps the most important data, methods, tools, and techniques close at hand.
