Download or read book Regional Conference on Science Technology and Social Sciences RCSTSS 2016 written by Nor Azizah Yacob and published by Springer. This book was released on 2018-05-26 with total page 1019 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book gathers selected theoretical and applied science papers presented at the 2016 Regional Conference of Sciences, Technology and Social Sciences (RCSTSS 2016), organized biannually by the Universiti Teknologi MARA Pahang, Malaysia. Addressing a broad range of topics, including architecture, computer science, engineering, environmental and management, furniture, forestry, health and medicine, material science, mathematics, plantation and agrotechnology, sports science and statistics, the book serves as an essential platform for disseminating research findings, and inspires positive innovations in the region’s development. The carefully reviewed papers in this volume present work by researchers of local, regional and global prominence. Taken together, they offer a valuable reference guide and point of departure for all academics and students who want to pursue further research in their respective fields.

Download or read book From LED to Solid State Lighting written by S. W. Ricky Lee and published by John Wiley & Sons. This book was released on 2021-09-28 with total page 260 pages. Available in PDF, EPUB and Kindle. Book excerpt: FROM LED TO SOLID STATE LIGHTING A comprehensive and practical reference complete with hands-on exercises and experimental data In From LED to Solid State Lighting: Principles, Materials, Packaging, Characterization, and Applications, accomplished mechanical engineers Shi-Wei Ricky Lee, Jeffery C. C. Lo, Mian Tao, and Huaiyu Ye deliver a practical overview of the design and construction of LED lighting modules, from the fabrication of the LED chip to the LED modules incorporated in complete LED lighting fixtures. The distinguished authors discuss the major advantages of solid-state lighting, including energy savings, environmental friendliness, and lengthy operational life, as well as the contributions offered by the packaging of light-emitting diodes in the pursuit of these features. Readers will discover presentations of the technical issues that arise in packaging LED components, like interconnection, phosphor deposition, and encapsulation. They’ll also find insightful elaborations on optical design, analysis, and characterization. Discussions of LED applications, technology roadmaps, and IP issues round out the included material. This important book also includes: Thorough introductions to lighting, photometry, and colorimetry, the fundamentals of light-emitting diodes, and the fabrication of LED wafers and chips Practical discussions of the packaging of LED chips, wafer-level packaging of LED arrays, and optical and electrical characterization Comprehensive explorations of board-level assembly and LED modules and optical and electrical characterization In-depth examinations of thermal management, reliability engineering for LED packaging, and applications for general lighting Perfect for post-graduate students and practicing engineers studying or working in the field of LED manufacturing for solid state lighting applications, From LED to Solid State Lighting: Principles, Materials, Packaging, Characterization, and Applications is also an indispensable resource for managers and technicians seeking a one-stop guide to the subject.

Download or read book Reliability of Organic Compounds in Microelectronics and Optoelectronics written by Willem Dirk van Driel and published by Springer Nature. This book was released on 2022-01-31 with total page 552 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book aims to provide a comprehensive reference into the critical subject of failure and degradation in organic materials, used in optoelectronics and microelectronics systems and devices. Readers in different industrial sectors, including microelectronics, automotive, lighting, oil/gas, and petrochemical will benefit from this book. Several case studies and examples are discussed, which readers will find useful to assess and mitigate similar failure cases. More importantly, this book presents methodologies and useful approaches in analyzing a failure and in relating a failure to the reliability of materials and systems.

Download or read book Finite Element Analysis written by David Moratal and published by BoD – Books on Demand. This book was released on 2010-08-17 with total page 700 pages. Available in PDF, EPUB and Kindle. Book excerpt: Finite element analysis is an engineering method for the numerical analysis of complex structures. This book provides a bird's eye view on this very broad matter through 27 original and innovative research studies exhibiting various investigation directions. Through its chapters the reader will have access to works related to Biomedical Engineering, Materials Engineering, Process Analysis and Civil Engineering. The text is addressed not only to researchers, but also to professional engineers, engineering lecturers and students seeking to gain a better understanding of where Finite Element Analysis stands today.

Download or read book Index of Conference Proceedings written by British Library. Document Supply Centre and published by . This book was released on 2001 with total page 870 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Encyclopedia Of Packaging Materials Processes And Mechanics Set 1 Die attach And Wafer Bonding Technology A 4 volume Set written by and published by World Scientific. This book was released on 2019-08-27 with total page 1079 pages. Available in PDF, EPUB and Kindle. Book excerpt: Packaging materials, assembly processes, and the detailed understanding of multilayer mechanics have enabled much of the progress in miniaturization, reliability, and functional density achieved by modern electronic, microelectronic, and nanoelectronic products. The design and manufacture of miniaturized packages, providing low-loss electrical and/or optical communication, while protecting the semiconductor chips from environmental stresses and internal power cycling, require a carefully balanced selection of packaging materials and processes. Due to the relative fragility of these semiconductor chips, as well as the underlying laminated substrates and the bridging interconnect, selection of the packaging materials and processes is inextricably bound with the mechanical behavior of the intimately packaged multilayer structures, in all phases of development for traditional, as well as emerging, electronic product categories.The Encyclopedia of Packaging Materials, Processes, and Mechanics, compiled in 8, multi-volume sets, provides comprehensive coverage of the configurations and techniques, assembly materials and processes, modeling and simulation tools, and experimental characterization and validation techniques for electronic packaging. Each of the volumes presents the accumulated wisdom and shared perspectives of leading researchers and practitioners in the packaging of electronic components. The Encyclopedia of Packaging Materials, Processes, and Mechanics will provide the novice and student with a complete reference for a quick ascent on the packaging 'learning curve,' the practitioner with a validated set of techniques and tools to face every challenge in packaging design and development, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in the assembly and mechanical behavior of electronic and photonic components and systems. It will be most beneficial to undergraduate and graduate students studying materials, mechanical, electrical, and electronic engineering, with a strong interest in electronic packaging applications.

Download or read book Recent Progress in Lead Free Solder Technology written by Mohd Arif Anuar Mohd Salleh and published by Springer Nature. This book was released on 2022-03-01 with total page 332 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book highlights recent research progress in lead (Pb)-free solder technology, focusing on materials development, processing, and performances. It discusses various Pb-free solder materials’ development, encompassing composite solders, transient liquid phase sintering, and alloying. The book also details various Pb-free solder technology processing and performances, including flux modification for soldering, laser soldering, wave soldering, and reflow soldering, while also examining multiple technologies pertaining to the rigid and flexible printed circuit board (PCB). Some chapters explain the materials characterization and modeling techniques using computational fluid dynamics (CFD). This book serves as a valuable reference for researchers, industries, and stakeholders in advanced microelectronic packaging, emerging interconnection technology, and those working on Pb-free solder.

Download or read book Flip Chip Technologies written by John H. Lau and published by McGraw-Hill Professional Publishing. This book was released on 1996 with total page 600 pages. Available in PDF, EPUB and Kindle. Book excerpt: A guide to flip chip technologies, for professionals in flip chip and MCM research and development, and for engineers and technical managers choosing design and manufacturing processes for electronic packaging and interconnect systems. Discusses economic, design, material, quality, and reliability issues of flip chip technologies, and details aspects of classical solder-bumped flip chip interconnect technologies; the next generations of flip chip technologies; and known-good-die testing for multiple module applications. Annotation copyright by Book News, Inc., Portland, OR

Download or read book Benn s Media written by and published by . This book was released on 2002 with total page 776 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Electronic Materials and Packaging 2006 EMAP 2006 International Conference on written by and published by . This book was released on 2006 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Die Attach Materials for High Temperature Applications in Microelectronics Packaging written by Kim S. Siow and published by Springer. This book was released on 2019-01-29 with total page 292 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents the scientific principles, processing conditions, probable failure mechanisms, and a description of reliability performance and equipment required for implementing high-temperature and lead-free die attach materials. In particular, it addresses the use of solder alloys, silver and copper sintering, and transient liquid-phase sintering. While different solder alloys have been used widely in the microelectronics industry, the implementation of sintering silver and transient liquid-phase sintering remains limited to a handful of companies. Hence, the book devotes many chapters to sintering technologies, while simultaneously providing only a cursory coverage of the more widespread techniques employing solder alloys. Addresses the differences between sintering and soldering (the current die-attach technologies), thereby comprehensively addressing principles, methods, and performance of these high-temperature die-attach materials; Emphasizes the industrial perspective, with chapters written by engineers who have hands-on experience using these technologies; Baker Hughes, Bosch and ON Semiconductor, are represented as well as materials suppliers such as Indium; Simultaneously provides the detailed science underlying these technologies by leading academic researchers in the field.

Download or read book Electronic Materials and Packaging 2006 EMAP 2006 International Conference on written by and published by . This book was released on 2006 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Foldable Flex and Thinned Silicon Multichip Packaging Technology written by John W. Balde and published by Springer Science & Business Media. This book was released on 2003-01-31 with total page 382 pages. Available in PDF, EPUB and Kindle. Book excerpt: Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex). It is also being used in single chip packages where the thinness of the chips and the flex substrate made packages significantly thinner than through any other means. Much of the work in this field has not been widely disseminated other than by papers presented at conferences and workshops. This book is organized to report on the developments in this technology, but with special additional material and emphasis. The intent is to do more than report on present state of the art. It is intended as an advocacy book, pointing out the reasons for 3-D assemblies, the reasons for Silicon-in-a-Package multichip modules, and the commercial availability of the techniques. The contributing authors, all leaders in this technical field, explore the needs, reveal the state of development and production, and point to changes in technology that can bring this technology into wider use for more complex applications. It is an advocacy book in this respect - advocacy for the use of a technology that is already mature, and advocacy for exploring ways to make it even more capable for the future. It will also do more than discuss the present; it will point out the deficiencies of the constructions, the needed availability of good flex material, the use of newer flex materials, such as LCP, and the implications from the use of the Integrated Mesh Power Systems to enhance the capability for future designs. Lastly it will discuss the serious problem of heat removal if multiple microprocessors are included.

Download or read book Reflow Soldering Processes written by Ning-Cheng Lee and published by Newnes. This book was released on 2002-01-11 with total page 282 pages. Available in PDF, EPUB and Kindle. Book excerpt: Focused on technological innovations in the field of electronics packaging and production, this book elucidates the changes in reflow soldering processes, its impact on defect mechanisms, and, accordingly, the troubleshooting techniques during these processes in a variety of board types. Geared toward electronics manufacturing process engineers, design engineers, as well as students in process engineering classes, Reflow Soldering Processes and Troubleshooting will be a strong contender in the continuing skill development market for manufacturing personnel. Written using a very practical, hands-on approach, Reflow Soldering Processes and Troubleshooting provides the means for engineers to increase their understanding of the principles of soldering, flux, and solder paste technology. The author facilitates learning about other essential topics, such as area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and rework process,--and provides an increased understanding of the reliability failure modes of soldered SMT components. With cost effectiveness foremost in mind, this book is designed to troubleshoot errors or problems before boards go into the manufacturing process, saving time and money on the front end. The author's vast expertise and knowledge ensure that coverage of topics is expertly researched, written, and organized to best meet the needs of manufacturing process engineers, students, practitioners, and anyone with a desire to learn more about reflow soldering processes. Comprehensive and indispensable, this book will prove a perfect training and reference tool that readers will find invaluable. Provides engineers the cutting-edge technology in a rapidly changing field Offers in-depth coverage of the principles of soldering, flux, solder paste technology, area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and the rework process

Download or read book Techno Societal 2020 written by Prashant M. Pawar and published by Springer Nature. This book was released on 2021-06-19 with total page 1090 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book, divided in two volumes, originates from Techno-Societal 2020: the 3rd International Conference on Advanced Technologies for Societal Applications, Maharashtra, India, that brings together faculty members of various engineering colleges to solve Indian regional relevant problems under the guidance of eminent researchers from various reputed organizations. The focus of this volume is on technologies that help develop and improve society, in particular on issues such as advanced and sustainable technologies for manufacturing processes, environment, livelihood, rural employment, agriculture, energy, transport, sanitation, water, education. This conference aims to help innovators to share their best practices or products developed to solve specific local problems which in turn may help the other researchers to take inspiration to solve problems in their region. On the other hand, technologies proposed by expert researchers may find applications in different regions. This offers a multidisciplinary platform for researchers from a broad range of disciplines of Science, Engineering and Technology for reporting innovations at different levels.

Download or read book Radio Production written by Robert McLeish and published by CRC Press. This book was released on 2015-09-16 with total page 435 pages. Available in PDF, EPUB and Kindle. Book excerpt: Radio Production is for professionals and students interested in understanding the radio industry in today’s ever-changing world. This book features up-to-date coverage of the purpose and use of radio with detailed coverage of current production techniques in the studio and on location. In addition there is exploration of technological advances, including handheld digital recording devices, the use of digital, analogue and virtual mixing desks and current methods of music storage and playback. Within a global context, the sixth edition also explores American radio by providing an overview of the rules, regulations, and purpose of the Federal Communications Commission. The sixth edition includes: Updated material on new digital recording methods, and the development of outside broadcast techniques, including Smartphone use. The use of social media as news sources, and an expansion of the station’s presence. Global government regulation and journalistic codes of practice. Comprehensive advice on interviewing, phone-ins, news, radio drama, music, and scheduling. This edition is further enhanced by a companion website, featuring examples, exercises, and resources: www.focalpress.com/cw/mcleish.

Download or read book Multiword expressions written by Manfred Sailer and published by Language Science Press. This book was released on 2018 with total page 376 pages. Available in PDF, EPUB and Kindle. Book excerpt: Multiword expressions (MWEs) are a challenge for both the natural language applications and the linguistic theory because they often defy the application of the machinery developed for free combinations where the default is that the meaning of an utterance can be predicted from its structure. There is a rich body of primarily descriptive work on MWEs for many European languages but comparative work is little. The volume brings together MWE experts to explore the benefits of a multilingual perspective on MWEs. The ten contributions in this volume look at MWEs in Bulgarian, English, French, German, Maori, Modern Greek, Romanian, Serbian, and Spanish. They discuss prominent issues in MWE research such as classification of MWEs, their formal grammatical modeling, and the description of individual MWE types from the point of view of different theoretical frameworks, such as Dependency Grammar, Generative Grammar, Head-driven Phrase Structure Grammar, Lexical Functional Grammar, Lexicon Grammar.